ClassID:

208418

H01L29/66931 - CPC Classification

Classification description:

Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Types of semiconductor device ; Multistep manufacturing processes therefor; Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices BJT-like unipolar transistors, e.g. hot electron transistors [HET], metal base transistors [MBT], resonant tunneling transistor [RTT], bulk barrier transistor [BBT], planar doped barrier transistor [PDBT], charge injection transistor [CHINT]

Sub-classes:
Recent Application in this class:
#1
20240021712
2024-01-18

A NOVEL TRANSISTOR DEVICE

#2
20220271125
2022-08-25

TRANSISTOR DEVICES HAVING SOURCE/DRAIN STRUCTURE CONFIGURED WITH HIGH GERMANIUM CONTENT PORTION

#3
20210399198
2021-12-23

Digital circuits comprising quantum wire resonant tunneling transistors

#4
20210005712
2021-01-07

Column IV transistors for PMOS integration

#5
20200259008
2020-08-13

Amorphous metal hot electron transistor

#6
20200144362
2020-05-07

Transistors with high concentration of germanium

#7
20200127091
2020-04-23

Selective germanium P-contact metalization through trench

#8
20190318926
2019-10-17

Amorphous metal hot electron transistor

#9
20190259835
2019-08-22

Selective germanium P-contact metalization through trench

#10
20180342582
2018-11-29

Transistor devices having source/drain structure configured with high germanium content portion

#11
20170373147
2017-12-28

Selective germanium p-contact metalization through trench

#12
20170221724
2017-08-03

TRANSISTORS WITH HIGH CONCENTRATION OF BORON DOPED GERMANIUM

#13
20170125557
2017-05-04

Method of making a graphene base transistor with reduced collector area

#14
20160087087
2016-03-24

Method of making a graphene base transistor with reduced collector area

#15
20150303276
2015-10-22

Method of fabricating a lateral insulated gate bipolar transistor

#16
20150255588
2015-09-10

Hot-electron transistor having multiple MSM sequences

#17
20140284552
2014-09-25

Graphene base transistor with reduced collector area

#18
20140008723
2014-01-09

Lateral insulated gate bipolar transistor structure with low parasitic BJT gain and stable threshold voltage

#19
20120153387
2012-06-21

Transistors with high concentration of boron doped germanium

#20
20110127572
2011-06-02

Gated resonant tunneling diode

#21
20100207101
2010-08-19

Incorporating gate control over a resonant tunneling structure in CMOS to reduce off-state current leakage, supply voltage and power consumption

#22
20100065823
2010-03-18

Gated resonant tunneling diode

#23
20080239625
2008-10-02

Electronic component manufacturing method

#24
20070284640
2007-12-13

Semiconductor capacitors in hot (hybrid orientation technology) substrates