Layered chip package and method of manufacturing same

Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same

SEMICONDUCTOR DEVICE HAVING SOLDER BUMPS PROTRUDING BEYOND INSULATING FILMS

Conductive bump, method for producing the same, and electronic component mounted structure

Semiconductor package with joint reliability, entangled wires including insulating material

Electrode structure and semiconductor device

Semiconductor chip assembly

Pin substrate and package

Semiconductor device

Stacked semiconductor devices and a method for fabricating the same

Integrated circuit package system with wire-in-film encapsulation

Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same

Die attach method and leadframe structure

Prefabricated lead frame and bonding method using the same

PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME

Solid-state imaging apparatus and method for manufacturing the same

INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANES AND ITS METHOD OF PRODUCTION

THIN GALLIUM NITRIDE LIGHT EMITTING DIODE DEVICE

LIGHT EMITTING DEVICE

Light emitting diode submount with high thermal conductivity for high power operation

Light emitting diode package including metal lines having gap therebetween

Light emitting diode

Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus

Semiconductor device package including a paste member

Light emitting elements, light emitting devices including light emitting elements and methods of manufacturing such light emitting elements and/or devices

Optical semiconductor element mounting package, and optical semiconductor device using the same

Optical module and optical pickup apparatus

COMPOUND SEMICONDUCTOR ELEMENT RESISTIBLE TO HIGH VOLTAGE

Semiconductor integrated circuit having terminal for measuring bump connection resistance and semiconductor device provided with the same

Light emitting device and display

Light emitting device and display

Method of controlling the trajectory of a bonding tool during the formation of a wire loop

Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same

ELECTRONIC COMPONENT

Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof

Printed Circuit Board With Additional Functional Elements, Method of Production and Use

Processes of making pad-less interconnect for electrical coreless substrate

Heat sink for power module

Compression bonding device

Pressure sensor device

Pressure sensing device package and manufacturing method thereof

Sensor module

Method for producing a semiconductor component

Manufacturing method of semiconductor device

Flex chip connector for semiconductor device

Semiconductor package and manufacturing method thereof

Performing die-to-wafer stacking by filling gaps between dies

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device

Method for making micro-electromechanical system devices

High power light emitting diode package and method of producing the same

INSULATING PASTE FOR LOW TEMPERATURE CURING APPLICATION

MULTI-LAYER ADHESIVE FILM FOR DIE STACKING

Electronic device and method of manufacturing the electronic device

Illuminative light communication system

MEMS microphone package with RF insensitive MEMS microphone chip

Semiconductor laser device

Light source device and display device having the same

Semiconductor Package

Low profile solder grid array technology for printed circuit board surface mount components

Heat sink, electronic device, and method of manufacturing electronic device

Circuit apparatus and method of manufacturing the same

CONNECTION METHOD AND SUBSTRATE

Systems and methods for power amplifier with integrated passive device

Light emitting elements, light emitting devices including light emitting elements and methods for manufacturing such light emitting elements and/or devices

Light emitting diode replacement lamp

Nitride phosphor and production process thereof, and light emitting device

Return loss techniques in wirebond packages for high-speed data communications

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

Semiconductor package system with substrate having different bondable heights at lead finger tips

Package on Package Structure with thin film Interposing Layer

Method and apparatus for wafer level integration using tapered vias

Semiconductor device and method of manufacturing the same

Circuitry component and method for forming the same

Semiconductor device having copper interconnect for bonding

Injection molded solder ball method

Semiconductor device and method of manufacturing the same

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

Wafer level package and manufacturing method thereof

Semiconductor module and method for fabricating semiconductor module

Semiconductor device mounted on heat sink having protruded periphery

Method of forming stress relief layer between die and interconnect structure

Compliant wirebond pedestal

Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposed

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit package system with die and package combination

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Semiconductor chip package and multichip package

Ball grid array package stacking system

Package substrate having embedded semiconductor chip and fabrication method thereof

LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device

CHIP PACKAGE FOR SEMICONDUCTOR DEVICES

Integrated circuit package system with internal stacking module

Surface-hydrophobicized film, material for formation of surface-hydrophobicized film, wiring layer, semiconductor device and process for producing semiconductor device

Inductor module, silicon tuner module and semiconductor device

Package substrate having embedded photosensitive semiconductor chip and fabrication method thereof

Sensor module and semiconductor chip

VERTICAL TRANSISTOR WITH INTEGRATED ISOLATION

Light emitting apparatus

Gallium nitride based compound semiconductor light-emitting device and method for manufacturing same

Semiconductor device member, production method of semiconductor-device-member formation liquid and semiconductor device member, and semiconductor-device-member formation liquid, phosphor composition, semiconductor light-emitting device, lighting system and image display system using the same

SEMICONDUCTOR LIGHT EMITTING DEVICE

LIGHT-EMITTING DEVICE MODULE WITH A SUBSTRATE AND METHODS OF FORMING IT

Wire bonding method

WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS

WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME

Illumination device for use in endoscope

White heat-curable silicone resin composition and optoelectronic part case

Bump structure for a semiconductor device and method of manufacture

Method of manufacturing semiconductor package with etch removal of carrier frame and base plating layer

Array-processed stacked semiconductor packages

Manufacturing method of wafer level chip scale package of image-sensing module

Method of making light emitting diodes

Method of making foil based semiconductor package

White heat-curable silicone resin composition and optoelectronic part case

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

Memory chip and semiconductor device

Memory module, method for using same and memory system

Light emitting device

LED lighting device with thermally conductive resin lampstand

Light source device

Integrated circuit package system for stackable devices

Batch-test method using a chip tray

Substrate including alignment columnar member and plural protection columnar members, and method of making the same

Laminate substrate and semiconductor package utilizing the substrate

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

STACKED DIE PACKAGE

Through substrate via semiconductor components

Semiconductor device and method of forming recessed conductive vias in saw streets

Semiconductor device and manufacturing method therefor

Semiconductor device and method for manufacturing thereof

Printed circuit board comprising semiconductor chip and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Semiconductor device having substrate with differentially plated copper and selective solder

Contact pads for silicon chip packages

Mountable integrated circuit package-in-package system

Semiconductor device having function circuits selectively connected to bonding wire

Semiconductor device and method of manufacturing semiconductor device

Packaged products, including stacked package modules, and methods of forming same

Semiconductor arrangement having specially fashioned bond wires

Semiconductor package fabricated by cutting and molding in small windows

Method and apparatus for thermally enhanced semiconductor package

Resin sealed semiconductor device and manufacturing method therefor

Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package

Integrated circuit packaging system with isolated pads and method of manufacture thereof

COL (Chip-On-Lead) multi-chip package

Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference

IC having voltage regulated integrated Faraday shield

Semiconductor device and method of connecting a shielding layer to ground through conductive vias

Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

Semiconductor device and method of shielding semiconductor die from inter-device interference

Semiconductor device and method of manufacturing the same

Electrically conducting connection with insulating connection medium

TRENCH ISOLATION FOR REDUCED CROSS TALK

Low resistance integrated MOS structure

LED lamp module and fabrication method thereof

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Semiconductor Light-Emitting Device and Manufacturing Method

Light emitting device

Light-emitting device

LIGHT EMITTING DIODE SYSTEM

Semiconductor device and method of manufacturing the same

LENS FRAME AND OPTICAL FOCUS ASSEMBLY FOR IMAGER MODULE

Techniques for arranging solder balls and forming bumps

Techniques for arranging solder balls and forming bumps

CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME

Method and system for composite bond wires

PLATING APPARATUS AND PLATING METHOD

Methods of forming interlayer dielectrics having air gaps

Maskless Process for Solder Bumps Production

Integrated module for data processing system

METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER, AND METHOD OF SAWING THE SEMICONDUCTOR WAFER

Method of forming a leaded molded array package

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Method for manufacturing a semiconductor device

Method for Manufacturing Solid-State Image Pickup Device Module

Structure and Method for Reliable Solder Joints

Ribbon bonding tool and process

MANUFACTURING METHOD FOR A SILVER ALLOY BONDING WIRE AND PRODUCTS THEREOF

Illuminative light communication device and lighting device

Illuminative light communication device

Emergency lamp and wireless emergency lamp data transmission system

Illuminative light communication system, lighting device and illuminative light source

Bent optical fiber couplers and opto-electrical assemblies formed therefrom

Illumination unit comprising luminescence diode chip and optical waveguide, method for producing an illumination unit and LCD display

Light emitting apparatus, optical scanning apparatus, and image forming apparatus

Lamp and method of making the same

LIGHT SOURCE MODULE, RELATED LIGHT BAR AND RELATED LIQUID CRYSTAL DISPLAY

High efficiency lighting device including one or more solid state light emitters, and method of lighting

Method and apparatus for generating white light from solid state light emitting devices

CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS

Line light source device, plane light emission device, plane light source device, and liquid crystal display

Phosphor composition and method for producing the same, and light-emitting device using the same

Ultra high-temperature plastic package and method of manufacture

Bond pad structure located over active circuit structure

Embedding device in substrate cavity

FLIP-CHIP INTERCONNECTION WITH FORMED COUPLINGS

Semiconductor memory device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

THIN CHIP SCALE SEMICONDUCTOR PACKAGE

Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends

Semiconductor device, and manufacturing method therefor

SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF

Package for a Die

Substrate for semiconductor package

High frequency interconnect pad structure

Method of manufacturing a semiconductor device

Method for fabricating a module including a sintered joint

Packaging substrate and method for fabricating the same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof

3-D ICs with microfluidic interconnects and methods of constructing same

Integrated circuit package module and method of the same

CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF

Semiconductor device including an LSI chip and a method for manufacturing the same

Semiconductor device

MOLDED SEMICONDUCTOR DEVICE

Chip package structure and manufacturing method thereof

Semiconductor device and manufacturing method therefor

Semiconductor device assembly and method thereof

Stacked structure of integrated circuits having space elements

Package-on-package system with heat spreader

LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

Four mosfet full bridge module

Semiconductor package system with cut multiple lead pads

Conductive clip for semiconductor device package

Lead Frame and Chip Package Structure and Method for Fabricating the Same

Leadframe having delamination resistant die pad

Methods of making an electronic component package and semiconductor chip packages

Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and method of forming double-sided through vias in saw streets

Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

Semiconductor device

Semiconductor memory device and method of fabricating the same

Methods and devices for fabricating and assembling printable semiconductor elements

Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device

LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

CARD TYPE MEMORY PACKAGE

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE

Light emitting diode lamp package structure and assembly thereof

Light emitting device

Transponder and method of producing a transponder

Structure including an electronic device for making a security document

ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME

Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board

Circuit board process

Sensor chip, detection device and method of manufacturing detection device

Method of manufacturing a printed wiring board with built-in electronic component

Method for selectively processing surface tension of solder mask layer in circuit board

Semiconductor chip and method for fabricating the same

Method of manufacturing a semiconductor device and molding die

Method of manufacturing semiconductor element

Method of manufacturing a semiconductor device

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WITH FIRST RESIN LAYER AND SECOND SUBSTRATE WITH SECOND RESIN LAYER ADHERED TO THE FIRST RESIN LAYER

Combined metallic bonding and molding for electronic assemblies including void-reduced underfill

LIGHT EMITTING ELEMENT, A LIGHT EMITTING DEVICE, A METHOD OF MANUFACTURING A LIGHT EMITTING ELEMENT AND A METHOD OF MANUFACTURING A LIGHT EMITTING DEVICE

Semiconductor device and a semiconductor device manufacturing method

Electronic components mounting adhesive and electronic components mounting structure

Method and apparatus providing fine alignment of a structure relative to a support

Methods of making an environment protection coating system

Low loading pad design for STT MRAM or other short pulse signal transmission

Power converter

LIGHT EMITTING DIODE DEVICE

Light source unit and lighting system

Printed wiring board having a substrate with higher conductor density inserted into a recess of another substrate with lower conductor density

Printed circuit board, method of fabricating printed circuit board, and semiconductor device

Printed wiring board

Environmental protection coating system and method

Light-emitting diode package having electrostatic discharge protection function and method of fabricating the same

Optical device and production method thereof

Solid-state imaging device

On-chip highly-efficient antennas using strong resonant coupling

Phosphor and method for manufacturing the same, and light-emitting device and display device using phosphor

Warm-white light-emitting diode and its phosphor powder

Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module

Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias

Semiconductor device and method of manufacturing a semiconductor device

WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTAL MOVEMENT OF TERMINALS OF IC DURING PRESSING

Semiconductor package and methods of manufacturing the semiconductor package

Peel-resistant semiconductor device with improved connector density, and method of manufacturing the same

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Wirebondless wafer level package with plated bumps and interconnects

Electronic module

Semiconductor apparatus having a two-side heat radiation structure

HERMETIC SEALING OF MICRO DEVICES

Circuit board, lead frame, semiconductor device, and method for fabricating the same

Structure and manufacturing method of chip scale package

Electronic device package and fabrication method thereof

Semiconductor device

Semiconductor package having an antenna on the molding compound thereof