Method of bonding carbon nanotubes

Methods for discretized processing and process sequence integration of regions of a substrate

Optical tandem photovoltaic cell panels

COOLING UNIT

3D inter-stratum connectivity robustness

Method and apparatus for determining an overlay error

System and method to thermally protect a transistor in an electric drive vehicle

HEAT DISSIPATION APPARATUS

Techniques for Impeding Reverse Engineering

Method for manufacturing semiconductor device using anisotropic etching

Layer alignment in FinFET fabrication

Semiconductor device having a reduced bit line parasitic capacitance and method for manufacturing the same

Vertical solid-state transducers having backside terminals and associated systems and methods

INTEGRATED CIRCUIT WITH FACE-TO-FACE BONDED PASSIVE VARIABLE RESISTANCE MEMORY AND METHOD FOR MAKING THE SAME

FinFET based one-time programmable device and related method

Electronic component cooling unit and power converting device

Light emitting device

Lighting module

Reduced phosphor lighting devices

System and method for a high retention module interface

Power module, method for manufacturing power module, and molding die

FASTENING MECHANISM FOR FIXING RADIATOR

High performance liquid cooled heatsink for IGBT modules

Position measurement system, lithographic apparatus and device manufacturing method

LED ARRAY CAPABLE OF REDUCING UNEVEN BRIGHTNESS DISTRIBUTION

Lighting device, display device and television device

DIE-CUT THROUGH-GLASS VIA AND METHODS FOR FORMING SAME

MOFSET mismatch characterization circuit

Packaging identical chips in a stacked structure

3D chip stack skew reduction with resonant clock and inductive coupling

3D integrated circuit stack-wide synchronization circuit

3D chip stack skew reduction with resonant clock and inductive coupling

Programming the behavior of individual chips or strata in a 3D stack of integrated circuits

Programming the behavior of individual chips or strata in a 3D stack of integrated circuits

MOFSET mismatch characterization circuit

Semiconductor devices with self-heating structures, methods of manufacture thereof, and testing methods

DC-DC converter

LIGHT EMITTING DEVICE PACKAGE, LIGHTING DEVICE AND LIGHTING SYSTEM COMPRISNG THE SAME

OLED tile for illumination

Method of manufacturing a metal housing part

SELECTIVE PLATING OF FRAME LID ASSEMBLY

Through silicon via keep out zone formation along different crystal orientations

Semiconductor device and method for forming the same

INTEGRATED CIRCUIT INCLUDING FRONT SIDE AND BACK SIDE ELECTRICAL INTERCONNECTS

Semiconductor device with buried electrode

Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board

Power module and manufacturing method thereof

Semiconductor device and method of fabricating the same

Semiconductor integrated circuit

Fuse

Semiconductor device with an amorphous semi-insulating layer, temperature sensor, and method of manufacturing a semiconductor device

ANODE-ILLUMINATED RADIATION DETECTOR

On-chip radiation dosimeter

Controlling the device performance by forming a stressed backside dielectric layer

Electrostatic discharge protection device and applications thereof

Capacitor and method of forming same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof for protecting metal-gate from oxidation

Semiconductor integrated circuit

Transistor with high electron mobility and inhomogeneous layer resistance of the guide channel

Light-emitting device

Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods

Lighting device

Light emitting diode module and method for manufacturing the same

Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism

LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE

Light-emitting device, light-emitting module, and lamp

Organic light-emitting display device and method of manufacturing the same

Semiconductor element and display device using the same

Solid state transducers with state detection, and associated systems and methods

Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism

High density gallium nitride devices using island topology

Semiconductor device and method for manufacturing the same

Display and method of manufacturing the same

Nanopillar E-fuse structure and process

Methods of forming structures with a focused ion beam for use in atomic force probing and structures for use in atomic force probing

Electrically measurable on-chip IC serial identifier and methods for producing the same

Integrated circuits with leakage current test structure

Solid state radiation transducers and methods of manufacturing

Etching liquid for a copper/titanium multilayer thin film

Radiological image detection apparatus

Heat dissipating device supporting apparatus

Method of manufacturing a metallized ceramic substrate

SUBSTRATE WITH SPRING TERMINAL AND METHOD OF MANUFACTURING THE SAME

Thermal management system for an aircraft avionics bay

HEAT DISSIPATION DEVICE

HEAT DISSIPATION DEVICE

Heat transfer bridge

HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING SAME

VAPOR CHAMBER STRUCTURE AND METHOD OF MANUFACTURING SAME

HEAT DISSIPATION DEVICE INCORPORATING HEAT SPREADER

HEAT PIPE MADE OF COMPOSITE MATERIAL AND METHOD OF MANUFACTURING THE SAME

HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF

Heat dissipation apparatus with heat pipe

Heat transfer system for aircraft structures

Method for fabricating camera module

METHOD FOR SEALING LIGHT ENGINE MODULE WITH FLIP-CHIP LIGHT EMITTING DIODE

Lead pin correction device and lead pin correction method

Space-saving high-density modular data pod systems and energy-efficient cooling systems

Method of manufacturing a heat transfer system for aircraft structures

Method for sealing package

Method and Kit For Depilation

Integrated circuit for preventing chip swapping and/or device cloning in a host device

Methods of on-chip memory partitioning and secure access violation checking in a system-on-chip

Systems and methods for distributing an aging burden among processor cores

Adaptive clocking scheme to accommodate supply voltage transients

Apparatus and method to update a default time interval based on process corner, temperature and voltage

Integrated circuit allowing to test a power management unit based on or more conditions and configuring the plurality of pins to operate in normal and test mode

Semiconductor device predictive dynamic thermal management

Proactive Power Management Using a Power Management Unit

Scalable and configurable system on a chip interrupt controller

Clock signal multiplication to reduce noise coupled onto a transmission communication signal of a communications device

Method and system for wafer level singulation

Electronics device capable of efficient communication between components with asyncronous clocks

Stacked MRAM device and memory system having the same

Vertically oriented semiconductor device and shielding structure thereof

Device for electric insulation of a conducting plane

Heat-dissipating device for electronic apparatus

LENS MODULE AND METHOD FOR MANUFACTURING THE SAME

Pattern inspection apparatus and pattern inspection method

Electrical fuse structure

Vertically oriented semiconductor device and shielding structure thereof

Monolithic microwave integrated circuit (MMIC) including air bridge coupler

Integrated circuit with an adaptable contact pad reconfiguring architecture

Power boosting circuit for semiconductor packaging

Integrated circuit with pre-heating for reduced subthreshold leakage

Wave clocking

Time-based apparatus and method to mitigate semiconductor aging effects

Semiconductor device and method for manufacturing the same

Methods of forming interconnects

Semiconductor device

Semiconductor structure and method of manufacturing

Methods of Forming a Non-Planar Cap Layer Above Conductive Lines on a Semiconductor Device

Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate

DIODE STRUCTURE

Integrated circuit devices and methods and apparatuses for designing integrated circuit devices

Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers

Vertically oriented inductor within interconnect structures and capacitor structure thereof

SIZE-FILTERED MULTIMETAL STRUCTURES

Low power/high speed TSV interface design

Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD

Lighting device

LIGHT-EMITTING DIODE STRUCTURE

High-voltage solid-state transducers and associated systems and methods

Crack stop structure and method for forming the same

Non-contact measurement of the dopant content of semiconductor layers

HEAT SINKING PLATE

HEAT SINK

HEAT DISSPATION DEVICE

Heat dissipation element with mounting structure

HEAT DISSIPATING MODULE SUPPORTING APPARATUS

Heat dissipation device

Heat dissipation unit with mounting structure

Heat dissipation device with mounting structure

THERMAL MODULE MOUNTING HOLDER

SOLDER BONDED BODY, METHOD OF PRODUCING SOLDER BONDED BODY, ELEMENT, PHOTOVOLTAIC CELL, METHOD OF PRODUCING ELEMENT AND METHOD OF PRODUCING PHOTOVOLTAIC CELL

Heat transfer system with integrated evaporator and condenser

Low clearance machined part mating system

Flexible and stretchable electronic systems for epidermal electronics

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD

Substrate wiring method and semiconductor manufacturing device

Power MOSFET contact metallization

Through silicon via layout

Methods of forming semiconductor devices having narrow conductive line patterns

Ultraviolet energy shield for non-volatile charge storage memory

Through substrate via with embedded decoupling capacitor

Semiconductor device and method of producing the same

Semiconductor thermocouple and sensor

Passivated nanoparticles

Centrifugal fan module, heat dissipation device having the same and electric device having the heat dissipation device

Methods of forming three dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates

Methods and systems for determining a critical dimension and overlay of a specimen

Integrated DRAM memory device

Semiconductor device

Power converting apparatus having improved electro-thermal characteristics

Film system for LED applications

Heat-dissipating module

Heat dissipation device and semiconductor device

Converter arrangement with an air cooling system

Contactless communications using ferromagnetic material

Semiconductor apparatus and substrate

Semiconductor device having a through-substrate via

SEMICONDUCTOR CHIP INCLUDING BUMP HAVING BARRIER LAYER, AND MANUFACTURING METHOD THEREOF

Methods of forming bulb-shaped trenches in silicon

Chip-component structure and method of producing same

Method of manufacturing decoupling MIM capacitor designs for interposers

Semiconductor-on-insulator (SOI) structures including gradient nitrided buried oxide (BOX)

3D memory array

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD THEREOF

Light emitting device and light emitting device package having the same

Method and apparatus for coupling light-emitting elements with light-converting material

LED PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR DEVICE

Light emitting device

Monitoring pad and semiconductor device including the same

Semiconductor device

Organic light emitting diode display

IMAGE PICK-UP APPARATUS

Piezoelectric fan and air cooling apparatus using the piezoelectric fan

FLAT HEAT PIPE

FASTENERS AND HEAT DISSIPATION DEVICES WITH THE FASTENERS

Curable composition, cured product, and method for using of curable composition

VERSATILE WORKPIECE REFINING

Interconnecting mechanism for 3D integrated circuit

Conductive vias in a substrate

GLASS SUBSTRATE FOR FORMING THROUGH-SUBSTRATE VIA OF SEMICONDUCTOR DEVICE

GLASS SUBSTRATE FOR FORMING THROUGH-SUBSTRATE VIA OF SEMICONDUCTOR DEVICE

Semiconductor device

Electronic Control Unit

COOLING A MULTI-CHIP ELECTRONIC MODULE

Printed electronics

Method for manufacturing passive optical components, and devices comprising the same

Semiconductor device

Integrated circuit

Solid state LED bridge rectifier light engine

Light-emitting device having fluorescent substance particles and spacer particles, and method for manufacturing the same

Low-K dielectric layer and porogen

SEMICONDUCTOR DEVICE COMPRISING VARIABLE-SIZED CONTACT, METHOD OF FORMING SAME, AND APPARATUS COMPRISING SAME

Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication

Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication

Implementing enhanced thermal conductivity in stacked modules

Layer structure with EMI shielding effect

Solid-state imaging apparatus and electronic apparatus

SEMICONDUCTOR DEVICE COMPRISING METAL GATE ELECTRODE STRUCTURES AND NON-FETS WITH DIFFERENT HEIGHT BY EARLY ADAPTATION OF GATE STACK TOPOGRAPHY

Semiconductor device having insulating film with different stress levels in adjacent regions and manufacturing method thereof

Silicone resin composition, encapsulating material, and light emitting diode device

Light-emitting diode mounted on intersected and discontinuous transparent conductive pattern layers and manufacturing method thereof

Light emitting package

Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate

Light emitting diode array and method for manufacturing the same

Apparatus and methods for de-embedding through substrate vias

MRAM with sidewall protection and method of fabrication

Heat conductive elastomer composition

Method and apparatus for controlling output of the solid-state imager in a barcode reader

METAL THIN SHIELD ON ELECTRICAL DEVICE

THERMOSTATIC CONTROL LED THERMAL MODULE

THERMAL SOLUTION WITH SPRING-LOADED INTERFACE

System for using active and passive cooling for high power thermal management

HEAT SINK WITH PROTECTIVE OUTER BUCKLING PLATE

Apparatus for manufacturing semiconductor devices

FLOW DISTRIBUTOR

Non-invasive leakage power device characterization of integrated circuits using device grouping and compressive sensing

Crystallinity evaluation method, crystallinity evaluation device, and computer software thereof

Integrated circuit with intra-chip and extra-chip RF communication

Method and system for forming conductive bumping with copper interconnection

Methods of forming graphene-containing switches

SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD FOR MANUFACTURING THE SAME

TCE compensation for package substrates for reduced die warpage assembly

Method of making thin-wafer current sensors

Adhesive Sheet

METHOD OF FORMING MICROSTRUCTURE, LASER IRRADIATION DEVICE, AND SUBSTRATE

Method for manufacturing interposer

Doped, passivated graphene nanomesh, method of making the doped, passivated graphene nanomesh, and semiconductor device including the doped, passivated graphene nanomesh

Semiconductor device having a vertical cavity surface emitting laser (VCSEL) and a protection diode integrated therein and having reduced capacitance to allow the VCSEL to achieve high operating speeds

Optoelectronic semiconductor chip

Method and system for flexible illuminated devices having edge lighting utilizing light active sheet material with integrated light emitting diode

System for lighting apparatus utilizing light active sheet material with integrated light emitting diode, window with lighting apparatus, conveyance with lighting apparatus, and method of providing lighting apparatus

STIFFNESS ENHANCEMENT OF ELECTRONIC SUBSTRATES USING CIRCUIT COMPONENTS

Cooling device installation using a retainer assembly

HEAT SPREADER FOR MULTI-CHIP MODULES

Liquid DIMM cooling device

Housing for encasing a tablet computer

Digital cameras with direct luminance and chrominance detection

Method and apparatus for verification of imaging systems

Semiconductor device and display device

Multilayer ceramic substrate and method for producing the same

ISOLATED POWER CONVERTER WITH MAGNETICS ON CHIP

ELECTRONIC DEVICE, OSCILLATOR, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Integrated circuit systems including vertical inductors

On-chip active decoupling capacitors for regulating voltage of an integrated circuit

High side switch

APPARATUS FOR DETECTING PATTERN ALIGNMENT ERROR

Standard cell circuit, semiconductor integrated circuit, and semiconductor integrated circuit device

Solid state lighting apparatus and methods of forming

Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment

Transformer of the balanced-unbalanced type

Die seal ring structure

Via structure

CONDUCTOR CONTACT STRUCTURE AND FORMING METHOD, AND PHOTOMASK PATTERN GENERATING METHOD FOR DEFINING SUCH CONDUCTOR CONTACT STRUCTURE

Method of fabricating dual damascene structures using a multilevel multiple exposure patterning scheme

Wafer-level chip scale package

Metal gate electrode of a field effect transistor

Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board

Hybrid copper interconnect structure and method of fabricating same

Multilayer metallization with stress-reducing interlayer

Semiconductor device

MINIATURIZATION ACTIVE SENSING MODULE AND METHOD OF MANUFACTURING THE SAME

N-channel and p-channel finFET cell architecture

N-channel and P-channel finFET cell architecture with inter-block insulator

Multiple well drain engineering for HV MOS devices

Semiconductor integrated circuit device with transistor and non-transistor regions

Light emitting device

Method of manufacturing light emitting device including light emitting element and wavelength converting member

Light emitting devices, systems, and methods of manufacturing

Light-emitting diode package and method for manufacturing the same

Wafer level LED package and method of fabricating the same

TRANSFER-BONDING METHOD FOR THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE ARRAY

Lighting device utilizing light active sheet material with integrated light emitting diode, disposed in seam and/or in low profile application

Wafer-level solid state transducer packaging transducers including separators and associated systems and methods

Silicon carbide semiconductor device