212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Radiation-emitting component
#6902White light source and white light source system including the same
#6903Aluminum EMI / RF shield
#6904Fluid-cooled heat dissipation device
#6905Heat sink base and shield
#6906Semiconductor device
#6907Semiconductor element temperature detecting system and semiconductor module and semiconductor module system
#6908Vertical hall sensor circuit comprising stress compensation circuit
#6909Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
#6910Semiconductor device and fabrication method
#6911Method of manufacturing through-glass vias
#6912Semiconductor device having groove-shaped via-hole
#69133D packages and methods for forming the same
#6914Cavity package with die attach pad
#6915Semiconductor device, manufacturing method therefor, and electronic apparatus
#6916Wafer-level array cameras and methods for fabricating the same
#6917Ceramic conversion element, optoelectronic semiconductor component comprising a ceramic conversion element, and method for producing a ceramic conversion element
#6918Light emitting device and manufacturing method for same
#6919Light emitting diode package and method for manufacturing the same
#6920Layered conductive phosphor electrode for vertical LED and method for forming same
#6921Light-emitting device having an electrode with depressions
#6922Semiconductor device with plural electrodes formed on substrate
#6923Array substrate with ESD assembly and short-circuit ring
#6924Display device comprising a metal oxide semiconductor channel and a specified insulating layer arrangement
#6925Cooling device that uses three fluids to cool electronics
#6926Method for strain-relieved through substrate vias
#6927Method for producing an optoelectronic nitride compound semiconductor component
#6928Thermocompression bonding structure and thermocompression bonding method
#6929Methods for bypassing faulty connections
#6930LED lamps with improved quality of light
#6931Substrate assembly, method of manufacturing substrate assembly and method of manufacturing chip package
#6932Pulse signal output circuit and shift register
#6933Cascoded semiconductor devices with gate bias circuit
#6934Intelligent voltage regulator
#6935Semiconductor apparatus
#6936Conductive structures, systems and devices including conductive structures and related methods
#6937Multilevel interconnect structures and methods of fabricating same
#6938Semiconductor device and method
#6939Semiconductor device having groove-shaped via-hole
#6940Semiconductor device having groove-shaped via-hole
#6941Semiconductor device having groove-shaped via-hole
#6942Semiconductor structures having adhesion promoting layer in cavities
#6943Display device and manufacturing method thereof
#6944Semiconductor device with air gap and method for fabricating the same
#6945Self-forming embedded diffusion barriers
#6946Semiconductor device having groove-shaped via-hole
#6947Semiconductor integrated circuit device
#6948Semiconductor device having groove-shaped via-hole
#6949Semiconductor device and method for manufacturing the same
#6950Semiconductor light-emitting device and method of forming the same
#6951Flexible substrate, flexible display device, and method for manufacturing flexible display device
#6952Wafer-level fabrication of optical devices with front focal length correction
#6953Black marker composition and an electronic component using these
#6954Arrangement for energy conditioning
#6955Vehicular camera and lens assembly and method of manufacturing same
#6956Statistical model-based metrology
#6957Compound semiconductor device and manufacturing method therefor
#6958Aluminum interconnection apparatus
#6959Semiconductor devices and methods of manufacturing the same
#6960Method for forming through-silicon via (TSV) with diffused isolation well
#6961Dicing sheet with protective film forming layer and chip fabrication method
#6962Capacitor arrays for minimizing gradient effects and methods of forming the same
#6963Package with passive devices and method of forming the same
#6964Plasma processing apparatus and plasma processing method
#6965Thin film battery on an integrated circuit or circuit board and method thereof
#6966Method for wafer-level manufacturing of objects and corresponding semi-finished products
#6967Cooling unit and illuminating apparatus
#6968Power semiconductor module and method of manufacturing a power semiconductor
#6969Silicon-based heat dissipation device for heat-generating devices
#6970Cooling electronic components and supplying power to the electronic components
#6971Method for measuring film thickness distribution
#6972Capacitive blind-mate module interconnection
#6973LED light with three-dimensional polyhedron printed circuit board
#6974Piezoelectric/electrostrictive element and wiring substrate
#6975On-chip capacitors with a variable capacitance for a radiofrequency integrated circuit
#6976Semiconductor device having groove-shaped via-hole
#6977Semiconductor device having groove-shaped via-hole
#6978Semiconductor device having groove-shaped via-hole
#6979Semiconductor device having groove-shaped via-hole
#6980Semiconductor-on-insulator integrated circuit with interconnect below the insulator
#6981Method for making a photolithography mask intended for the formation of contacts, mask and integrated circuit corresponding thereto
#6982Stacked structure having a protective layer between an insulation layer and wiring
#6983TSV layout structure and TSV interconnect structure, and fabrication methods thereof
#6984Semiconductor device and semiconductor system including the same
#6985Package structure of a chip and a substrate
#6986Interconnect for an optoelectronic device
#6987Lead pin for package substrate
#6988Semiconductor device
#6989Semiconductor device and method of manufacturing a semiconductor device with a continuous silicate glass structure
#6990Insulating substrate, method of manufacturing the same, and semiconductor device
#6991Laser machining method and chip
#6992Avalanche diode having an enhanced defect concentration level and method of making the same
#6993Capacitor arrays for minimizing gradient effects and methods of forming the same
#6994Semiconductor structures with metal lines
#6995Semiconductor device with antenna and light-emitting element
#6996Imaging device, imaging apparatus, production apparatus and method, and semiconductor device
#6997Deposited material and method of formation
#6998Semiconductor chip including digital logic circuit including linear-shaped conductive structures having electrical connection areas located within inner region between transistors of different type and associated methods
#6999Flip-chip light emitting diode package with moisture barrier layer
#7000Display device
#7001Alternating current vertical light emitting element and manufacturing method thereof
#7002Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
#7003Ceramic/copper circuit board and semiconductor device
#7004Silicon carbide device and a method for forming a silicon carbide device
#7005Silicon member and method of producing the same
#7006Integrated multi-sensor module
#7007Devices and methods for providing selectable field of view functionality by providing an optical element into and out of an optical receiving path
#7008Ceramic circuit board and process for producing same
#7009Method and apparatus for improved cooling of a heat sink using a synthetic jet
#7010Thermal ground plane for cooling a computer
#7011Method of producing electronics substrate with enhanced direct bonded metal
#7012Microelectronic devices with through-silicon vias and associated methods of manufacturing
#7013Electroplating methods for fabricating integrated circuit devices and devices fabricated thereby
#7014Methods for producing interconnects in semiconductor devices
#7015Method for manufacturing semiconductor device and exposure mask used in the same method
#7016Package including an interposer having at least one topological feature
#7017Warp correction device and warp correction method for semiconductor element substrate
#7018Thermally assisted flash memory with diode strapping
#7019LED lamp
#7020Photodetector, liquid crystal display device, and light-emitting device
#7021Display device
#7022Wafer masks, semiconductor device, and computer aided fabrication system for distributed LC resonant tanks and clock tree synthesis
#7023Light-emitting diode module and method for operating a light-emitting diode module
#7024Method of curing thermoplastics with microwave energy
#7025Interlevel dielectric stack for interconnect structures
#7026Interconnect level structures for confining stitch-induced via structures
#7027Methods for multi-wire routing and apparatus implementing same
#7028Semiconductor device
#7029Stacked semiconductor device, and method and apparatus of manufacturing the same
#7030Semiconductor device
#7031Semiconductor device and method of manufacturing the same
#7032Graphene wiring
#7033Jet impingement cooling apparatuses having non-uniform jet orifice sizes
#7034Methods and systems for selectively forming metal layers on lead frames after die attachment
#7035Ferroelectric capacitor
#7036Semiconductor device, method for manufacturing the same, and electronic device
#7037Method of semiconductor integrated circuit fabrication
#7038Semiconductor structure with deep trench thermal conduction
#7039Semiconductor device
#7040Solid-state imaging device, method for manufacturing solid-state imaging device, method for manufacturing solid-state imaging element, and semiconductor device
#7041Light-emitting diode package and method for manufacturing same
#7042Light emitting device with molded wavelength converting layer
#7043Semiconductor light emitting device and method of fabricating semiconductor light emitting device
#7044Optoelectronic semiconductor component
#7045Light emitting diode package
#7046Light emitting diode package
#7047High purity copper—manganese alloy sputtering target
#7048Cooling device for electric equipment
#7049Interleaved heat sink and fan assembly
#7050Tamper resistant amorphous alloy joining
#7051Support for capillary self-assembly with horizontal stabilisation, fabrication method and use
#7052Mesh planes with alternating spaces for multi-layered ceramic packages
#7053Flexible memory system with a controller and a stack of memory
#7054Systems and methods of compensating for filling material losses in electroplating processes
#7055Shock determination based on prior shocks
#7056Chip mode isolation and cross-talk reduction through buried metal layers and through-vias
#7057Synthetic jet driven cooling device with increased volumetric flow
#7058Multiple-patterned semiconductor device channels
#7059Integrated cluster to enable next generation interconnect
#7060Capacitors in integrated circuits and methods of fabrication thereof
#7061High density three-dimensional integrated capacitors
#7062Inductive element with interrupter region and method for forming
#7063Methods of manufacturing a semiconductor device
#7064Method of fabricating semiconductor multi-chip stack packages
#7065Methods for bonding a hermetic module to an electrode array
#7066Semiconductor light-emitting device with a protection layer and the manufacturing method thereof
#7067Optical absorbers
#7068Methods for reducing etch nonuniformity in the presence of a weak magnetic field in an inductively coupled plasma reactor
#7069Method for forming ReRAM chips operating at low operating temperatures
#7070Optical control of multi-stage thin film solar cell production
#7071Portable wireless sensor
#7072Method for qualifying a semiconductor wafer for subsequent processing
#7073Transparent substrate having nano pattern and method of manufacturing the same
#7074Method for improving data retention of ReRAM chips operating at low operating temperatures
#7075Electrically insulative coatings for LED lamp and elements
#7076Capacitor with a dielectric between a via and a plate of the capacitor
#7077Support structure for integrated circuitry
#7078Electronic devices assembled with heat absorbing and/or thermally insulating composition
#7079Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint
#7080Advanced cooling for power module switches
#7081Power pole isolated heat pipe inverter assembly
#7082Thermosiphon systems for electronic devices
#7083Defect inspection method and defect inspection device
#7084Image pickup unit and method for manufacturing the same
#7085Integration of a replica circuit and a transformer above a dielectric substrate
#7086Circuits for and methods of implementing a gain stage in an integrated circuit
#7087Connector devices, systems, and related methods for light emitter components
#7088Wafer mapping process control with indicator line
#7089Encapsulation of advanced devices using novel PECVD and ALD schemes
#7090Wiring structures including spacers and an airgap defined thereby, and methods of manufacturing the same
#7091Multiple-patterned semiconductor device channels
#7092Three-dimensional semiconductor architecture
#7093Semiconductor device
#7094Through-silicon vias and interposers formed by metal-catalyzed wet etching
#7095Method and apparatus for back end of line semiconductor device processing
#7096Interconnect structure with kinked profile
#7097Semiconductor structure
#7098Metal cap apparatus and method
#7099Chip arrangement, wafer arrangement and method of manufacturing the same
#7100Integrated circuit layout
#7101Through silicon vias
#7102Dual damascene gap filling process
#7103Stubby pads for channel cross-talk reduction
#7104Interconnect structure and method of forming the same
#7105Patterning approach for improved via landing profile
#7106Semiconductor device and layout design system
#7107Structure and method for a low-K dielectric with pillar-type air-gaps
#7108Pitch-halving integrated circuit process and integrated circuit structure made thereby
#7109Oriented crystal nanowire interconnects
#7110Methods and structures to facilitate through-silicon vias
#7111Copper interconnect structures and methods of making same
#7112Multi-layer barrier layer stacks for interconnect structures
#7113Electro-migration barrier for Cu interconnect
#7114Chemical direct pattern plating interconnect metallization and metal structure produced by the same
#7115Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#7116Methods of forming wafer level underfill materials and structures formed thereby
#7117Semiconductor device including insulating films with different moisture resistances and fabrication method thereof
#7118Formation of a high aspect ratio contact hole
#7119Passivation layer for harsh environments and methods of fabrication thereof
#7120Metal deposition on substrates
#7121Precursor composition for deposition of silicon dioxide film and method for fabricating semiconductor device using the same
#7122Nanocrystalline diamond three-dimensional films in patterned semiconductor substrates
#7123System and method for optimization of an imaged pattern of a semiconductor device
#7124Shielding for through-silicon-via
#7125Method of forming through substrate vias (TSVs) and singulating and releasing die having the TSVs from a mechanical support substrate
#7126Methods for forming a stress-relieved film stack by applying cutting patterns
#7127Layout optimization of a main pattern and a cut pattern
#7128Dual three-dimensional (3D) resistor and methods of forming
#7129Integrated capacitor
#7130Folded conical inductor
#7131Inductor system and method
#7132Magnetic core inductor (MCI) structures for integrated voltage regulators
#7133Nonvolatile semiconductor memory device and method of manufacturing the same
#7134Seal ring structure with rounded corners for semiconductor devices
#7135Image pickup module and image pickup unit
#7136Low profile image sensor
#7137Interconnect structure for stacked device and method
#7138Methods for forming protection layers on sidewalls of contact etch stop layers
#7139Methods of forming alignment marks and overlay marks on integrated circuit products employing FinFET devices and the resulting alignment/overlay mark
#7140Hybrid extremely thin silicon-on-insulator (ETSOI) structure to minimize noise coupling from TSV
#7141Hybrid ETSOI structure to minimize noise coupling from TSV
#7142Semiconductor devices having dielectric caps on contacts and related fabrication methods
#7143Metal-oxide-semiconductor field-effect transistor with metal-insulator semiconductor contact structure to reduce Schottky barrier
#7144Light-emitting device and method for manufacturing the same
#7145Light emitting device
#7146Wiring board and light emitting device
#7147Flexible lighting device
#7148Integrated multi-chip module optical interconnect platform
#7149Light emitting module
#7150Light emitting diode
#7151Fin field effect transistors having a nitride containing spacer to reduce lateral growth of epitaxially deposited semiconductor materials
#7152Power switching module with reduced oscillation
#7153Process of forming a semiconductor wafer
#7154Daisy chain connection for testing continuity in a semiconductor die
#7155Double sided Si(Ge)/Sapphire/III-nitride hybrid structure
#7156ZnTe on TiN or Pt electodes with a portion operable as a current limiting layer for ReRAM applications
#7157Actively aligned detectors for optical and optoelectronic arrays
#7158Image sensor including planar boundary between optical black and active pixel sensor areas
#7159Read out integrated circuit input/output routing on permanent carrier
#7160Low cost interposer and method of fabrication
#7161Thermal interface materials
#7162Heat transfer system and method incorporating tapered flow field
#7163Inverter power module packaging with cold plate
#7164Management of exterior temperatures encountered by user of a portable electronic device using multiple heat-rejection elements
#7165Management of exterior temperatures encountered by user of a portable electronic device
#7166Direct injection phase change temperature control system
#7167Thermoelectric assembly
#7168Electronic apparatus and cooling method
#7169Method of manufacturing LED module
#7170Interlevel dielectric stack for interconnect structures
#7171Radiofrequency adjustment for instability management in semiconductor processing
#7172Contactless communications using ferromagnetic material
#7173Multi-sequenced LEDs on two or more wires
#7174Stud bump bonding in implantable medical devices
#7175Drive circuit device
#7176Electronic component and electronic component cooling method
#7177Multi-component electronic module with integral coolant-cooling
#7178Electronic apparatus, such as a modem or the like, comprising a plurality of air-cooled processors
#7179Electronic product including a heat dissipating device
#7180Synthetic jet actuator equipped with entrainment features
#7181RF choke device for integrated circuits
#7182Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods
#7183Surface potential measuring apparatus and surface potential measuring method
#7184Current sensor
#7185Multilayer pattern transfer for chemical guides
#7186Layout structure of standard cell, standard cell library, and layout structure of semiconductor integrated circuit
#7187Anchor vias for improved backside metal adhesion to semiconductor substrate
#7188Semiconductor integrated circuit
#7189Semiconductor module
#7190Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)
#7191Mitigating electromigration effects using parallel pillars
#7192Chip package and method for forming the same
#7193Integrated circuit device, method for producing mask layout, and program for producing mask layout
#7194Interconnect structure and method of forming the same
#7195Self-aligned pitch split for unidirectional metal wiring
#7196Self-aligned pitch split for unidirectional metal wiring
#7197Material and process for copper barrier layer
#7198Method for forming interconnect structure that avoids via recess
#7199Barrier layer conformality in copper interconnects
#7200Electroless fill of trench in semiconductor structure