212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Bi-Layer Nanoparticle Adhesion Film
#2HYBRID BONDING WITH UNIFORM PATTERN DENSITY
#3OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES
#4SEMICONDUCTOR DEVICE HAVING STACKED CHIPS
#5SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
#6SEMICONDUCTOR DEVICE
#7ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
#8SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF
#9RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
#10DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
#11LIGHT EMITTING DIODES AND METHODS
#12METHODS OF PACKAGING SEMICONDUCTOR DEVICES AND PACKAGED SEMICONDUCTOR DEVICES
#13SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS
#14SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#15PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
#16SEMICONDUCTOR PACKAGE HAVING CHIP STACK
#172.5D/3D SYSTEM INTEGRATION
#18CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#19POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD
#20SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
#21WIRE BOND WIRES FOR INTERFERENCE SHIELDING
#22LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR
#23SWITCHING DEVICE AND ELECTRONIC CIRCUIT
#24Semiconductor Packages and Methods of Forming Same
#25ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
#26SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
#27Semiconductor Die Connection System and Method
#28INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#29PACKAGE STRUCTURE
#30Stacked Semiconductor Device Assembly in Computer System
#31INTEGRATED CIRCUIT STRUCTURE
#32COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHIN CARRIER
#33RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING CAPABILITY
#34Multi-Die Fine Grain Integrated Voltage Regulation
#35LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING
#36MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DATA INTERFACES
#37PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
#38INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTURING THE SAME
#39DAM LAMINATE ISOLATION SUBSTRATE
#40LOW COST PACKAGE WARPAGE SOLUTION
#41DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS
#42METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC CHIP AND A CARRIER SUBSTRATE AND ELECTRONIC DEVICE
#43SEMICONDUCTOR DEVICE
#44METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING CAPABILITY
#45Advanced Device Assembly Structures And Methods
#46Multi-Die Fine Grain Integrated Voltage Regulation
#47BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
#48MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME
#49SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
#50LOW PRESSURE SINTERING POWDER
#51SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD
#52MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND ASSOCIATED METHODS OF MANUFACTURING
#53MULTI-DIE MEMORY DEVICE
#54SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMICONDUCTOR DEVICES
#55SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF
#56SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#57PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#58APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
#59METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE
#60SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
#61SEMICONDUCTOR DEVICE
#62PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
#63PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME
#64SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
#65SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#66ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
#67Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#68Switching device and electronic circuit
#69STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
#70HYBRID BONDING WITH UNIFORM PATTERN DENSITY
#71SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFERENT SEMICONDUCTOR DIES
#72MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DATA INTERFACES
#73Radio-frequency switching devices having improved voltage handling capability
#74STACKED VIA STRUCTURE
#75OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES
#76SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME
#77METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VARIATION
#78ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
#79PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
#80STACKED SEMICONDUCTOR DEVICE
#81LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
#82SEMICONDUCTOR PACKAGE HAVING CHIP STACK
#83STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
#84Package structure
#85THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
#86DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
#87Integrated Fan-Out Packages with Embedded Heat Dissipation Structure
#88Semiconductor package having a high reliability
#89Semiconductor device package and a method of manufacturing the same
#90SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS
#91STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
#923D SYSTEM INTEGRATION
#93METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#94Stacked semiconductor device assembly in computer system
#95Memory device comprising programmable command-and-address and/or data interfaces
#96PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
#97SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#98Package structure and manufacturing method thereof
#99Package-on-package assembly with wire bond vias
#100SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP CHIP MANNER
#101Wire bond wires for interference shielding
#102Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#103Multi-chip package and method of providing die-to-die interconnects in same
#104Bridge interconnection with layered interconnect structures
#105Offset interposers for large-bottom packages and large-die package-on-package structures
#106POWER DEVICE INTEGRATION ON A COMMON SUBSTRATE
#107Semiconductor device packages, packaging methods, and packaged semiconductor devices
#108MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME
#109Display apparatus and manufacturing method thereof
#110Package structure and method of forming the same
#111Low cost package warpage solution
#112Low warpage high density trench capacitor
#113Multi-die memory device
#114Fault tolerant memory systems and components with interconnected and redundant data interfaces
#115MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
#116SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#117Detection unit, semiconductor film layer inspection apparatus including the same, and semiconductor film layer inspection method using the same
#118Semiconductor die connection system and method
#119INVERTED LEADS FOR PACKAGED ISOLATION DEVICES
#120Semiconductor device
#121ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
#122Sensor package and manufacturing method thereof
#123Method for interconnecting stacked semiconductor devices
#124Shielded electronic component package
#125Switching device and electronic circuit
#126Switching device and electronic circuit
#127Switching device and electronic circuit
#128Chip package and manufacturing method thereof
#129Packaged die and RDL with bonding structures therebetween
#130Bump structure having a side recess and semiconductor structure including the same
#131Packaging of a semiconductor device with a plurality of leads
#132Wafer level chip scale packaging intermediate structure apparatus and method
#133Semiconductor package having a high reliability
#134Pad Design For Reliability Enhancement in Packages
#135Semiconductor device including a bidirectional switch
#136OPTICAL MODULE HAVING MULTIPLE LASER DIODE DEVICES AND A SUPPORT MEMBER
#137Single-package wireless communication device
#138High voltage monolithic LED chip with improved reliability
#139Package-on-package (PoP) semiconductor package and electronic system including the same
#140Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#141Smart packaging for improved medication regimen compliance
#142Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#143Semiconductor device
#144Semiconductor package having routable encapsulated conductive substrate and method
#145Semiconductor device with transmissive layer and manufacturing method thereof
#146SEMICONDUCTOR DEVICE AND POWER CONVERTER
#147Wire bond wires for interference shielding
#148PACKAGE STRUCTURE
#1493D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
#150Semiconductor chip with redundant thru-silicon-vias
#151ENHANCED SEMICONDUCTOR STRUCTURES
#152Integrated circuit package having wirebonded multi-die stack
#153SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
#154Impedance controlled electrical interconnection employing meta-materials
#155Multi-chip package and method of providing die-to-die interconnects in same
#156Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
#157STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
#158Universal Surface-Mount Semiconductor Package
#159Display apparatus having a semiconductor light emitting source
#160Semiconductor package device and method of manufacturing the same
#161MANUFACTURING METHOD OF PACKAGE STRUCTURE
#162Semiconductor device assemblies including multiple stacks of different semiconductor dies
#163Package-on-package assembly with wire bonds to encapsulation surface
#164Semiconductor package with layer structures, antenna layer and electronic component
#165Pad structure design in fan-out package
#166Semiconductor device with sealed semiconductor chip
#167Offset interposers for large-bottom packages and large-die package-on-package structures
#168Ultra small molded module integrated with die by module-on-wafer assembly
#169Fine pitch probe card
#170Devices and methods related to metallization of ceramic substrates for shielding applications
#171MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND ASSOCIATED METHODS OF MANUFACTURING
#172EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#173Burn-in board and burn-in apparatus
#174Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure
#175Dummy structure of stacked and bonded semiconductor device
#176Stacked semiconductor device assembly in computer system
#177Semiconductor die connection system and method
#178SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
#179Secure semiconductor integration and method for making thereof
#180Package-on-package semiconductor assemblies and methods of manufacturing the same
#181Semiconductor packages and methods of forming same
#182Semiconductor device with a semiconductor chip connected in a flip chip manner
#183Integrated circuit package pad and methods of forming
#184Resonant-coupled transmission line
#185Optoelectronic device with electrodes forming an outer boundary beyond an outer boundary of an epitaxial stack
#186Semiconductor device
#187Semiconductor package system and related methods
#188Photonics fabrication process performance improvement
#189Switching device and electronic circuit
#190Semiconductor device
#191Low cost package warpage solution
#192Integrated circuit structure
#193Semiconductor package and manufacturing method of the same
#194Power device integration on a common substrate
#195SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
#196Semiconductor device package and a method of manufacturing the same
#197Semiconductor device packages, packaging methods, and packaged semiconductor devices
#1983D integrations and methods of making thereof
#199SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF
#200Method and device for controlling operation using temperature deviation in multi-chip
#201Light emitting apparatus
#202Hybrid bonding with uniform pattern density
#203EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#204Memory device comprising programmable command-and-address and/or data interfaces
#205Package-on-package assembly with wire bond vias
#206Offset interposers for large-bottom packages and large-die package-on-package structures
#207Display apparatus and manufacturing method thereof
#208Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
#209Integrated circuit packages with cavities and methods of manufacturing the same
#210Memories and memory components with interconnected and redundant data interfaces
#211Transistor devices and methods for producing transistor devices
#212ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
#213Multi-die memory device
#214Stacked semiconductor device
#215Semiconductor package and fabricating method thereof
#216Methods of embedding magnetic structures in substrates
#217Semiconductor image sensor module and method of manufacturing the same
#218Package structure and manufacturing method thereof
#219PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME
#220Devices and methods related to dual-sided radio-frequency package with overmold structure
#221Leadframe package with pre-applied filler material
#222Advanced device assembly structures and methods
#223Semiconductor device including a bidirectional switch
#224Manufacturable RGB laser diode source and system
#225Sensor package and manufacturing method thereof
#226Semiconductor device having a redistribution layer
#227Phosphor and light-emitting equipment using phosphor
#228Shielded electronic component package
#229SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#230Coaxial probe
#231Multichip package manufacturing process
#232Package-on-package semiconductor assemblies and methods of manufacturing the same
#233Semiconductor device
#234PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#235Radio-frequency switching devices having improved voltage handling capability
#236Methods related to radio-frequency switching devices having improved voltage handling capability
#237Packaging of a semiconductor device with a plurality of leads
#238Smart packaging for improved medication regimen compliance
#239Multi-die fine grain integrated voltage regulation
#240Circuit board structure and method for manufacturing a circuit board structure
#241Semiconductor device and method for manufacturing the same
#242Stacked semiconductor die assemblies with support members and associated systems and methods
#243Stacked semiconductor die assemblies with die support members and associated systems and methods
#244Bridge interconnection with layered interconnect structures
#245Transient liquid phase bonding compositions and power electronics assemblies incorporating the same
#246Methods of manufacturing an integrated circuit having stress tuning layer
#247Fault tolerant memory systems and components with interconnected and redundant data interfaces
#248Semiconductor package and method of forming the same
#249Redistribution layer structures for integrated circuit package
#250Semiconductor package and method of manufacturing the semiconductor package
#251Package structure and method of forming the same
#252Packages with metal line crack prevention design
#253Method for interconnecting stacked semiconductor devices
#254Radio frequency modules
#255Test apparatus and testing method using the same
#256Pressure sensor devices and methods for manufacturing pressure sensor devices
#257Wafer level chip scale packaging intermediate structure apparatus and method
#258Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#259PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
#260RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
#261Semiconductor package having a high reliability
#262PACKAGE STRUCTURE
#263System and process for implementing accelerated test conditions for high voltage lifetime evaluation of semiconductor power devices
#264Methods and apparatus for an improved integrated circuit package
#265Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#266Power module package and method of manufacturing the same
#267LED package with multiple element light source and encapsulant having curved and/or planar surfaces
#268Packaged die and RDL with bonding structures therebetween
#269Low pressure sintering powder
#270Package-on-package (PoP) semiconductor package and electronic system including the same
#271Semiconductor structure and method for making thereof
#272Land structure for semiconductor package and method therefor
#273Semiconductor device having a junction portion contacting a Schottky metal
#274Package with different types of semiconductor dies attached to a flange
#275Iintegrated fan-out packages with embedded heat dissipation structure
#276THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING METAL
#277Thermocompression Bonding with Passivated Gold Contacting Metal
#278Thermocompression bonding with passivated copper-based contacting metal
#279Thermocompression Bonding with Passivated Tin-Based Contacting Metal
#280Semiconductor device and method of manufacturing the same
#281Method of manufacturing package-on-package device and bonding apparatus used therein
#282Packages with Si-substrate-free interposer and method forming same
#283Thermocompression bonding with passivated nickel-based contacting metal
#284Thermocompression bonding using metastable gas atoms
#285Semiconductor device and manufacturing method of the same
#286Chip on Package Structure and Method
#287Package with metal-insulator-metal capacitor and method of manufacturing the same
#288Packaging mechanisms for dies with different sizes of connectors
#289SEMICONDUCTOR DEVICE HAVING STACKED CHIPS
#290Methods of manufacturing a semiconductor device including a joint adjacent to a post
#291SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
#292Semiconductor package
#293SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
#294Manufacturing method of package structure
#295Electronic device packaging with galvanic isolation
#296Multi-die memory device
#297Semiconductor package having chip stack
#298Package structures and method of forming the same
#299Semiconductor devices with package-level configurability
#300SECURE SEMICONDUCTOR INTEGRATION