Method of manufacturing a semiconductor device having an active region and dummy patterns

Reprogrammable fuse structure and method

WIRING STRUCTURE IN A SEMICONDUCTOR DEVICE, METHOD OF FORMING THE WIRING STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD FOR A SOLID-STATE IMAGE PICKUP DEVICE

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST

Liquid barrier and method for making a liquid barrier

Semiconductor integrated circuit

Optical converter system for (W)LEDs

CIRCUIT SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Electrical circuit component carrier

Substrate, a method of measuring a property, an inspection apparatus and a lithographic apparatus

Solid-state image pickup device and camera

Digital cameras with direct luminance and chrominance detection

Electronic communications device with antenna and electromagnetic shield

METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE

Die having embedded circuitry with test and test enable circuitry

Lighting system with thermal management system

Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME

Method of fabricating dual damascene structures using a multilevel multiple exposure patterning scheme

METAL ELECTRODE AND SEMICONDUCTOR ELEMENT USING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor Device with Vias Having More Than One Material

IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch

Semiconductor device and method of forming IPD in fan-out level chip scale package

Microelectronic package assembly, method for disconnecting a microelectronic package

INTEGRATED CIRCUIT PACKAGING SYSTEM INCLUDING NON-LEADED PACKAGE

CIRCUIT MODULE, ELECTRONIC DEVICE INCLUDING THE SAME, AND CIRCUIT MODULE MANUFACTURING METHOD

Shielding structure for transmission lines

Method of manufacturing a semiconductor integrated circuit device

Sub-wavelength segmentation in measurement targets on substrates

Method and electronic device for a simplified integration of high precision thinfilm resistors

Semiconductor device and semiconductor device fabrication

3D integration of a MIM capacitor and a resistor

Semiconductor integrated circuit device

Methods of forming an electrically conductive buried line and an electrical contact thereto and methods of forming a buried access line and an electrical contact thereto

Semiconductor device and manufacturing method thereof

Interconnection structure of three-dimensional semiconductor device

Integrated circuits including multi-gate transistors locally interconnected by continuous fin structure and methods for the fabrication thereof

Semiconductor light emitting device and method for manufacturing same

LED ARRAY GRID, METHOD AND DEVICE FOR MANUFACTURING SAID GRID AND LED COMPONENT FOR USE IN THE SAME

Solid state light sheet or strip having cavities formed in top substrate

Solid state light sheet having wide support substrate and narrow strips enclosing LED dies in series

GROWTH OF MULTI-JUNCTION LED FILM STACKS WITH MULTI-CHAMBERED EPITAXY SYSTEM

Semiconductor integrated circuit device, design method, design apparatus, and program

Optoelectronic Semiconductor Body and Method for Producing an Optoelectronic Semiconductor Body

Thermal interface materials including thermally reversible gels

Charged particle beam apparatus

Lead-free solder alloy having reduced shrinkage cavities

Apparatus for detecting pattern alignment error

Heat pipe with micro-pore tube array and heat exchange system employing the heat pipe

COOLING MEMBER, MANUFACTURING METHOD AND APPARATUS THEREOF

SYSTEM AND METHOD FOR ENHANCED HEAT TRANSFER USING NANOPOROUS TEXTURED SURFACES

Nanoscale High-Aspect-Ratio Metallic Structure and Method of Manufacturing Same

Press apparatus and method for manufacturing semiconductor device

Method and system for providing process tool correctables using an optimized sampling scheme with smart interpolation

Electronic circuit and communication functionality inspection method

Method and apparatus providing air-gap insulation between adjacent conductors using nanoparticles

Method for making via interconnection

Method of making a semiconductor device having a conductive particle on an electric pad

Method of processing backside copper layer for semiconductor chips

Substrate treatment method

POWER CONVERTER

Electronic apparatus

Electronic substrate device

Cooling structure of electronic device

Metal-on-metal capacitor with diagonal feedline

High-frequency device and wireless IC device

Semiconductor device including a bootstrap diode, high side power drive circuit, low side power drive circuit, and control circuit for controlling a high side power device and low side power device

Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit

Imaging unit and imaging device

Wireless interconnect for an integrated circuit

SUBSTRATE INTER-TERMINAL VOLTAGE SENSING CIRCUIT

Fuse set and semiconductor integrated circuit apparatus having the same

Method and device for driving the frequency of a clock signal of an integrated circuit

Semiconductor device

Inverted magnetic isolator

LED ILLUMINATION DEVICE

Light emitting device with molded wavelength converting layer

Manufacturing method of aluminum-diamond composite

Methods for multi-wire routing and apparatus implementing same

Semiconductor device including contact plug and method of manufacturing the same

Semiconductor structure having an air-gap region and a method of manufacturing the same

Method of fabricating a conductive post on an electrode

Semiconductor device and method of patterning resin insulation layer on substrate of the same

Apparatus and method for defining laser cleave alignment

Method of manufacturing semiconductor device

Method of embedding passive component within via

ELECTRONIC DEVICE COMPRISING A PLURALITY OF ELECTRONIC COMPONENTS LAID DOWN ON A SUBSTRATE AND ASSOCIATED INFRARED SENSOR

Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry

Contact formation method, semiconductor device manufacturing method, and semiconductor device

Semiconductor integrated circuit device and a method of manufacturing the same

Structure of light emitting diode and method to assemble thereof

Light emitting device, light emitting device package, and lighting system

Radiation emitting body and method for producing a radiation-emitting body

Solid state light strips containing LED dies in series

Solid state light sheet or strip having cavities formed in bottom substrate

LIGHT EMITTING DIODE ASSEMBLY HAVING IMPROVED LIGHTING EFFICIENCY

ELECTRODE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Termination structure with multiple embedded potential spreading capacitive structures for trench MOSFET and method

ALUMINUM ALLOY FILM FOR DISPLAY DEVICE, DISPLAY DEVICE, AND SPUTTERING TARGET

Polysilicon control etch-back indicator

SELF ASSEMBLED NANO DOTS (SAND) AND NON-SELF ASSEMBLED NANO-DOTS (NSAND) DEVICE STRUCTURES AND FABRICATION METHODS THEREOF TO CREATE SPACERS FOR ENERGY TRANSFER

Thermoelectric device and method of forming the same, temperature sensing sensor, and heat-source image sensor using the same

Multilayer wiring substrate, and method of manufacturing the same

Heat dissipation structure having combined cooling fins

Sheet having high thermal conductivity and flexibility

Heat Dissipation Apparatus for Data Center

Heat exchange structure and cooling device comprising such a structure

Heat exhaustion structure for heat dissipating device

HEAT DISSIPATION APPARATUS FOR DATA CENTER

PHOTOVOLTAIC DEVICE AND MANUFACTURING METHOD FOR A PHOTOVOLTAIC DEVICE

Heat-dissipating device for supplying cold airflow

Heat-dissipating device for supplying cold airflow

Method for mounting fins onto annular seat

Device for use in photovoltaic module manufacture

METHOD FOR PRODUCING SILICONE MOULDED BODIES FROM LIGHT-CURABLE SILICONE MIXTURES

Chip-stacked semiconductor device and manufacturing method thereof

Methods for forming interconnect structures for integration of multi-layered integrated circuit devices

Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore

Solid state light sheet for general illumination

Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate

Memory dies, stacked memories, memory devices and methods

PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

Fixing device and heat sink assembly using the same

Power semiconductor device adaptive cooling assembly

SEMICONDUCTOR APPARATUS HAVING SEMICONDUCTOR MODULE COOLED BY HEAT SINKS WHICH HAVE INCREASED STRENGTH TOGETHER WITH INCREASED THERMAL MASS

Electronic gaming machine interface system

Power conversion apparatus

Power conversion apparatus

Power conversion apparatus

ESD Protection Integrated at System Level

Integrated circuit provided with a protection against electrostatic discharges

Semiconductor wafer alignment markers, and associated systems and methods

SUPERSENSITIZATION OF DEFECT INSPECTION METHOD

Camera module with molded tape flip chip imager mount and method of manufacture

METHOD OF MANUFACTURING PACKAGE AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR

Semiconductor integrated circuit

Modulized LED apparatus with enhanced heat dissipation

COMPRESSION MOLDING METHOD AND COMPRESSION MOLDING APPARATUS

Chip-stacked semiconductor and manufacturing method thereof

Chip package and method for forming the same

Silicon wafer for semiconductor with powersupply system on the backside of wafer

Semiconductor substrate, semiconductor device, and manufacturing methods thereof

Methods for double-patterning-compliant standard cell design

Interconnect pattern for transceiver package

Conductive pillar structure for semiconductor substrate and method of manufacture

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE

Pillar structure having a non-planar surface for semiconductor devices

Manufacturing of a device including a semiconductor chip

Surface Preparation of Die for Improved Bonding Strength

Electromigration immune through-substrate vias

Structure and method for making crack stop for 3D integrated circuits

RADIATION DETECTOR MODULE

Floating body field-effect transistors, and methods of forming floating body field-effect transistors

Electronic device including a buried insulating layer and a vertical conductive structure extending therethrough and a process of forming the same

Methods of forming contact structures including alternating metal and silicon layers and related devices

Light emitting device, light emitting device package and lighting system

Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination

LIGHT EMITTING DIODE ILLUMINATING APPARATUS WITH SAME-TYPE LIGHT EMITTING DIODES

Solid state light sheet for general illumination having metal interconnector through layer for connecting dies in series

Solid state light sheet for general illumination having substrates for creating series connection of dies

SiC semiconductor device and method of manufacturing the same

High voltage high package pressure semiconductor package

Silicon carbide semiconductor

Methods of forming structures with a focused ion beam for use in atomic force probing and structures for use in atomic force probing

Light emitting diode device having uniform current distribution

III-nitride light emitting device including porous semiconductor

LED having current spreading layer

OPTICAL SENSING DEVICE WITH ANTI-STATIC MEMBER

SPUTTERING TARGET FOR FORMING THIN FILM TRANSISTOR WIRING FILM

Arrangement for energy conditioning

Interconnect pattern for high performance interfaces

HEAT CONDUCTING SHEET, MANUFACTURING METHOD THEREOF, AND HEAT RADIATOR THAT UTILIZES THE SAME

Heat Sink For Dissipating A Thermal Load

Cooling structure, electronic device using same, and cooling method

HEAT EXCHANGER

METHOD OF MANUFACTURING A STRUCTURE COMPRISING A SUBSTRATE AND A LAYER DEPOSITED ON ONE OF ITS FACES

TEMPERATURE CONDITIONING SYSTEM METHOD TO OPTIMIZE VAPORIZATION APPLIED TO COOLING SYSTEM

PRESS FITTING METHOD FOR HEAT PIPE AND HEAT SINK

Method for sealing edges of vapor chamber

Method of controlling semiconductor device fabrication

High Sensitivity Real Time Profile Control Eddy Current Monitoring System

Electronic component embedded connector, and method and device for manufacturing the same

High Sensitivity Real Time Profile Control Eddy Current Monitoring System

Method for forming vias in a substrate

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device with a barrier film

Method for reducing dielectric overetch when making contact to conductive features

Method for manufacturing solid-state imaging device

LED packaging using injection molding method

Chip ID applying method suitable for use in semiconductor integrated circuit

Carbon Nanotube Arrays as Thermal Interface Materials

Device and Method for Inert Gas Cure for Leadframe or Substrate Strips

System and method for wireless communication in a backplane fabric architecture

Heat-assisted magnetic recording head with convergent lens

ELECTROMECHANICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME

Electric power converter

Processes for enhanced 3D integration and structures generated using the same

Mobile terminal

Semiconductor power module, inverter/converter including the same, and method of manufacturing a cooling jacket for semiconductor power module

INDUCTOR FORMED ON A SEMICONDUCTOR SUBSTRATE

Radio frequency switch circuit

Output circuit of semiconductor apparatus having two different types of decoupling capacitors

Radio frequency switch circuit

Complementary metal oxide semiconductor devices

System for heat conduction between two connectable members

Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material

SEMICONDUCTOR DEVICES INCLUDING AN INTERCONNECTION PATTERN AND METHODS OF FABRICATING THE SAME

Semiconductor device including process monitoring pattern having overlapping input/output pad array area

Stress buffer structures in a mounting structure of a semiconductor device

Substrate processing apparatus and method of manufacturing semiconductor device

SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Electrically programmable fuse and fabrication method

Semiconductor IC having electrical fuse capable of preventing thermal diffusion

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

Backside illuminated sensor and manufacturing method thereof

Semiconductor device and method for manufacturing the same

NEUTRON SENSOR WITH THIN INTERCONNECT STACK

Ring power gating with distributed currents using non-linear contact placements

Semiconductor device with gate stack structure

Radiation-emitting semiconductor body with carrier substrate and method for the production thereof

Power surface mount light emitting die package

Power surface mount light emitting die package

Power surface mount light emitting die package

Light emitting device package having dielectric pattern on reflective layer

Semiconductor lighting module package

Reflection Mode Wavelength Conversion Material for Optical Devices Using Non-Polar or Semipolar Gallium Containing Materials

Multifunctional tape

LIGHT EMITTING DIODE WITH BONDED SEMICONDUCTOR WAVELENGTH CONVERTER

Semiconductor light emitting device and image forming apparatus

Light emitting device package, method of manufacturing the same, and lighting system

Optoelectronic device array

Display device

Manufacturing method of thin film and metal line for display using the same, thin film transistor array panel, and method for manufacturing the same

Diamond SOI with thin silicon nitride layer and related methods

Circuit architecture for the parallel supplying during electric or electromagnetic testing of a plurality of electronic devices integrated on a semiconductor wafer

Nanotube array light emitting diodes

SYSTEM FOR SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS

SUBSTRATE FOR MOUNTING ELEMENT AND PROCESS FOR ITS PRODUCTION

Printed compatible designs and layout schemes for printed electronics

Heat dissipation apparatus with coarse surface capable of intensifying heat transfer

SOLAR CELL ASSEMBLY WITH SOLDER LUG

Heat sink

Metal wiring structure for integration with through substrate vias

Establishing a wireless communications bus and applications thereof

Methods of forming wiring structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of forming semiconductor device having contact plug

Semiconductor structure and method of manufacturing same

Semiconductor structure formed without requiring thermal oxidation

Integrated semiconductor substrate structure using incompatible processes

Dual carrier for joining IC die or wafers to TSV wafers

Light shield for CMOS imager

Method of fabricating semiconductor device

OPERATING TEMPERATURE MEASUREMENT FOR AN MOS POWER COMPONENT, AND MOS COMPONENT FOR CARRYING OUT THE METHOD

LED MODULE AND BACKLIGHT UNIT HAVING THE SAME

Light sources utilizing segmented LEDs to compensate for manufacturing variations in the light output of individual segmented LEDs

Quantum Dot Wavelength Conversion for Optical Devices Using Nonpolar or Semipolar Gallium Containing Materials

Omni-directional and multi-directional light-emitting diode (LED) lamp designs with multiple discrete LEDs on multiple facets

ELECTRONIC DEVICE

Integrated antenna and chip package and method of manufacturing thereof

Antenna arrangement for a chip card

Semiconductor integrated circuit and electronic device

Polychromatic electronic display device with electroluminescent screen

Power conversion apparatus for vehicle use

Gold-tin-indium solder for processing compatibility with lead-free tin-based solder

SEMICONDUCTOR CHIP, SEAL-RING STRUCTURE AND MANUFACTURING PROCESS THEREOF

Method of fabricating an integrated circuit package

Semiconductor device and manufacturing method thereof

Imaging module, fabricating method therefor, and imaging device

Semiconductor Device and Method of Fabricating the Same

CMOS transistor, semiconductor device including the transistor, and semiconductor module including the device

Charge-balance power device comprising columnar structures and having reduced resistance, and method and system of same

LIGHT EMITTING DEVICE PACKAGE

Luminous element

Light emitting device with encapsulant formed with barriers and light emitting device package having the same

Solid state light sheet using thin LEDs for general illumination

Insulated gate field effect transistor

Semiconductor apparatus and fabrication method of the same

Optoelectronic device based on nanowires and corresponding processes

Interconnect structure employing a Mn-group VIIIB alloy liner

Vortical boiling phenomenon based water cooling block

METHOD FOR FLATTENING HEAT DISSIPATING TUBE AND DEVICE FOR PERFORMING THE SAME

COOLING APPARATUS

Layout determining for wide wire on-chip interconnect lines

Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Method for manufacturing semiconductor device

Through silicon via lithographic alignment and registration

Standard cell architecture and methods with variable design rules

Manufacturing process for solid state lighting device on a conductive substrate

Workpiece breakage prevention method and apparatus

CERAMIC ASSEMBLED BOARD, METHOD OF MANUFACTURING THE SAME, CERAMIC SUBSTRATE AND CERAMIC CIRCUIT SUBSTRATE

Molecular self-assembly in substrate processing