SiC crystalline on Si substrates to allow integration of GaN and Si electronics

MONOLITHIC SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Via-holed ceramic substrate, metallized via-holed ceramic substrate, and method for manufacturing the same

Packaging substrate and fabrication method thereof

Print compatible designs and layout schemes for printed electronics

FIXING DEVICE, AND HEAT SINK DEVICE OR SHIELD CASE COMPRISING THE SAME

HEAT SINK

HEAT SINK

Cooling system for power conversion device

Thermal management of photonics assemblies

HEAT SINK ASSEMBLY WITH MISTAKE-PROOF STRUCTURE

Adaptive endpoint method for pad life effect on chemical mechanical polishing

Solar cell system

HEAT SINK FIN STRUCTURE BLOCKING ELECTROMAGNETIC RADIATION

Integrated circuit manufacturing tool condition monitoring system and method

Method for forming a reliable solderable contact

Method for manufacturing semiconductor device

Methods of fabricating optoelectronic devices using layers detached from semiconductor donors and devices made thereby

Light emitter devices and methods with reduced dimensions and improved light output

Display device

FAN-OUT CIRCUIT AND ELECTRONIC DEVICE HAVING THE SAME

Heat switch array for thermal hot spot cooling

Heat dissipating module

Thermally controlled assembly

Portable computing device with thermal management

Capacitance trimming with an integrated heater

Electronic device, in particular for protection against electrostatic discharges, and method for protecting a component against electrostatic discharges

TAPE SUBSTRATE WITH CHIP ON FILM STRUCTURE FOR LIQUID CRYSTAL DISPLAY PANEL

Image pickup device, image pickup module, and camera

Inductor structure

High electron mobility transistors with multiple channels

Non-linear kerf monitor and design structure thereof

Chip identification for organic laminate packaging and methods of manufacture

Multilayer interconnects with an extension part

Semiconductor device including a protective film

Semiconductor device and method of manufacturing the same

Through silicon via structure having protection ring

Solderable contact and passivation for semiconductor dies

Doped tantalum nitride for copper barrier applications

Semiconductor device

Superfilled metal contact vias for semiconductor devices

Variable inductor and semiconductor device using same

Transient devices designed to undergo programmable transformations

Analog circuit cell array having some transistors that include two connected gate electrodes and two connected source regions

Field-effect device and manufacturing method thereof

Integrated circuit including a power transistor and an auxiliary transistor

GaN high voltage HFET with passivation plus gate dielectric multilayer structure

Method for producing an optoelectronic semiconductor chip, and optoelectronic semiconductor chip

Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device

Apparatus and method for measuring a luminescent decay

Wireless IC device

Method for manufacturing a cooling device for electronic component

Method for manufacturing solar cell

Heat sink with orientable fins

Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film

Film forming method and processing system

HEAT SINK AND LED LAMP USING THE SAME

LED and backlight module using the same

Fixing device and thermal module incorporating the same

Liquid-cooling memory modules with liquid flow pipes between memory module sockets

TAG FORGERY PROTECTION

Three-dimensional integrated circuit and testing method for the same

LED GLASS AND METHOD FOR MANUFACTURING THE SAME

Epoxy resin composition and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Methods and apparatus to improve reliability of isolated vias

Wire and semiconductor device

Sealed body, light-emitting module and method of manufacturing sealed body

Structure of very high insertion loss of the substrate noise decoupling

Semiconductor structure comprising moisture barrier and conductive redistribution layer

Vertical capacitors and methods of forming the same

INDUCTORS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

Dark current reduction for back side illuminated image sensor

Semiconductor device and method of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor devices and methods of manufacturing the same

Polysilicon/metal contact resistance in deep trench

Abutment structure of semiconductor cell

LOW-LIGHT-EMITTING-ANGLE HIGH-LUMINANCE UV LED NAIL LAMP STRUCTURE AND LED LIGHT SOURCE MODULE THEREOF

Cost-effective LED lighting instrument with good light output uniformity

Light emitting, photovoltaic or other electronic apparatus and system

Thin-film transistor and thin-film transistor manufacturing method

Composition of organic insulating layer and thin film transistor substrate and display device using the same

Mesh planes with alternating spaces for multi-layered ceramic packages

Top corner rounding of damascene wire for insulator crack suppression

HEAT DISTRIBUTION STRUCTURE, MANUFACTURING METHOD FOR THE SAME AND HEAT-DISSIPATION MODULE INCORPORATING THE SAME

Co-extruded microchannel heat pipes

HEAT DISSIPATION DEVICE WITH FIXING MEMBER FOR HEAT PIPE THEREOF

HEAT SINK WITH HEAT BUS AND FIN STRUCTURE

Optical sensor array and method for solar concentrator alignment

Use of energy harvested by adaptive cooling and energy harvesting arrangements for information technology

Co-extruded microchannel heat pipes

Method of manufacturing stacked mounting structure

Method for fabricating a metal silicide interconnect in 3D non-volatile memory

Methods of testing integrated circuit devices using fuse elements

Edge-emitting semiconductor laser

Power conversion device

HEAT SINK ASSEMBLY

Cooling device and electronic device

Electrostatic discharge protection apparatus and method therefor

Imaging device

Image pickup apparatus, endoscope and image pickup apparatus manufacturing method

Display device, method of laying out wiring in display device, and electronic device

Redundant via structure for metal fuse applications

High-voltage AC LED structure

Adaptive switch mode LED driver

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME

Through silicon via in n+ epitaxy wafers with reduced parasitic capacitance

Liner-free tungsten contact

SEMICONDUCTOR DEVICES INCLUDING DUAL DAMASCENE METALLIZATION STRUCTURES

Mechanisms of forming damascene interconnect structures

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Thick bond pad for chip with cavity package

Metal oxide metal capacitor with slot vias

Defected ground plane inductor

Image Sensor Module Package and Manufacturing Method Thereof

Interposer package for CMOS image sensor and method of making same

Integrated circuits with electrical fuses and methods of forming the same

Semiconductor device and method of manufacturing the same

3D non-volatile memory with metal silicide interconnect

Dynamic Random Access Memory Array and Method of Making

Semiconductor device and method of formation

Light emitting diode without leads

Semiconductor light-emitting device and method for manufacturing semiconductor light-emitting device

Inverted optical device

Light emitting device and fabricating method thereof

Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof

E-fuses containing at least one underlying tungsten contact for programming

System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects

Series fan assembling structure

MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES

FIXING APPARATUS FOR HEAT SINK

System and method for a switchable heat sink

Heat sink with orientable fins

Heat pipe and method of manufacturing a heat pipe

Thermal switch using moving droplets

Anti-tamper device for integrated circuits

Cavities containing multi-wiring structures and devices

Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package

Cu alloy film for display device and display device

Illumination apparatus confining light by total internal reflection and methods of forming the same

LIGHT EMITTING DIODE PACKAGE

Housing for a chip arrangement and a method for forming a housing

Heat dissipation module

MOTHERBOARD WITH HEAT SINK

User-serviceable liquid DIMM cooling system

Input/output circuit with inductor

ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT AND ELECTRONIC DEVICE

Heat dissipation device of light engine with fan module and heat sink

Die power structure

Rotating curing

Semiconductor device and method of manufacturing the same

THROUGH SILICON VIA FOR STACKED WAFER CONNECTIONS

THERMALLY ENHANCED PACKAGING STRUCTURE

Chips with high fracture toughness through a metal ring

Forming BEOL line fuse structure

FORMATION OF STI TRENCHES FOR LIMITING PN-JUNCTION LEAKAGE

Electrical overstress protection using through-silicon-via (TSV)

Image pickup apparatus and image pickup apparatus manufacturing method

Semiconductor device and method of manufacturing the same

Semiconductor device with seal ring with embedded decoupling capacitor

Light emitting device

LIGHT EMITTING DIODE PACKAGE STRUCTURE

Display device and method for fabricating the same

Light-emitting device having mixed layer including hole transporting compound

Broadband infrared light emitting device

Method and system for ion beam delayering of a sample and control thereof

Package Substrate Structure

High strength through-substrate vias

Electronic device having heat dissipation device

Vortex generating finned liquid-cooling heat exchanger module with transverse plate or pathways

APPARATUS FOR COOLING OF ELECTRONIC DEVICES UTILIZING MICROFLUIDIC COMPONENTS

Processing method for wafer having chamfered portion along the outer circumference thereof followed by thinning and separating

End point detection in grinding

Method for forming an air gap around a through-silicon via

Low-temperature wafer level processing for MEMS devices

Method of manufacturing semiconductor device

Semiconductor device performing refresh operation

Broad-area lighting systems

LED integrated packaging light source module

EMI shield

Power semiconductor system

HEAT MANAGEMENT DEVICE AND ELECTRONIC APPARATUS

Thermally controlled assembly

HEAT REMOVAL SYSTEM FOR COMPUTING SYSTEMS

Electrostatic discharge protection device

Substrate inspection apparatus and substrate inspection method

Surface light source and liquid crystal display device

Semiconductor device

Semiconductor devices and methods of manufacturing the same

Wiring structure, thin film transistor array substrate including the same, and display device

DEVICE HAVING TSVs WITH GETTERING LAYER LATERAL TO TSV TIPS

Semiconductor interconnect structure having a graphene-based barrier metal layer

Use of gas cluster ion beam to reduce metal void formation in interconnect structures

MODULE IC PACKAGE STRUCTURE HAVING A METAL SHIELDING FUNCTION FOR PREVENTING ELECTRICAL MALFUNCTION INDUCED BY SHORT-CIRCUIT

Metal finger capacitor for high-K metal gate processes

Metal-insulator-metal capacitor structure and method for manufacturing the same

Integrated circuit having a MOM capacitor and method of making same

SEMICONDUCTOR DEVICE WITH FUSE

Low-K dielectric protection spacer for patterning through substrate vias through a low-K wiring layer

Lens Holder, Method for Manufacturing the Same and Image Capturing Device Thereof

Optoelectronic component and method for producing an optoelectronic component

Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device

Heat sink

Conformal reference planes in substrates

Metal Alloy Cap Integration

Thermal conductive sheet, method of producing thermal conductive sheet and heat releasing device

HEAT SINK

HEAT DISSIPATION DEVICE

HEAT DISSIPATING DEVICE AND MANUFACTURE METHOD THEREOF

HEAT-DISSIPATING DEVICE AND HEAT-DISSIPATING SYSTEM

Flat heat pipe and fabrication method thereof

POWER SEMICONDUCTOR MODULE COOLING APPARATUS

Hermetic sealing of glass plates

Instruction type issue throttling upon reaching threshold by adjusting counter increment amount for issued cycle and decrement amount for not issued cycle

Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation

Manufacturing method of semiconductor device

NANOWIRE EFUSES

Mask, manufacturing method thereof and mask haze monitoring method

Methods of Filling Voids in Copper Structures

Electric work vehicle

Optical bus in 3D integrated circuit stack

Inspection method and device therefor

Method and System for Optical Inspection Using Known Acceptable Dies

System and method for operating an electric power converter

LED module and method of bonding thereof

Heat pipe, heat dissipating module and illumination device

Fixing mechanism and related electronic device

Heat sink device

Storage device and method for producing the same

INTEGRATED CIRCUITS WITH CASCODE TRANSISTOR

Nanowire efuses

Test key structure and method for measuring step height by such test key structure

Light emitting device in which traces of light emitting elements merge into a single trace and lighting apparatus including the same

Method of manufacturing a temperature-compensated micromechanical resonator

Low energy etch process for nitrogen-containing dielectric layer

Semiconductor device

Semiconductor device with vias on a bridge connecting two buses

Chip

Structure for hermetic encapsulation of a device and an electronic component

Metal capacitor design for improved reliability and good electrical connection

Packaging substrate having embedded capacitors and fabrication method thereof

Semiconductor device including in wafer inductors, related method and design structure

Simplified pitch doubling process flow

Semiconductor structure

Fin-like field effect transistor (FinFET) based, metal-semiconductor alloy fuse device and method of manufacturing same

Semiconductor device and the method of manufacturing the same

Flip-chip light emitting diode

WHITE LIGHT EMITTING DIODE DEVICE

Integrated sensing package structure

System for transient voltage suppressors

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

Low cost and high performance bonding of wafer to interposer and method of forming vias and circuits

COOLING SYSTEM

HEAT SINK FIN AND HEAT SINK DEVICE

FLATTENED HEAT PIPE

Heat dissipation fan

HEAT DISSIPATION DEVICE

Heat dissipation device with fin set

Liquid-cooling heat exchange module

HEAT SINK

Method for encapsulating semiconductor and structure thereof

Simultaneous silicone dispension on coupler

Polycrystalline silicon rod and method for manufacturing polycrystalline silicon rod

Test system supporting simplified configuration for controlling test block concurrency

Optoelectronic lighting module and automotive headlamp

LED Lamp

ELECTRONIC DEVICE USING FASTENER FOR FIXING

Electrical feedthrough assembly

Stacked power supplies for integrated circuit devices and methods of making the same

Semiconductor device and method of forming same for ESD protection

Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device

Chamfered corner crackstop for an integrated circuit chip

Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough

Structure and method for a high-K transformer with capacitive coupling

Structure and process for microelectromechanical system-based sensor

Semiconductor structure having a through substrate via (TSV) and method for forming

Vertical MOSFET electrostatic discharge device

Semiconductor device having a through contact and a manufacturing method therefor

Semiconductor device and method for manufacturing same

FULL SPECTRUM LED LIGHT SOURCE

Multi-chip package cross-reference to related applications

STRUCTURE OF SEMICONDUCTOR CHIPS WITH ENHANCED DIE STRENGTH AND A FABRICATION METHOD THEREOF

Solution composition for passivation layer, thin film transistor array panel, and manufacturing method for thin film transistor array panel

SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME

Solid-state imaging device, members for the same, and imaging system

Method for manufacturing a data carrier body for a portable data carrier and data carrier body

HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF

Thermogenerator comprising phase-change materials

Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor

Pins for semiconductor device

System And Method For Constructing Waffle Transistors

THICK WINDOW LAYER LED MANUFACTURE

Visual indicator for semiconductor chips for indicating mechanical damage

Molded power supply system having a thermally insulated component

Surface mount electronic component

Structure for mounting heat sink, and heat sink mounted using the structure

MOTHER BOARD AND FIXING MODULE THEREOF

Combiner box

METHOD AND APPARATUS FOR DE-EMBEDDING