THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING METAL

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression bonding with passivated copper-based contacting metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression bonding with passivated nickel-based contacting metal

Thermocompression bonding using metastable gas atoms

Semiconductor device and a method of manufacturing the same

Method for stress reduction in semiconductor package via carrier

Wavelength converting member and method of producing the same

WAVELENGTH CONVERTING MEMBER AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Method for stress reduction in semiconductor package via carrier

ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING

Semiconductor device and a method of manufacturing the same

Thermocompression Bonding with Passivated Nickel-Based Contacting Metal

Thermocompression Bonding with Passivated Silver-Based Contacting Metal

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting Metal

Thermocompression Bonding with Passivated Indium-Based Contacting Metal

Thermocompression Bonding Using Metastable Gas Atoms

System for Low-Force Thermocompression Bonding

Quantum dot aggregate particles, production methods thereof, and compositions and electronic devices including the same

WAVELENGTH CONVERTING MEMBER AND METHOD OF PRODUCING THE SAME

Bonding structure between semiconductor device package

Semiconductor device and a method of manufacturing the same

Method of producing an interposer with microspring contacts

Pressure application apparatus and pressure application method

Method for fabricating electronic device package

Semiconductor device and a method of manufacturing the same

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Electronic component assembly apparatus

Chip package and fabrication method thereof

Chip package and fabrication method thereof

Bypass diode

Forming semiconductor chip connections

Pb-free solder bumps with improved mechanical properties

Chip package and method for forming the same

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Manufacturing method for semiconductor package, semiconductor package, and semiconductor device

Polymer matrices for polymer solder hybrid materials

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Methods and integrated circuit package for sensing fluid properties

Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure

Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support

CD control

Semiconductor structure and method of generating masks for making integrated circuit

Semiconductor device and a method of manufacturing the same

Method and apparatus to improve reliability of vias

Overlay-tolerant via mask and reactive ion etch (RIE) technique

Method for producing three-dimensional integrated circuit structure

Method of fabricating a package substrate

Warpage control in a package-on-package structure

Semiconductor structure and manufacturing method and operating method of the same

Hot bar soldering

Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures

Method of packaging a die

Fabrication of window cavity cap structures in wafer level packaging

Semiconductor device and method of manufacturing thereof

Cu pillar bump with electrolytic metal sidewall protection

Method for housing an electronic component in a device package and an electronic component housed in the device package

Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device

3D packaging with low-force thermocompression bonding of oxidizable materials

Connecting elements for producing hybrid electronic circuits

Power semiconductor device with reduced contact resistance

Integrated circuit packages having redistribution structures

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Through-silicon via with low-K dielectric liner

Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus

ARRANGEMENT OF THROUGH-SUBSTRATE VIAS FOR STRESS RELIEF AND IMPROVED DENSITY

Reduction of etch microloading for through silicon vias

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Integrated circuit packaging system with stiffener and method of manufacture thereof

Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device

Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Solder bump with inner core pillar in semiconductor package

Semiconductor package comprising an interposer and method of manufacturing the same

Ball-limiting-metallurgy layers in solder ball structures

Methods of forming a metal pattern

Semiconductor device

Multi-component integrated circuit contacts

Methods for controlling wafer curvature

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Electrical connection for multichip modules

Conductive pads defined by embedded traces

Power semiconductor device

Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance

Wafer level IC assembly method

Die stacking with an annular via having a recessed socket

INTEGRATED PASSIVE COMPONENT

Electronic component and electronic component assembly apparatus

Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Structure and design structure for high-Q value inductor and method of manufacturing the same

Method for fabricating multi-chip module with multi-level interposer

Semiconductor device

Semiconductor device

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Chip package and method for forming the same

Semiconductor device and method for manufacturing semiconductor device

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Ni plating of a BLM edge for Pb-free C4 undercut control

Routing method for flip chip package and apparatus using the same

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Chip package and fabrication method thereof

RFID integrated circuit with integrated antenna structure

Semiconductor module having deflecting conductive layer over a spacer structure

OHMIC CONNECTION USING WIDENED CONNECTION ZONES IN A PORTABLE ELECTRONIC OBJECT

Manufacturing method of semiconductor device and semiconductor device

Semiconductor package and method for fabricating the same

Forming semiconductor chip connections

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL

Semiconductor package with semiconductor core structure and method of forming same

Method of manufacturing semiconductor device

Light emitting semiconductor element bonded to a base by a silver coating

Elimination of RDL using tape base flip chip on flex for die stacking

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof

Semiconductor device and a method of manufacturing the same

Integrated circuit package system with stacked die

Semiconductor packages and methods of manufacturing the same

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

Pressure application apparatus and pressure application method

Semiconductor device

Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment

Wafer level chip package and a method of fabricating thereof

STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY

Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

Solder mold plates used in packaging process and method of manufacturing solder mold plates

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

Conductive pads defined by embedded traces

Adding cap to copper passivation flow for electroless plating

Grain refinement by precipitate formation in Pb-free alloys of tin

Ni plating of a BLM edge for Pb-free C4 undercut control

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Integrated circuit system with distributed power supply comprising interposer and voltage regulator module

Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device

Electronic device and electronic apparatus

Semiconductor module

Structure and design structure for high-Q value inductor and method of manufacturing the same

Power/ground layout for chips

Method of producing a chip package, and chip package

Multi-component electronic system having leadframe with support-free with cantilever leads

Semiconductor device packages stacked together having a redistribution layer

Method of Contacting a Semiconductor Substrate

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Semiconductor device and a method of manufacturing the same

SEMICONDUCTOR PACKAGE WITH THROUGH ELECTRODES AND METHOD FOR MANUFACTURING THE SAME

Microsprings partially embedded in a laminate structure and methods for producing same

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR

Interposer with microspring contacts

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Semiconductor package and method for manufacturing the same

SEMICONDUCTOR CHIP, STACKED CHIP SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND FABRICATING METHOD THEREOF

Semiconductor device having pad structure with stress buffer layer

Embedded package and method for manufacturing the same

Semiconductor package with thermal heat spreader

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method for manufacturing the same

Semiconductor die terminal

SEMICONDUCTOR DEVICE WITH LESS POWER SUPPLY NOISE

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device having a conductive layer reliably formed under an electrode pad

Manufacturing method of semiconductor apparatus and semiconductor apparatus

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Semiconductor device cover mark

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Method and apparatus for manufacturing three-dimensional integrated circuit

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip

Chip scale package and fabrication method thereof

Semiconductor device for driving electric motor

Semiconductor device having an interconnect structure with TSV using encapsulant for structural support

Solder bump with inner core pillar in semiconductor package

Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips

Multi-chip package including chip address circuit

Semiconductor device and package

Multi-chip package module and a doped polysilicon trench for isolation and connection

Reduction of etch microloading for through silicon vias

Structure and process for the formation of TSVs

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Testing die-to-die bonding and rework

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

Protection film having a plurality of openings above an electrode pad

Forming a semiconductor package including a thermal interface material

Semiconductor device

Semiconductor device having a multilayer structure

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate

Semiconductor device

Semiconductor integrated circuit device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE, AND ELECTRONIC APPARATUS

SEMICONDUCTOR SENSOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SENSOR DEVICE, PACKAGE, METHOD OF MANUFACTURING PACKAGE, MODULE, METHOD OF MANUFACTURING MODULE, AND ELECTRONIC DEVICE

POST-DISPENSE VACUUM OVEN FOR REDUCING UNDERFILL VOIDS DURING IC ASSEMBLY

Chip package including multiple sections for reducing chip package interaction

Chip package having a chip combined with a substrate via a copper pillar

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Chip structure

IC HAVING DIELECTRIC POLYMERIC COATED PROTRUDING FEATURES HAVING WET ETCHED EXPOSED TIPS

Semiconductor device including semiconductor elements mounted on base plate

Electrical connections for multichip modules

Semiconductor chip, and semiconductor package and system each including the semiconductor chip

Stacked-die package for battery power management

Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors

Hermetic wafer-to-wafer bonding with electrical interconnection

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

Electronic elements and devices with trench under bond pad feature

Carbon nanotube circuit component structure

Cu pillar bump with electrolytic metal sidewall protection

Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device

STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS

Package substrate and fabricating method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device

Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof

Method of making semiconductor package having redistribution layer

Chipstack package and manufacturing method thereof

Electronic device package and fabrication method thereof

Semiconductor chip with coil element over passivation layer

Manufacturing process and structure of through silicon via

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor chip having double bump structure and smart card including the same

Image sensor package and fabrication method thereof

Die stacking with an annular via having a recessed socket

Multi-chip module with multi-level interposer

Silicon nitride passivation layer for covering high aspect ratio features

Layered chip package with wiring on the side surfaces

Semiconductor device

Chip package and method for fabricating the same

Stacked semiconductor package having discrete components

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Methods of forming a metal pattern and semiconductor device structure

Semiconductor die having a redistribution layer

System and Method for Improving Reliability of Integrated Circuit Packages

Chip structure

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

Semiconductor apparatus and endoscope apparatus

RFID integrated circuit with integrated antenna structure

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Wafer level chip scale package without an encapsulated via

Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore

Polymer matrices for polymer solder hybrid materials

Semiconductor device and semiconductor assembly with lead-free solder

Systems and Methods Providing Arrangements of Vias

Cleaning system and a package carrier for a semiconductor package

Method and apparatus for interconnect layout in an integrated circuit

Integrated circuits having TSVs including metal gettering dielectric liners

Semiconductor device structures and electronic devices including same hybrid conductive vias

PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE

Microelectronic devices

PB-free solder bumps with improved mechanical properties

Method of manufacturing semiconductor device

Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same

Wafer-level stack package and method of fabricating the same

Semiconductor device having a microcomputer chip mounted over a memory chip

Semiconductor device and electronic device

Semiconductor devices including voltage switchable materials for over-voltage protection

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor device

Conductor bump method and apparatus

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Multi-chip stacked package and its mother chip to save interposer

Layer structure for electrical contacting of semiconductor components

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

Bonding material with exothermically reactive heterostructures

Electronic device and electronic apparatus

Semiconductor device

Structure for bumped wafer test

Die mounting substrate and method of fabricating the same

Flip-chip underfill

Semiconductor device having multi-layered wiring layer and fabrication process thereof

Bumping free flip chip process

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and method of manufacturing semiconductor device

Semiconductor chip, stack module, and memory card

Bumping Electronic Components Using Transfer Substrates

Terminal structure, electronic device, and manufacturing method thereof

Multi-chip module

MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE

Non-uniform alignment of wafer bumps with substrate solders

Semiconductor Device

Electrical connection for multichip modules

Semiconductor integrated circuit and multi-chip module

Integrated circuit with protective structure

SEMICONDUCTOR DEVICE

Method of manufacturing a semiconductor component and structure

Electronic device

Semiconductor device with interface peeling preventing rewiring layer

DEVICE MOUNTING BOARD, AND SEMICONDUCTOR MODULE

Semiconductor device with copper wire having different width portions

Semiconductor package with semiconductor core structure and method of forming the same

Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via