Combination of TSV and back side wiring in 3D integration

Integrated circuit having main route and detour route for signal transmission and integrated circuit package including the same

Vehicular power conversion device

Nanoscale interconnects fabricated by electrical field directed assembly of nanoelements

Integrated circuits including modified liners and methods for fabricating the same

Trench formation using horn shaped spacer

Buried signal transmission line

Semiconductor device with air gap and method for fabricating the same

Packaging substrate and method for manufacturing same

Vertical spiral inductor

Integrated optical sensor and methods for manufacturing and using the same

Triangular routing for high speed differential pair length matching

Method of density-controlled floorplan design for integrated circuits and integrated circuits

Interface for bridging out-of-band information from a downstream communication link to an upstream communication link

Array substrate and method for manufacturing the same, display device

Precise definition of transducer electrodes

Integrated circuit with integrated current sensor

Test socket assembly and related methods

Welding state inspection method

Positioning graphic component for substrate detection and method of manufacturing the same

Liquid cooling

Curable resin composition and cured product thereof, encapsulant, and semiconductor device

Epoxy and alkoxysilyl group-containing silsesquioxane and composition thereof

Co-extruded microchannel heat pipes

Resilient mounting assembly for photovoltaic modules

Light emitting die component formed by multilayer structures

Semiconductor light-emitting device and method of manufacturing the same

Semiconductor structure and method for manufacturing a semiconductor structure

Semiconductor device

Graphene-metal bonding structure, method of manufacturing the same, and semiconductor device having the graphene-metal bonding structure

Integrated circuit having a contact etch stop layer

Method of manufacturing semiconductor device and structure including passivation film with a trench having sections of different depths and widths

Array substrate, display panel and display device

Three-dimensional non-volatile memory device having a silicide source line and method of making thereof

Embedded nonvolatile memory and forming method thereof

Semiconductor device

Semiconductor devices and methods of manufacturing the same

Semiconductor device

Systems and methods for detecting and preventing optical attacks

Semiconductor device and method for manufacturing same

Formation of metal resistor and e-fuse

Integrated circuit with guard ring

Semiconductor structures having low resistance paths throughout a wafer

Metal interconnect structure and fabrication method thereof

Selective formation of conductor nanowires

Device having multiple-layer pins in memory MUX1 layout

Monitor structures and methods of formation thereof

Semiconductor structures and die assemblies including conductive vias and thermally conductive elements and methods of forming such structures

Method for forming MOS device passivation layer and MOS device

Display device

Self-aligned interconnect with protection layer

Aluminum interconnection apparatus

Semiconductor structures having low resistance paths throughout a wafer

Semiconductor structures having low resistance paths throughout a wafer

Enhancement of iso-via reliability

Non-hierarchical metal layers for integrated circuits

Integrated transformer

Low-test memory stack for non-volatile storage

Memory system having overwrite operation control method thereof

Display device

Display with low reflectivity alignment structures

Signal monitoring of through-wafer vias using a multi-layer inductor

Gas sensor package

Temperature sensor

Heat dissipation structure and heat dissipation system adopting the same

High thermal conductivity materials for thermal management applications

Bidirectional light emitting diode light sheet

Hybrid felts of electrospun nanofibers

Compute device casing that doubles as packaging and shipping container for the compute device

Selective clamping of electronics card to coolant-cooled structure

Compressible thermally conductive articles

Image capture apparatus

Thermally tempered glass substrate using CTE mismatched layers and paste mixtures for transient electronic systems

Device and method for bridging an electrical energy storage

Light-emitting device

Light-emitting diode chip with current spreading layer

Transparent conductive coatings for optoelectronic and electronic devices

Tunable breakdown voltage RF FET devices

Semiconductor device and manufacturing method thereof

Wafer strength by control of uniformity of edge bulk micro defects

Multilayer electrical device

Substrate

Solid state lighting device including narrow spectrum emitter

Semiconductor memory devices and methods of fabricating the same

Memory having memory cell string and coupling components

Methods and structures for multiport memory devices

Embedding semiconductor devices in silicon-on-insulator wafers connected using through silicon vias

Transparent overlapping LED die layers

Semiconductor device and manufacturing method of the same

Organic EL luminescent device

Dielectric region in a bulk silicon substrate providing a high-Q passive resonator

Laminar structure of semiconductor and manufacturing method thereof

Method for semiconductor wafer alignment

Formation of carbon-rich contact liner material

Semiconductor devices comprising interconnect structures and methods of fabrication

Logic cell, semiconductor device including logic cell, and method of manufacturing the logic cell and semiconductor device

Manufacturing method of a semiconductor device and method for creating a layout thereof

Semiconductor device and heat-conductive sheet

Method of reducing residual contamination in singulated semiconductor die

Three-dimensional semiconductor architecture

Method for patterning a graphene layer and method for manufacturing a display substrate

Multi-level stack having multi-level contact and method

Electrochemical plating methods

Methods for integrating lead and graphene growth and devices formed therefrom

Methods of providing dielectric to conductor adhesion in package structures

Vertical capacitors with spaced conductive lines

Stacked memory having same timing domain read data and redundancy

Smart pixel lighting and display microcontroller

Clock skew adjusting structure

Semiconductor element cooling structure and electronic apparatus provided with same

System and method for electrical testing of through silicon vias (TSVs)

Visually detecting electrostatic discharge events

Wide-angle emitting LED driven by built-in power and assembly method thereof

Sintering powder

Methods for stiction reduction in MEMS sensors

Semiconductor device

Multi-layer resin substrate having grounding conductors configured to form triplate line sections and microstrip sections

Electric power conversion apparatus

Circuit arrangement for the thermal protection of a power semiconductor

Wireless module with plural in-plane terminals

Light emitting device package having improved heat dissipation efficiency

Light emitting diode structure

Encapsulant film

Oxide semiconductor stacked film and semiconductor device

Organic optoelectronic component

Solid-state imaging device, members for the same, and imaging system

Dark current reduction for back side illuminated image sensor

Semiconductor devices

Individually read-accessible twin memory cells

High density single-transistor antifuse memory cell

Semiconductor device and electronic device

Self-healing electrostatic discharge power clamp

Three-dimensional inter-chip contact through vertical displacement MEMS

Stack package and reduction of standby current

Reconfigurable multi-stack inductor

Semiconductor substrate, image pickup element, and image pickup apparatus

Interconnect structures and fabrication method thereof

Semiconductor device including insulating film having opening portion and conductive film in the opening portion

Semiconductor device including plural types of resistors and manufacturing method of the semiconductor device

3DIC interconnect devices and methods of forming same

Protective via cap for improved interconnect performance

Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures

Tsv wafer with improved fracture strength

Semiconductor device

Two-sided jet impingement assemblies and power electronics modules comprising the same

Transistor, heat sink structure thereof and method for manufacturing same

Nanocrystalline diamond three-dimensional films in patterned semiconductor substrates

Semiconductor apparatus having TSV and testing method thereof

Self-aligned nanowire formation using double patterning

Manganese oxide hard mask for etching dielectric materials

Directed self assembly of block copolymers to form vias aligned with interconnects

Semiconductor device structure and method for forming the same

Method for electrochemically depositing metal on a reactive metal film

Thin film interconnects with large grains

Method for manufacturing semiconductor device and manufacturing apparatus of semiconductor device

Apparatus and method for chemical mechanical polishing process control

Semiconductor device structures with doped elements and methods of formation

Semiconductor device and fabrication method thereof

Method of manufacturing a semiconductor device with a continuous silicate glass structure

Integrated vapor chamber for thermal management of computing devices

Infrared ray absorbing composition or infrared ray absorbing composition kit, infrared ray cut filter using the same, method for producing the infrared ray cut filter, camera module, and method for producing the camera module

Test method and test arrangement

Color conversion arrangement, a lighting unit, a solid state light emitter package and a luminaire

Optoelectronic component and method for the production thereof

Method for electrochemically depositing metal on a reactive metal film

Encapsulating composition, barrier layer including same, and encapsulated apparatus including same

Vehicular control device and fail-safe method

Micro electro mechanical system, semiconductor device, and manufacturing method thereof

I/O device, method for providing ESD protection for an I/O device and ESD protection device for an I/O device

Heatsink with internal cavity for liquid cooling

Heat sink and housing for an inverter with such a heat sink

Integrated compact impingement on extended heat surface

Seal ring and method for manufacturing seal ring

Vacuum pallet reflow

Semiconductor module with low inductance load connections

Semiconductor package including an embedded circuit component within a support structure of the package

Printed wiring board and method for manufacturing the same

Frequency selective structures for EMI mitigation

Component carrier and component carrier arrangement

Electric assembly to be mounted on a top-hat rail

Mounting structure of electronic components provided with heat sink

Semiconductor device and power circuit including a sense transistor for current sensing

Sealed body, light-emitting module, and method of manufacturing sealed body

Light emitting diode and method of manufacturing the same

Wafer-level light emitting diode package and method of fabricating the same

Thin film transistor array substrate and method of manufacturing the same

Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions

Conductive spline for metal gates

Vertical meander inductor for small core voltage regulators

Semiconductor device having inductor

Method for fabricating COA array substrate, array substrate and display device

High density MOSFET array with self-aligned contacts delimited by nitride-capped trench gate stacks and method

Semiconductor integrated circuit

Opto-electronic modules including features to help reduce stray light and/or optical cross-talk

Self-forming embedded diffusion barriers

Semiconductor integrated circuit

Device architecture and method for precision enhancement of vertical semiconductor devices

E-fuse structure of semiconductor device

Semiconductor devices having nonlinear bitline structures

Structures for heat dissipating interposers

Passivation structure of fin field effect transistor

Curable resin composition, and cured product of same

Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates

Interconnect structure and methods of making same

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

Through silicon via (TSV) process

Method of manufacturing dielectric layers of semiconductor structure

Stitch-derived via structures and methods of generating the same

Display device

Production of micro-mechanical devices

Backlight module and display device

Motor vehicle lighting and/or signalling device

Light panel system

Vibrational fluid mover active controller

Adhesive tape containing getter material

Reflectors for light-emitting diode assemblies containing a white pigment

Photocured composition, blocking layer comprising same and encapsulated device comprising same

Method and apparatus for tuning a resonant circuit using a laser

Evaporator, cooling device, and electronic device

Wiring board

Wiring substrate for bonding using solder having a low melting point and method for manufacturing same

Semiconductor device including electrostatic discharge circuit and operation method thereof

Nano-encapsulating polymers with high barrier properties

Method and apparatus for coupling light-emitting elements with light-converting material

Process for producing adjacent chips comprising LED wires and device obtained by the process

Transistors with isolation regions

Flexible display substrate and a manufacturing method thereof, as well as a flexible display device

Semiconductor integrated circuit device and a method of manufacturing the same

Methods and devices for intra-connection structures

Methods, structures and devices for intra-connection structures

Semiconductor device including self-protecting current sensor

Decoupling capacitor and method of making same

Transistor structure having an electrical contact structure with multiple metal interconnect levels staggering one another

Integrated device

Optical semiconductor lighting apparatus

Method for manufacturing semiconductor device

Semiconductor devices and methods of making the same

Designing and manufacturing methods of TFT LCD array positioning mark

Semiconductor devices including metal-silicon-nitride patterns

Semiconductor device having air gap structures and method of fabricating thereof

Standard cell architecture with M1 layer unidirectional routing

Metal pad offset for multi-layer metal layout

Semiconductor device having Ti- and N-containing layer, and manufacturing method of same

Substrate and method of forming the same

Voids in interconnect structures and methods for forming the same

Conductive line patterning

Vertical NAND string multiple data line memory

Semiconductor interconnect structure and manufacturing method thereof

Semiconductor having a high aspect ratio via

Method of forming semiconductor device including source/drain contact having height below gate stack

Conductive lines in circuits

Semiconductor devices and methods of fabricating the same

Semiconductor device having air gap structures and method of fabricating thereof

Wafer processing method

Wafer processing method

Passive-matrix light-emitting diodes on silicon micro-display

Package structure

Wide pin for improved circuit routing

Wafer-level liquid-crystal-on-silicon projection assembly, systems and methods

LED display with wavelength conversion layer

Group III nitride wafers and fabrication method and testing method

Optical device with optical element and sensor for sampling light

Tantalum sputtering target and method for producing same

Pressure-sensitive adhesive composition

Group III nitride wafers and fabrication method and testing method

Lead-free solder alloy for printed circuit board assemblies for high-temperature environments

Variable frequency drive operation to avoid overheating

Information carrying card comprising a cross-linked polymer composition, and method of making the same

Package substrate and method for manufacturing package substrate

Mounting carrier and method of mounting a mounting carrier on a connecting carrier

Backside initiated uniform heat sink loading

Light emitting device and electronic apparatus including the same

Cascode power amplifier

Method for making a capacitive micromachined ultrasonic transducer

Extended drain non-planar MOSFETs for electrostatic discharge (ESD) protection

Organic electroluminescent panel

Light emitting device having opening for extracting light and method for manufacturing light emitting device having opening for extracting light

Method for manufacturing semiconductor device

Optoelectronic modules that have shielding to reduce light leakage or stray light

Display device and method for producing a display device

FinFETs suitable for use in a high density SRAM cell

Method of thinning a wafer to provide a raised peripheral edge

Semiconductor light emitting element and method for manufacturing the same

Imprint method, imprint apparatus, and article manufacturing method using the same

Semiconductor device comprising a graphene wire

Interconnect structure and manufacturing method thereof

Semiconductor device and method of manufacturing such semiconductor device

Semiconductor device having fuse pattern

Structure and method for a high-K transformer with capacitive coupling

Slot-shielded coplanar strip-line compatible with CMOS processes

Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies

Electronic device and method for manufacturing the same, and substrate structure and method for manufacturing the same

Semiconductor package with coated side walls and method of manufacture

Light emitting device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Self-aligned barrier and capping layers for interconnects

Alignment to multiple layers

Film forming method, film forming apparatus and recording medium

Stacked memory device system interconnect directory-based cache coherence methodology

Heat dissipation in computing device