Lighting system and liquid crystal display using the same

Power amplifier circuitry and method

SEMICONDUCTOR CIRCUIT

LIGHT EMITTING DIODE LAMP, LIGHT EMITTING DIODE ASSEMBLY, AND LIGHT EMITTING DIODE STRING

Light emitting device and light emitter

Light emitting device, light source and method of making the device

Low profile and high efficiency lighting device for backlighting applications

Integrated circuit package system employing resilient member mold system technology

Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same

Chip Package with Stiffener Ring

Flip chip mounting method and bump forming method

Method for Fabricating Array-Molded Package-On-Package

Base semiconductor component for a semiconductor component stack and method for the production thereof

Semiconductor device and method of manufacturing same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE

Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Semiconductor device with multilayered metal pattern

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA

Integrated chip carrier with compliant interconnects

METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS

Reliable metal bumps on top of I/O pads after removal of test probe marks

Semiconductor package with under bump metallization aligned with open vias

Chip assembly with interconnection by metal bump

Method for manufacturing semiconductor device, and semiconductor device

Semiconductor module manufacturing method, semiconductor module, and mobile device

BUMP STRUCTURE

Apparatus for connecting integrated circuit chip to power and ground circuits

Dimple free gold bump for drive IC

Semiconductor device

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor package having die with recess and discrete component embedded within the recess

Integrated circuit package system with thin profile

Semiconductor device and fabrication method

Methods of assembling integrated circuit packages

Chip Package with Pin Stabilization Layer

Semiconductor package using chip-embedded interposer substrate

Stacked package structure and fabrication method thereof

Die stacking system and method

Multi layer low cost cavity substrate fabrication for pop packages

Housed active microstructures with direct contacting to a substrate

Package and packaging assembly of microelectromechanical system microphone

System-in-package type semiconductor device

Circuit substrate, molding semiconductor device, tray and inspection socket

Package structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Multi-chip semiconductor device having leads and method for fabricating the same

Chip-On-Lead and Lead-On-Chip Stacked Structure

LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Semiconductor Package Having Reduced Thickness

Leadframe for a semiconductor device

Methods of forming stacked semiconductor devices with a leadframe and associated assemblies

Semiconductor Device and Its Fabrication Method

Semiconductor Package, Method of Fabricating the Same and Semiconductor Package Module For Image Sensor

Semiconductor device and method for manufacturing the same

Single Crystal Phosphor Light Conversion Structures for Light Emitting Devices

Side-emission type semiconductor light-emitting device and manufacturing method thereof

Power light emitting die package with reflecting lens and the method of making the same

Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities

Fluorescent substance and light-emitting device using the same

IC CARD

Dual interface inlays

Method for manufacturing a printed wiring board

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Method for manufacturing light reflecting metal wall

Method for producing a ceramic printed-circuit board

METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEMICONDUCTOR DEVICE FABRICATION

Wiring board connection method

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Multilayer ceramic substrate

Composite ceramic substrate

Ultra thin bumped wafer with under-film

Manufacturing method of semiconductor device and electronic device

Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same

Stacked die package for peripheral and center device pad layout device

Method of manufacturing semiconducting device with stacked dice

Systems and methods for post-circuitization assembly

METHODS FOR FORMING PACKAGE STRUCTURES

CONVEX DIE ATTACHMENT METHOD

CAMERA MODULE AND METHOD FOR ASSEMBLING SAME

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Light emitting diode device using nanocrystal-metal oxide composite and method for fabricating the same

Etch method

MEMS microphone, production method and method for installing

Digital Isolator Interface with Process Tracking

Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit

Method and apparatus for driving semiconductor lasers, and method and apparatus for deriving drive current patterns for semiconductor lasers

Light emitting diode with light emitting chips at inner side surfaces thereof and backlight module using same

Mounting Assembly for Optoelectronic Devices

Luminous element for backlight unit

Lighting device and lighting method

Lighting device and lighting method

Multi chip electronic system

Semiconductor package and method of forming the same, and printed circuit board

HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME

In package ESD protections of IC using a thin film polymer

Light emitting diode package having dual lens structure and backlight for liquid crystal display device implementing the same

Camera module

Image capturing device module, manufacturing method of the image capturing device module, and electronic information device

Packaged antenna and method for producing same

RF-FRONTEND FOR A RADAR SYSTEM

RF-coupled digital isolator

RF-coupled digital isolator

Device comprising an element with electrodes coupled to connections

Protection for circuit boards

ELECTRICAL CONTACT DEVICE AND ITS MANUFACTURING PROCESS

Light Emitting Diode Module

Semiconductor device

Semiconductor device with improved resin configuration

Flip-chip semiconductor package and package substrate applicable thereto

Semiconductor device including an interconnect

Semiconductor package and method of forming the same

Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects

Semiconductor device and a method of manufacturing the same

Semiconductor package substrate

Package structure for integrated circuit device

Semiconductor chip and manufacturing method thereof

Printed circuit board and flip chip package using the same with improved bump joint reliability

Flash memory card

Microelectronic package and method of manufacturing same

Heat dissipation semiconductor package

POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE

Methods of packaging a semiconductor die and package formed by the methods

Semiconductor device

Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication

Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure

Light emitting diode package

Soldering method for semiconductor optical device, and semiconductor optical device

LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER

Electronic Assemblies without Solder and Methods for their Manufacture

Wiring board with built-in component and method for manufacturing the same

Electronic device manufacturing method and supporter

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

Circuit board and method of fabricating the same

Al-AlN composite material, related manufacturing method and heat exchanger using such composite material

Pressure sensor package and electronic part

Thermoelectric module and optical transmission apparatus

Methods of forming a semiconductor device including a diffusion barrier film

Structure and method for enhancing resistance to fracture of bonding pads

Semiconductor package having through-hole via on saw streets formed with partial saw

Semiconductor device package with multi-chips and method of the same

Process and apparatus for wafer-level flip-chip assembly

Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices

Manufacturing method of semiconductor device

Wafer-level flip-chip assembly methods

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Method of assembling electronic components of an electronic system, and system thus obtained

Multipath Soldered Thermal Interface Between a Chip and its Heat Sink

Multi-layer thermal insulation for a bonding system

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING ELECTROLESS THICK COPPER BOND PADS

Solid state light source having a variable number of dies

High power LED electro-optic assembly

Integrated circuit package system with interference-fit feature

Electronic circuit modules cooling

Memory card and method for fabricating the same

Miniature camera module

Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

Surface acoustic wave device

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT

Phosphor and Method of preparing the same as well as semiconductor light-emitting device and image display

White light LED

Package-in-package using through-hole via die on saw streets

Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor

Semiconductor package substrate structure and manufacturing method thereof

Semiconductor device and method for manufacturing semiconductor device

Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom

Package substrate and its solder pad

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

CHIP PACKAGE STRUCTURE

Integrated circuit package with top-side conduction cooling

Pin grid array package substrate including slotted pins

Land grid array semiconductor package

Integrated circuit package system with device cavity

Package-on-package using through-hole via die on saw streets

Through-hole via on saw streets

Air cavity package for a semiconductor die and methods of forming the air cavity package

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS

Same size die stacked package having through-hole vias formed in organic material

Semiconductor die package and integrated circuit package and fabricating method thereof

GROUNDED SHIELD FOR BLOCKING ELECTROMAGNETIC INTERFERENCE IN AN INTEGRATED CIRCUIT PACKAGE

Semiconductor substrates including vias of nonuniform cross-section and associated structures

Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Light emitting diode

Side mountable semiconductor light emitting device packages and panels

Test structures for stacking dies having through-silicon vias

Extended redistribution layers bumped wafer

High Density Nanotube Devices

Thermal insulation for a bonding tool

Vacuum wire tensioner for wire bonder

Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package

Temperature control of a bonding stage

METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE

Metallization with tailorable coefficient of thermal expansion

Substrate with feedthrough and method for producing the same

LED epiwafer pad manufacturing process & new construction thereof

Semiconductor device, its manufacture method and electronic component unit

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Manufacturing method of a semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method and system for bonding 3D semiconductor devices

Chip package

Fabricating process of a chip package structure

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Compound semiconductor light-emitting device and production method thereof

Mold for forming a molding member and method of fabricating a molding member using the same

Semiconductor Light Emitting Element and Method for Manufacturing the Same

Adhesive composition and a method of using the same

MANUFACTURING METHOD OF ELECTRONIC COMPONENT

Solid-state image sensing device and electronic apparatus comprising same

Optical element module and method of assembling the optical element module

Bidirectional multiplexed RF isolator

Semiconductor laser diode element and method of manufacturing the same

Magnetoresistive device and method of packaging same

Lighting Module With Compact Colour Mixing and Collimating Optics

LED module

Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit board

Housing for an electronic circuit and method for sealing the housing

Phase change cooled electrical connections for power electronic devices

Phase change cooled power electronic module

METHOD AND APPARATUS FOR HEAT DISSIPATION

Liquid crystal display and method for manufacturing the same

Surface acoustic wave device and boundary acoustic wave device

Surface-mounted piezoelectric oscillators

Over-voltage protection for power and data applications

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

Scalable wideband probes, fixtures, and sockets for high speed IC testing and interconnects

Oxynitride fluorescent material and light-emitting device

Method transparent member, optical device using transparent member and method of manufacturing optical device

Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same

Semiconductor device package having a semiconductor element with a roughened surface

Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure

Die bonding agent and a semiconductor device made by using the same

LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Package equipped with semiconductor chip and method for producing same

Semiconductor device and its manufacturing method

Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties

Semiconductor device having a sealing resin and method of manufacturing the same

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE

Semiconductor device and process for fabricating the same

VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT

Semiconductor chip with post-passivation scheme formed over passivation layer

Structure of packaging substrate and method for making the same

Highly reliable low cost structure for wafer-level ball grid array packaging

WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE

Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device

Substrate with multi-layer interconnection structure and method of manufacturing the same

Structure and methods of processing for solder thermal interface materials for chip cooling

Chip-Stacked Package Structure and Applications Thereof

Low-cost and ultra-fine integrated circuit packaging technique

SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Chip-stacked package structure

Quad flat no-lead chip carrier with standoff

Semiconductor device and method of fabricating the semiconductor device

STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME

Semiconductor device and method for manufacturing the same

Etched interposer for integrated circuit devices

Semiconductor device

Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications

ULTRA THIN IMAGE SENSING CHIP PACKAGE

Semiconductor device

Semiconductor package using copper wires and wire bonding method for the same

Integrated circuit package device with improved bond pad connections, a lead-frame and an electronic device

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Magnetically alignable integrated circuit device

CHIP SIZE IMAGE SENSING CHIP PACKAGE

Semiconductor device and method for producing the same

Image capturing device

Structure and method for self protection of power device with expanded voltage ranges

Semiconductor device having vertical MOSFET

Semiconductor device

Light emitting diode element having a voltage regulating capability

Light emitting device having zener diode therein and method of fabricating the same

Light-emitting element package and light source apparatus using the same

LED element for an LED stream

Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component

STACKED SEMICONDUCTOR DEVICE ASSEMBLY AND PACKAGE

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

CMOS image pick-up with integrated optical and electronic elements and micro bump connectors

Antenna in package with reduced electromagnetic interaction with on chip elements

Method for bonding electronic components finished with electroless NiXP for preventing brittle fracture

Method of ultrasonic mounting and ultrasonic mounting apparatus using the same

Method of ultrasonic mounting and ultrasonic mounting apparatus using the same

Electronic flame-off electrode with ball-shaped tip

Interconnect structure with stress buffering ability and the manufacturing method thereof

Printed circuit board and manufacturing method thereof

Printed wiring board and method for manufacturing printed wiring board

Pressure sensor with sensing chip protected by protective material

Electronic Device Installed in an Engine Room

Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Solder interconnection array with optimal mechanical integrity

Surface-roughening method

PACKAGING METHOD TO MANUFACTURE PACKAGE FOR A HIGH-POWER LIGHT EMITTING DIODE

Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components

Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device