Display device comprising two display panels

Surface-mountable device

FLEXIBLE LIGHTING DEVICE INCLUDING A NANO-PARTICLE HEAT SPREADING LAYER

Capacitor and method for making same

Semiconductor device having an inter-layer via (ILV), and method of making same

Structure and method for FinFET SRAM

Complimentary metal-oxide-semiconductor (CMOS) with low contact resistivity and method of forming same

Methods for forming a semiconductor arrangement of fins having multiple heights and an alignment mark

Thin film interconnects with large grains

Apparatuses and methods including memory access in cross point memory

Stacked chip layout and method of making the same

Memory having memory cell string and coupling components

Semiconductor device and method for manufacturing the same

Memories and methods to provide configuration information to controllers

Display apparatus and methods

Seam healing of metal interconnects

Manufacturing method of a semiconductor device and method for creating a layout thereof

Memory Circuits and Routing of Conductive Layers Thereof

Wafer dicing using femtosecond-based laser and plasma etch

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Interconnects formed by a metal replacement process

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Light emitting apparatus, light emitting unit, display apparatus, electronic device and light emitting element

Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry

Semiconductor device and manufacturing method of the same

Semiconductor device

Fibrillated liquid crystal polymer powder, method of producing fibrillated liquid crystal polymer powder, paste, resin multilayer substrate, and method of producing resin multilayer substrate

Locking assembly for electronic tablet and other devices

Epitaxial structure and method for making the same

Non-volatile semiconductor memory device and manufacturing method thereof

Methods of forming structures

Stacked semiconductor device assembly in computer system

Method for producing heat-dissipating sheet having high thermal conductivity

Integrated circuit layout wiring for multi-core chips

Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system

Shaped phosphor to reduce repeated reflections

Power module for supporting high current densities

Electrically conductive laminate structures

MULTI-CHIP SELF ADJUSTING COOLING SOLUTION

Method of making a semiconductor component having through-silicon vias

Modulating metal interconnect surface topography

Interconnect structure and method of forming the same

Semiconductor package and method of manufacturing the same

Solid state lighting devices having improved color uniformity and associated methods

Self aligned active trench contact

Bonding sheet and manufacturing method thereof, and heat dissipation mechanism and manufacturing method thereof

Encapsulated microelectromechanical structure

Shock determination based on prior shocks

Compact laser device

Array of recessed access gate lines

Semiconductor device and method of producing semiconductor device

Semiconductor device packages with direct electrical connections and related methods

Self-aligned contacts

Thermal interface material with ion scavenger

Pulsed level shift and inverter circuits for GaN devices

OPTOELECTRONIC SEMICONDUCTOR CHIP

Light emitting device and light emitting device package

Semiconductor device and method of manufacturing the same

Semiconductor element and display device using the same

Display module and system applications

Semiconductor chip for sensing temperature and semiconductor system including the same

Etch stop layer in integrated circuits

Heat transfer device with fins defining air flow channels

PRINT HEAD MAINTENANCE

Ceramic antenna module and methods of manufacture thereof

Organic light emitting diode display device

Wafer-level light emitting diode package and method of fabricating the same

Light-emitting structure having a plurality of light-emitting structure units

Analog circuit and semiconductor device

Power FET with a resonant transistor gate

Semiconductor device

Line structure and a method for producing the same

Semiconductor device

Semiconductor devices having nonlinear bitline structures

Memory device interconnects and method of manufacture

Semiconductor device and manufacturing method thereof

Method for designing mask set, recording medium, template, and method for manufacturing template

Methods and apparatus for testing ISFET arrays

System and method for inspecting a wafer

CONTROLLED TRANSFORMATION OF NON-TRANSIENT ELECTRONICS

Thermoelectric conversion element and thermoelectric conversion module

Semiconductor device and method for manufacturing the same

Heat dissipation assembly and electronic device

ENCAPSULATION BARRIER STACK

Thermal management assembly

Method and apparatus for detection and identification of counterfeit and substandard electronics

Integrated multi-sensor module

Light tube and power supply circuit

Structures incorporating and methods of forming metal lines including carbon

Solid state lighting devices with improved contacts and associated methods of manufacturing

Semiconductor device and method for manufacturing the same

Semiconductor Chip Having Region Including Gate Electrode Features Formed In Part from Rectangular Layout Shapes on Gate Horizontal Grid and First-Metal Structures Formed In Part from Rectangular Layout Shapes on First-Metal Vertical Grid

High density organic bridge device and method

3D semiconductor device and structure

LED substrate with electrical connection by bridging

Thermal management system for an aircraft avionics bay

Solid-state imaging device

3D semiconductor device and structure

Image sensor for endoscopic use

Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same

Display device

Power gating for three dimensional integrated circuits (3DIC)

Illumination assembly, method of manufacturing the illumination assembly, and backlight module including the illumination assembly

Dissipating heat from an electronic device in a protective housing

3D semiconductor device and structure

Liquid crystal display device, semiconductor device, and electronic appliance

Process for nano graphene platelet-reinforced composite material

Heat-dissipating film, and its production method and apparatus

Gate tie-down enablement with inner spacer

Semiconductor chip having region including gate electrode features formed in part from rectangular layout shapes on gate horizontal grid and first-metal structures formed in part from rectangular layout shapes on at least eight first-metal gridlines of first-metal vertical grid

Semiconductor chip having region including gate electrode features of rectangular shape on gate horizontal grid and first-metal structures of rectangular shape on at least eight first-metal gridlines of first-metal vertical grid

Semiconductor Chip Having Region Including Gate Electrode Features of Rectangular Shape on Gate Horizontal Grid and First-Metal Structures of Rectangular Shape on First-Metal Vertical Grid

SEMICONDUCTOR APPARATUS

Dual-series varactor EPI

Light emitting device reflective bank structure

Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration

Feedthrough assemblies and methods of forming same

Heat dissipation module

Power switching system for ESC with array of thermal control elements

Interconnect structure

DIFFUSION BARRIER LAYER FORMATION

Semiconductor constructions; and methods for providing electrically conductive material within openings

Memory devices and methods for managing error regions

Imaging device, manufacturing device, and manufacturing method

LED module with hermetic seal of wavelength conversion material

3DIC interconnect apparatus and method

Semiconductor device structures

IMPLANT DEVICE AND METHOD OF MAKING THE SAME

Array substrate for display device and manufacturing method thereof

Self-aligned interconnection for integrated circuits

Electronic circuit comprising electrically insulating trenches

Apparatuses and methods including memory access in cross point memory

Apparatuses and related methods for staggering power-up of a stack of semiconductor dies

Microfabricated ultrasonic transducers and related apparatus and methods

Waterproof stretchable optoelectronics

Light-emitting device and manufacturing method thereof

Substrate for use in manufacturing display device and method for forming element on substrate

Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture

Semiconductor unit, method of manufacturing the same, and electronic apparatus

Back-to-back solid state lighting devices and associated methods

Network with integrated passive device and conductive trace in packaging substrate and related modules and devices

Phase changing on-chip thermal heat sink

Magnetic trap for cylindrical diamagnetic materials

Semiconductor wafer device and manufacturing method thereof

Apparatuses for bonding semiconductor chips

Method of inspecting electrode provided in gas sensor element

POWER POLE ISOLATED HEAT PIPE INVERTER ASSEMBLY

Wafer-level light emitting diode package and method of fabricating the same

Method of forming a high electron mobility transistor

Capacitor having multiple graphene structures

Optical writing device, image forming device, and manufacturing method of optical writing device

Static random access memory (SRAM) device

Three dimensional integrated circuit

Overlay mark

Field-effect transistor, method of manufacturing the same, and radio-frequency device

Semiconductor structure and method of making the same

Pedestal surface for MOSFET module

LOW-COST PACKAGING FOR FLUIDIC AND DEVICE CO-INTEGRATION

Substrate dividing method

Display panel and method of manufacturing the same

Display device and electronic device

Solid state light source device, automotive lighting using same, image display device, and drive method for solid state light source device

Planar cavity MEMS and related structures, methods of manufacture and design structures

Adhesive and method of encapsulating organic electronic device using the same

Circuit for preventing static electricity and display device having the same

Layout construction for addressing electromigration

Solid state lighting device with different illumination parameters at different regions of an emitter array

Voltage compensated switch stack

Integrated circuit devices

Mitigating pattern collapse

Dynamic beam aperture control to reduce radiation dose using collimator

Implantable electrode array assembly with an array substrate, electrodes and packaged integrated circuits

Protective encasement for a mobile computing device

Solar photovoltaic waterless soiling monitoring systems and methods

Tunable breakdown voltage RF FET devices

Semiconductor memory device with a three-dimensional stacked memory cell structure

Semiconductor devices

Method of forming three-dimensional integrated circuit having ESD protection circuit

Semiconductor device including dummy conductive cells

Semiconductor Device with Multi Level Interconnects and Method of Forming the Same

Method of forming an interconnect structure

Vehicular camera and lens assembly and method of manufacturing same

Optoelectronic component and method for the production thereof

Semiconductor devices with shaped portions of elevated source/drain regions

Integrated circuit heat dissipation using nanostructures

Threshold adjustment for quantum dot array devices with metal source and drain

Solid-state imaging device, method for manufacturing same, and electronic device

3D semiconductor device and structure

Method of fabricating a semiconductor package

Ultra high performance interposer

Heat dissipation assembly

Tunable breakdown voltage RF FET devices

Metal oxide film and method for forming metal oxide film

Field-effect semiconductor device having a heterojunction contact

Semiconductor device and method of manufacturing the same

Semiconductor device and IO-cell

Package substrate and method of fabricating the same

Method And System For Improved Matching For On-Chip Capacitors

Chip capacitor, circuit assembly, and electronic device

LED lamps with improved quality of light

Semiconductor structures provided within a cavity and related design structures

Planar cavity MEMS and related structures, methods of manufacture and design structures

LIQUID SUBMERGED, HORIZONTAL COMPUTER SERVER RACK AND SYSTEMS AND METHOD OF COOLING SUCH A SERVER RACK

Semiconductor integrated circuit device and a method of manufacturing the same

Semiconductor device

Method of forming stacked trench contacts and structures formed thereby

Semiconductor device

Semiconductor structure

Method for making semiconductor device with stacked analog components in back end of line (BEOL) regions

SELF-ENCLOSED ASYMMETRIC INTERCONNECT STRUCTURES

Ground via clustering for crosstalk mitigation

Encapsulation of electronic components in polymer materials

Adaptive clocking scheme

Wafer-level solid state transducer packaging transducers including separators and associated systems and methods

Non-contact measurement of a stress in a film on a substrate

Sidewall passivation for HEMT devices

Multilevel template assisted wafer bonding

Three state buffer, another buffer coupled to ends of tsv

Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components

Heat transfer system and method incorporating tapered flow field

Appendage mountable electronic devices conformable to surfaces

Wiring board manufacturing method and wiring board manufacturing device

Insulating ceramic paste, ceramic electronic component, and method for producing the same

Extremely stretchable electronics

Light emitting device package and lighting system including the same

Copper etching integration scheme

Stacked multilayer structure and manufacturing method thereof

Semiconductor device with multi-layer metallization

Conductive structures in semiconductor devices

Solid state sensor for metal ion detection and trapping in solution

Systems and methods for cooling of power electronic devices

Cavities containing multi-wiring structures and devices

Light sources utilizing segmented LEDs to compensate for manufacturing variations in the light output of individual segmented LEDs

Optical cavity including a light emitting device and wavelength converting material

Light-emitting device

Integrated circuit heat dissipation using nanostructures

Semiconductor device and method for manufacturing the same

Reduction of stress in via structure

Reduction of stress in via structure

Robot arm and robot

Mounting apparatus, for mounting at least one heat dissipating electrical device, optionally including a heat sink body for solid, gas and fluid heat exchange, and circuit board assembly providing interface between circuits

Method for producing semiconductor device

Light-emitting device

Semiconductor integrated circuit device

Semiconductor constructions, and semiconductor processing methods

Hybrid bonding with through substrate via (TSV)

Semiconductor device comprising a die seal including long via lines

Apparatus and method for decapsulating packaged integrated circuits

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

Illumination apparatus confining light by total internal reflection and methods of forming the same

Light engine and lighting apparatus with first and second groups of LEDs

Pads and pin-outs in three dimensional integrated circuits

Method of fabricating a transistor having a drain pad with capping and silicide layers

3D semiconductor device and structure

Packages with stacked dies and methods of forming the same

Integrated package assembly for switching regulator

Feature fill with nucleation inhibition

Semiconductor device and formation thereof

Doping control of metal nitride films

Semiconductor structure with integrated passive structures

Cooling system for a computer system

Exposed-die mold package for a sensor and method for encapsulating a sensor that interacts with the environment

Thermal control process for a multijunction electronic power device and corresponding electronic power device

DECOUPLING ARRANGEMENT

Solid state lighting devices having improved color uniformity and associated methods

Method of producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Method for manufacturing insulated gate field effect transistor

Tunable breakdown voltage RF FET devices

Body-bias voltage routing structures

Apparatus and method of three dimensional conductive lines

Lead frame and the method to fabricate thereof

Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces

Vertical exhaust duct for electronic equipment enclosure

Sealing sheet, member for electronic devices, and electronic device

Integrated colour LED micro-display

Semiconductor device and manufacturing method thereof

IE type trench gate IGBT

Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods

Three-dimensional semiconductor memory device and method of fabricating the same

Semiconductor device having features to prevent reverse engineering

Electrically conductive laminate structures

Through vias and methods of formation thereof

Tunable inductor arrangement, transceiver, method and computer program

Automatic device detection and connection verification

Planar cavity MEMS and related structures, methods of manufacture and design structures

Encapsulated electronic circuit

Isolating electric paths in semiconductor device packages

Integrated circuits having parallel conductors and their formation

Interconnect Structure That Avoids Insulating Layer Damage and Methods of Making the Same

Top port multi-part surface mount MEMS microphone

Optoelectronic semiconductor component

Body contact layouts for semiconductor structures

Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method

Method Of Fabricating A Semiconductor Wafer Including A Through Substrate Via (TSV) And A Stepped Support Ring On A Back Side Of The Wafer

Methods of forming structures and methods of decreasing defect density

Planar cavity MEMS and related structures, methods of manufacture and design structures

Light-emitting dies incorporating wavelength-conversion materials and related methods

Method for expanding spacings in light-emitting element array

Semiconductor device and method of forming vertical structure