Semiconductor device and method for manufacturing the same

DFN semiconductor package having reduced electrical resistance

Fabricating method of light emitting diode package

Package for micro-electro-mechanical acoustic transducer with improved double side mountable electrodes

Semiconductor device

Power converter apparatus

COMPACT PACKAGING FOR POWER AMPLIFIER MODULE

Protection device, protection method using the same, method for processing signal using the same, and method for detecting quantity of electricity using the same

Camera module, method of manufacturing the same, and electronic system having the same

Partially underfilled solder grid arrays

Integrated circuit package-on-package system with central bond wires

Apparatus and method for a chip assembly including a frequency extending device

Continuously referencing signals over multiple layers in laminate packages

Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same

Semiconductor device and programming method

Stacked, interconnected semiconductor package

Method of making semiconductor devices employing first and second carriers

Stacked Micro-Module Packages, Systems Using the Same, and Methods of Making the Same

Semiconductor device packages with electromagnetic interference shielding

Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device

Method of fabricating back-illuminated imaging sensors using a bump bonding technique

Three-dimensional semiconductor device structures and methods

Resin composition for sealing light-emitting device and lamp

Semiconductor light-emitting device

Power conversion apparatus

Electronic component, illuminating device, contact-type image sensor, and image reading device having no short circuit condition achieved by allowing only one electrode of an LED chip in direct contact with a metallic substrate

Optical communication device and electronic equipment having an array of light receiving sections

Ultrasonic mounting apparatus

METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MATERIALS USING RF AND MICROWAVES

Wiring board and ceramic chip to be embedded

Heat resistant substrate incorporated circuit wiring board

Fluid ejection device utilizing a one-part epoxy adhesive

Pressure sensor module and method for manufacturing the same

Semiconductor acceleration sensor device and method for manufacturing the same

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape

Method of fabricating bonding structure

Microwave Cure of Semiconductor Devices

METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE

Reinforced assembly carrier

Semiconductor laser apparatus and optical apparatus

Light emitting diode

Lighting fixture using semiconductor coupled with a reflector having reflective surface with a phosphor material

Light-emitting device as well as lighting apparatus and display apparatus using the same

Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate

Method and system for collecting alignment data from coated chips or wafers

Three dimensional integrated automotive radars and methods of manufacturing the same

Dual-band antenna array and RF front-end for mm-wave imager and radar

Dual-band antenna array and RF front-end for automotive radars

Three chip package

Multi-chip stack package

Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof

Integrated circuit system having different-size solder bumps and different-size bonding pads

Flip-chip mounting substrate and flip-chip mounting method

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Electronic component and method for its production

Semiconductor package using an active type heat-spreading element

LEADFRAME-BASED IC-PACKAGE WITH SUPPLY-REFERENCE COMB

Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package

Semiconductor device

Semiconductor device and manufacturing method therefor

Semiconductor device package having features formed by stamping

Leadframe for packaged electronic device with enhanced mold locking capability

Method of forming a semiconductor package and structure therefor

Light emitting device

LED package and light source device using same

Multi-chip assembly with optically coupled die

Phosphor composition and method for producing the same, and light-emitting device using the same

Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE

Support substrate structure for supporting electronic component thereon and method for fabricating the same

Method for bonding metallic terminals by using elastic contact

METHOD FOR JOINTING A SEMICONDUCTOR ELEMENT AND A HEAT PIPE

Contact structure and forming method thereof and connecting structure thereof

Chip Package with Pin Stabilization Layer

Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device

Adhesive composition, adhesive sheet and production method of semiconductor device

METHOD OF PRODUCING SEMICONDUCTOR PACKAGES

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND ITS METHOD OF MANUFACTURE

Electro-optic integrated circuits and methods for the production thereof

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

OPTICAL COMMUNICATION DEVICE

Semiconductor device including multi-chip

Light source and vehicle lamp

Illumination assembly with diffusive reflector cup

Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same

Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring

Semiconductor device and bonding material

Circuit device

Method for manufacturing multilayer printed wiring board

Mounting structure of semiconductor device and electronic apparatus using thereof

Integrated-inverter electric compressor and inverter device

Thermal interface material for combined reflow

Power Device Substrates and Power Device Packages Including the Same

COMMUNICATION MODULE AND ELECTRONIC APPARATUS

Methods of making coil transducers

Flat magnetic element and power IC package using the same

Sensor module with mold encapsulation for applying a bias magnetic field

Drive circuit, light emitting diode head, and image forming apparatus

Phosphor and production method thereof, and phosphor-containing composition, light emitting device, image display and lighting system

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Semiconductor device and manufacturing method of the same

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

Window type BGA semiconductor package and its substrate

Underbump metallurgy for enhanced electromigration resistance

Semiconductor device and fabrication method thereof

Substrate, manufacturing method thereof, method for manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Mock bump system for flip chip integrated circuits

Mock bump system for flip chip integrated circuits

Module including a rough solder joint

Enhanced thermal dissipation ball grid array package

Wafer integrated with permanent carrier and method therefor

System and method of forming a wafer scale package

Semiconductor device package

Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same

Integrated circuit package system with rigid locking lead

Electronic system modules and method of fabrication

Mounting structure of semiconductor device and electronic apparatus using same

Stacked integrated circuit package system

Integrated circuit package system with stacking module

Integrated circuit package system with support structure under wire-in-film adhesive

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURES

Mountable integrated circuit package system with substrate

Mountable integrated circuit package system with exposed external interconnects

Semiconductor device and method for manufacturing semiconductor device

Method and apparatus for a package having multiple stacked die

Complex semiconductor packages and methods of fabricating the same

Lead frame and package of semiconductor device

Semiconductor package structure

Lead frame and package of semiconductor device

Semiconductor chip package assembly method and apparatus for countering leadfinger deformation

Chip package having asymmetric molding

Leadframe, semiconductor packaging structure and manufacturing method thereof

I/O connection scheme for QFN leadframe and package structures

Structure for reduction of soft error rates in integrated circuits

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

Through hole vias at saw streets including protrusions or recesses for interconnection

Method of manufacturing semiconductor device and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE

Capacitive isolation circuitry with improved common mode detector

WIRING BOARD AND SOLID-STATE IMAGING DEVICE

Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture and method for manufacturing same

Resin sheet for encapsulating optical semiconductor element and optical semiconductor device

Semiconductor light emitting module and method for manufacturing the same

Light emitting diodes with smooth surface for reflective electrode

Hermetically Sealed Device with Transparent Window and Method of Manufacturing Same

Light emitting device

Light-emitting device including light-emitting diode and stacked light-emitting phosphor layers

Method for packaging a light emitting device including a metal reflection layer and a metal heat dissipation layer

Semiconductor light-emitting device

LED assembly with high heat dissipating capability

Planar light source device

Semiconductor light emitting device and semiconductor light emitting unit

Luminous body with LED dies and production thereof

Three-dimensional microstructures and methods for making same

GaN based semiconductor light-emitting device and method for producing same

PROCESSOR FOR A PRINT ENGINE ASSEMBLY HAVING POWER MANAGEMENT CIRCUITRY

Semiconductor device capable of switching operation modes

Multi-layer wiring board and method of manufacturing the same

Multi-layer wiring board and method of manufacturing the same

Method for mounting semiconductor device

Acceleration sensor package

Bump bonding method

White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case

IC PACKAGING PROCESS

Methods for a multiple die integrated circuit package

METHOD OF STACKING DIES FOR DIE STACK PACKAGE

Method for manufacturing microelectronic devices

Method for manufacturing package structure of optical device

Package for a light emitting diode and a process for fabricating the same

Method and jig structure for positioning bare dice

Optical module and data communication system including the optical module

SEMICONDUCTOR LASER APPARATUS

Process variation compensated multi-chip memory package

Light source module and vehicular lamp

LED unit with interlocking legs

Illuminating device

Component built-in wiring board

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Devices and system for electrostatic discharge suppression

Lens array, light emitting diode head, exposure device, image forming apparatus, and image reading apparatus

High frequency power amplifier

Semiconductor device and data processor

Fluorescent substance, process for producing the same, and luminescent device

LED light source and method for adjusting chromaticity of LED light source

Phosphor and manufacturing method therefore, and light emission device using the phosphor

CURABLE SILICONE RUBBER COMPOSITION AND SEMICONDUCTOR DEVICE

Flip chip interconnection system having solder position control mechanism

Chip package structure

Integrated circuit package system with stacking module

Integrated circuit package system for stackable devices

Package-on-package system with via Z-interconnections

Integrated circuit package system with support structure for die overhang

Wire bonding over active circuits

CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME

Window ball grid array package

Semiconductor package having substrate ID code and its fabricating method

RF transistor output impedance technique for improved efficiency, output power, and bandwidth

Semiconductor device packages and assemblies

Ball grid array package system

THERMALLY-ENHANCED MULTI-HOLE SEMICONDUCTOR PACKAGE

Die substrate with reinforcement structure

Semiconductor device

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE

Solder preform and electronic component

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Integrated circuit packaging system with package-in-package and method of manufacture thereof

Semiconductor memory card and semiconductor memory device

Semiconductor device including a pressure-contact section

Integrated circuit package system with step mold recess

Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit

IC PACKAGE HAVING REDUCED THICKNESS

COL SEMICONDUCTOR PACKAGE

Semiconductor chip package

Semiconductor package having a bridged plate interconnection

Semiconductor chip package

Apparatus and method for series connection of two die or chips in single electronics package

Integrated circuit package system with isloated leads

Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement

Semiconductor device and manufacturing method of the same

Wire bond and redistribution layer process

Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die

LED device with conductive wings and tabs

White Semiconductor Light Emitting Device and Method for Manufacturing the Same

Light emitting apparatus and display apparatus having the same

Light-emitting diode package and lead group structure for light-emitting diode package

LED assembly incorporating a structure for preventing solder contamination when soldering electrode leads thereof together

LED assembly with separated thermal and electrical structures thereof

Semiconductor device and method of manufacturing the same

Electronic circuit

ELECTRONIC DEVICE

Transmission method, interface circuit, semiconductor device, semiconductor package, semiconductor module and memory module

Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating

Dual flat non-leaded semiconductor package

Wafer level IC assembly method

Thin quad flat package with no leads (QFN) fabrication methods

Rigid-flexible printed circuit board manufacturing method for package on package

LED with substrate modifications for enhanced light extraction and method of making same

Substrate having a functionally gradient coefficient of thermal expansion

Light transmitting/receiving device

Illuminator module

Light emitting device provided with lens for controlling light distribution characteristic

Electric power conversion apparatus

Direct dipping cooled power module and packaging

Broadband Power Amplifier with A High Power Feedback Structure

Electric Power Conversion Apparatus

Nitride phosphor and production process thereof, and light emitting device

Semiconductor package and method for manufacturing the same

Chip structure and stacked chip package as well as method for manufacturing chip structures

Semiconductor device and manufacturing method thereof

Semiconductor device including adhesive covered element

Bump-on-lead flip chip interconnection

Semiconductor device

Flip chip package

Semiconductor package and multi-chip package using the same

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Mounted body and method for manufacturing the same

Electronic device contact structures

Semiconductor package structure with heat sink

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Semiconductor die package including embedded flip chip

Semiconductor die package including multiple semiconductor dice

System for solder ball inner stacking module connection

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof

Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof

Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof

SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANUFACTURING METHODS THEREOF

Semiconductor package having a cavity structure

Method for producing a semiconductor device and the semiconductor device

Stress Mitigation in Packaged Microchips

Leadframe package with dual lead configurations

Semiconductor Device

Semiconductor die package including IC driver and bridge

Integrated circuit package system with integration port

Solid-state imaging device and method of fabricating solid-state imaging device

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LID FRAME

Piezoelectric device and electronic apparatus

Semiconductor device and bypass capacitor module

Semiconductor light emitting device and method for manufacturing the same

Reinforced chip package structure

Semiconductor light-emitting element

Semiconductor package structure, lead frame and conductive assembly for the same

Housing body and method for production thereof

Light emitting device

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Light emitting diode package structure and method for fabricating the same

Semiconductor light emitting device and method for manufacturing the same

LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

A1InGaP LED having reduced temperature dependence

Method of bonding

Device for mounting electric component

Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers