212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Optical semiconductor sealing resin composition and optical semiconductor device using same
#16202LIGHT EMITTING DIODE STRUCTURE, A LAMP DEVICE AND A METHOD OF FORMING A LIGHT EMITTING DIODE STRUCTURE
#16203Semiconductor device and method for producing the same
#16204INTEGRATED CIRCUIT WITH EMBEDDED RFID
#16205Secured identification document
#16206Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures
#16207BARRIER INTEGRATION SCHEME FOR HIGH-RELIABILITY VIAS
#16208Electronic apparatus, image display apparatus and method of cooling electronic apparatus
#16209POTTED ELECTRONIC COMPONENT AND METHOD FOR ITS MANUFACTURE
#16210Heat dissipating substrate and method of manufacturing the same
#16211Hermetically sealed housing for electronic components and manufacturing method
#16212Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate
#16213Heat dissipation apparatus
#16214HEAT-DISSIPATING DEVICE
#16215Cooling Module
#16216HEAT DISSIPATION MODULE
#16217Heat removal in compact computing systems
#16218MANUFACTURING METHOD, FINISHED PRODUCT AND FIXTURE OF COPLANAR EVAPORATORS OF MULTIPLE HEAT PIPES
#16219Method of making cold chassis for electronic modules
#16220Chassis with distributed jet cooling
#16221Thermal management with electrocaloric effect layer
#16222T-coil network design for improved bandwidth and electrostatic discharge immunity
#16223Semiconductor System Integrated With Through Silicon Vias for Nerve Regeneration
#16224Analyte Monitoring Device and Methods of Use
#16225System and method of silicon switched power delivery using a package
#16226Metallurgical clamshell methods for micro land grid array fabrication
#16227Device and methodology for reducing effective dielectric constant in semiconductor devices
#16228Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow
#16229Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#16230Backside-illuminated imaging device and manufacturing method of the same
#16231LEAD-FREE TIN PLATED MEMBER AND METHOD OF FORMING PLATING LAYER
#16232Remote cooling by combining heat pipe and resonator for synthetic jet cooling
#16233Integrated circuit die stacks having initially identical dies personalized with switches and methods of making the same
#16234Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same
#16235Multilayer wiring board
#16236Heat dissipation apparatus for electronic device
#16237Electronic device assembly with heat dissipation device
#16238Heat dissipation device
#16239DRIVER MODULE STRUCTURE
#16240Electronic device with heat dissipating structure
#16241Computer system with heat sink
#16242Fault protector for opto-electronic devices and associated methods
#16243PIXEL AND IMAGE PROCESSING DEVICES HAVING THE SAME
#16244Semiconductor device with thermal fault detection
#16245Crosstalk suppression in wireless testing of semiconductor devices
#16246Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
#16247Intermittent cyclic permanent illuminating LED lamp
#16248MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE COMPONENT
#16249Air gap interconnect structures and methods for forming the same
#16250Capping of copper interconnect lines in integrated circuit devices
#16251Via structures and semiconductor devices having the via structures
#16252SEMICONDUCTOR DEVICE
#16253Integrated Circuit
#16254Redistribution layer enhancement to improve reliability of wafer level packaging
#16255Graphene nanoplatelet metal matrix
#16256Chip package structure and method for fabricating the same
#16257Metal oxide semiconductor (MOS)-compatible high-aspect ratio through-wafer vias and low-stress configuration thereof
#16258Semiconductor device and manufacturing method
#16259Vertical metal insulator metal capacitor
#16260Metal capacitor design for improved reliability and good electrical connection
#16261FUSE OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
#16262Seal ring structures with reduced moisture-induced reliability degradation
#16263Method for producing field effect transistors with a back gate and semiconductor device
#16264Anodic bondable porcelain and composition for the porcelain
#16265Semiconductor device having an anti-fuse element and a transistor with a pocket region
#16266Field-effect transistor with compositionally graded nitride layer on a silicaon substrate
#16267Semiconductor device manufacturing method thereof
#16268Silicone based reflective underfill and thermal coupler
#16269Optoelectronic module
#16270Electro-mechanical transducer, an electro-mechanical converter, and manufacturing methods of the same
#16271Digital camera with multiple pipeline signal processors
#16272Fabricating process of circuit substrate
#16273Multilayer printed wiring board
#16274THREE-LAYERED COLD/HOT CONTROLLER
#16275Heat Dissipating device
#16276Cooling apparatus for semiconductor element
#16277Circuit Board Forming Diffusion Bonded Wall of Vapor Chamber
#16278HEAT SINK
#16279Heatsink with flexible base and height-adjusted cooling fins
#16280Heat dissipation device
#16281Fastening device and heat dissipation apparatus using the same
#16282METHOD FOR PRODUCING A CURVED CIRCUIT
#16283VAPOR CHAMBER AND MANUFACTURING METHOD THEREOF
#16284Planar electrical power electronic modules for high-temperature applications, and corresponding production methods
#16285Semiconductor integrated circuit and method of designing semiconductor integrated circuit
#16286Wiring forming system and wiring forming method for forming wiring on wiring board
#16287Isocyanuric ring-containing polysiloxane having vinyl groups at the terminals
#16288EPOXY RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC PART
#16289Dual inductor circuit for multi-band wireless communication device
#16290Method for fabricating semiconductor device
#16291Thermoelectric 3D cooling
#16292Edge protection seal for bonded substrates
#16293AXIAL FAN
#16294NAND flash memory devices having wiring with integrally-formed contact pads and dummy lines and methods of manufacturing the same
#16295AND-type one time programmable memory cell
#16296ILLUMINATION APPARATUS
#16297Card-type peripheral apparatus
#16298LOCKING DEVICE AND HEAT DISSIPATION DEVICE USING THE SAME
#16299HEATSINKS OF THERMALLY CONDUCTIVE PLASTIC MATERIALS
#16300Heat dissipation device for electronic device assembly
#16301HEAT DISSIPATION APPARATUS WITH FOOL-PROOF MECHANISM AND ELECTRONIC DEVICE INCORPORATING THE SAME
#16302Heat exchanger device and method for heat removal or transfer
#16303MULTILAYER STRUCTURE, CAPACITOR INCLUDING THE MULTILAYER STRUCTURE AND METHOD OF FORMING THE SAME
#16304Semiconductor light emitting device and backlight source, backlight source system, display device and electronic device using the same
#16305Semiconductor device with feedback control
#16306Programmable RF array
#16307Clocking architecture in stacked and bonded dice
#16308SEMICONDUCTOR DEVICE FORMED ON A SOI SUBSTRATE
#16309Method for encapsulating the edge of a flexible sheet
#16310Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device
#16311Creation of vias and trenches with different depths
#16312Methods for discretized formation of masking and capping layers on a substrate
#16313AUTOMATED SHORT LENGTH WIRE SHAPE STRAPPING AND METHODS OF FABRICTING THE SAME
#16314Semiconductor device and method of manufacture thereof
#16315Barrier layer for copper interconnect
#16316Semiconductor device and method of fabricating the same
#16317Mechanisms for forming copper pillar bumps
#16318PILLAR BUMP WITH BARRIER LAYER
#16319Post passivation interconnect with oxidation prevention layer
#16320Robust joint structure for flip-chip bonding
#16321VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS
#16322SEMICONDUCTOR DEVICE AND ARRANGEMENT METHOD THEREOF
#16323Three-terminal antifuse structure having integrated heating elements for a programmable circuit
#16324FUSE BOX FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
#16325SEMICONDUCTOR MEMORY DEVICE
#16326Electrical fuse structure and method of formation
#16327Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same
#16328LIGHT-RECEIVING DEVICE AND METHOD OF MANUFACTURING THE SAME
#16329Method for forming semiconductor fuses in a semiconductor device comprising metal gates
#16330Lateral double-diffused metal oxide semiconductor
#16331Substrate structures including buried wiring, semiconductor devices including substrate structures, and method of fabricating the same
#16332Electrostatic protection device
#16333Support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device
#16334Light emitting device package and method for manufacturing the same
#16335Semiconductor light converting construction
#16336Light emitting diode with thin multilayer phosphor film
#16337Monolithic, optoelectronic semiconductor body and method for the production thereof
#16338Light converting construction
#16339Semiconductor device and a method of manufacturing the same
#16340Paper including semiconductor device and manufacturing method thereof
#16341Semiconductor-based sub-mounts for optoelectronic devices with conductive paths
#16342Semiconductor package, method of evaluating same, and method of manufacturing same
#16343Semiconductor device
#16344Miniature housing and support arrangement having at least one miniature housing
#16345Printed circuit board structure
#16346Low-resistance conductive pattern structures and methods of fabricating the same
#16347Substrate anchor structure and method
#16348Heat radiating structure and method for manufacturing the same
#16349PROTECTIVE CAP FOR COATED HEAT SINK AND HEAT SINK MODULE HAVING THE SAME
#16350LIQUID COOLING DEVICE
#16351Heat Dissipating Device And Heat Dissipating Fin
#16352FLAT HEAT PIPE WITH HOOK CAPILLARY TISSUE
#16353HEAT DISSIPATING CAVITY OF LOOPED HEAT PIPE
#16354HEAT DISSIPATING CAVITY
#16355HEAT RADIATING DEVICE AND MANUFACTURING METHOD OF HEAT RADIATING DEVICE
#16356MICROCHANNEL COOLING DEVICE FOR SMALL HEAT SOURCES
#16357Heat dissipation device with pivotable fan
#16358COOLING ARRANGEMENT
#16359Water-cooled heat sink
#16360Fastener and heat dissipation device using the same
#16361COOLING APPARATUS
#16362Integrated MOS gas or humidity sensor having a wireless transceiver
#16363Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same
#16364METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#16365Semiconductor devices including interlayer conductive contacts and methods of forming the same
#16366Sprocket opening alignment process and apparatus for multilayer solder decal
#16367Progressive trimming method
#16368Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias
#16369Method of fabricating high-voltage semiconductor device
#16370Via forming method and method of manufacturing multi-chip package using the same
#16371Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same
#16372Method and apparatus for packaging circuit devices
#16373Method for fabricating semiconductor device
#16374Method for detecting stress migration properties
#16375THIN FILM ENCAPSULATION METHOD
#16376METHOD FOR INHIBITING GROWTH OF TIN WHISKERS
#16377Method for passivating hardware of a microelectronic topography processing chamber
#16378Semiconductor memory device including alternately arranged contact members
#16379Semiconductor memory device reducing resistance fluctuation of data transfer line
#16380Semiconductor memory device having layout area reduced
#16381Light emitting device and illumination device
#16382Printed circuit board assembly
#16383Heat dissipation device and electronic device using the same
#16384Substrate for a display device and method of manufacturing the same
#16385ELECTROSTATIC DISCHARGE CLAMP WITH CONTROLLED HYSTERESIS INCLUDING SELECTABLE TURN ON AND TURN OFF THRESHOLD VOLTAGES
#16386CAMERA MODULE AND MANUFACTURING METHOD THEREOF
#16387Inkjet printhead with nozzle layer defining etchant holes
#16388High impedance electrical connection via
#16389Integrated-inverter electric compressor and inverter unit thereof
#16390Adaptive clamp width adjusting device
#16391Methods and apparatus for layout of three dimensional matrix array memory for reduced cost patterning
#16392Through silicon via with dummy structure and method for forming the same
#16393Coaxial through-silicon via
#16394Apparatus and methods of forming memory lines and structures using double sidewall patterning for four times half pitch relief patterning
#16395Semiconductor device
#16396Small area, robust silicon via structure and process
#16397Low-resistance interconnects and methods of making same
#16398Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#16399Inductors having inductor axis parallel to substrate surface
#16400Antifuse and method of making the antifuse
#16401Creating extremely thin semiconductor-on-insulator (ETSOI) having substantially uniform thickness
#16402Semiconductor device
#16403Semiconductor memory devices
#16404Semiconductor chip, stack module, and memory card
#16405Electrostatic discharge protection device
#16406ESD/antenna diodes for through-silicon vias
#16407Semiconductor device and method
#16408Multiple layer barrier metal for device component formed in contact trench
#16409Semiconductor device and method of manufacturing same
#16410Methods of forming pillars for memory cells using sequential sidewall patterning
#16411CLOSE PROXIMITY COLLIMATOR FOR LED
#16412Light emitting device package and lighting system
#16413Light emitting device package, lighting module and lighting system
#16414Silicon carbide semiconductor device
#16415DISPLAY PANEL
#16416Light emitting device and light emitting device package for improving a light emission efficency
#16417Semiconductor inspecting apparatus
#16418Multilayer electrical component, coating composition, and method of making electrical component
#16419Method of making a multi-layer interconnecting structure
#16420COMBINATION OF FASTENER AND THERMAL-CONDUCTING MEMBER
#16421LIQUID-COOLED-TYPE COOLING DEVICE
#16422Heat dissipation assembly
#16423Heat dissipation device with heat pipe
#16424REDUNDANT EMITTER ELECTRODES IN AN ION WIND FAN
#16425HEAT DISSIPATION APPARATUS AND FRAME THEREOF
#16426Electrode assembly for the removal of surface oxides by electron attachment
#16427METHOD FOR CONNECTING HEAT PIPES AND A HEAT SINK
#16428Analyte Monitoring Device and Methods of Use
#16429Polyhedral oligomeric silsesquioxanes and metallized polyhedral oligomeric silsesquioxanes as coatings, composites and additives
#16430METHOD OF PRODUCING SILYLATED POROUS INSULATING FILM, METHOD OF PRODUCING SEMICONDUCTOR DEVICE, AND SILYLATED MATERIAL
#16431Air gap structure having protective metal silicide pads on a metal feature
#16432Semiconductor device suitable for a stacked structure
#16433Preventing UBM oxidation in bump formation processes
#16434Buried decoupling capacitors, devices and systems including same, and methods of fabrication
#16435Monitor pattern of semiconductor device and method of manufacturing semiconductor device
#16436Semiconductor device
#16437Efficient interconnect structure for electrical fuse applications
#16438Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections
#16439Method for stacked contact with low aspect ratio
#16440Light emitting diode
#16441RESIN COMPOSITION AND SHEET USING THE SAME
#16442Mounted semiconductor device and a method for making the same
#16443Thin film surface mount components
#16444Protective circuit board cover
#16445Thermal conductive member, manufacturing method of the thermal conductive member, heat radiating component, and semiconductor package
#16446TILT-TYPE HEAT-DISSIPATING MODULE FOR INCREASING HEAT-DISSIPATING EFFICIENCY AND DECREASING LENGTH OF SOLDER PIN
#16447Printed circuit board assembly
#16448Heat dissipating system with fan module
#16449CAPACITOR ELECTRODE, CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME
#16450Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
#16451Electronically scanned array having a transmission line distributed oscillator and switch-mode amplifier
#16452Inductor element, integrated circuit device, and three-dimensional circuit device
#16453Analog circuit and semiconductor device
#16454Semiconductor device, semiconductor element, and substrate
#16455Reconfiguring through silicon vias in stacked multi-die packages
#16456Semiconductor integrated circuit device
#16457Logic circuit and semiconductor device
#16458MEMS PROBE CARD AND MANUFACTURING METHOD THEREOF
#16459Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same
#16460Electroluminescent device and method for producing an electroluminescent device
#16461Light-emitting element lamp and lighting equipment
#16462Semiconductor wafer having scribe lane alignment marks for reducing crack propagation
#16463Semiconductor device comprising high performance encapsulation resins
#16464Pad layout structure of a driver IC chip
#16465Semiconductor device comprising multilayer interconnect structure with overlapping vias
#16466Method for fabricating through substrate vias
#16467Multi-Layer Connection Cell
#16468Multilayer wiring, method for placing dummy wiring in multilayer wiring, semiconductor device, and semiconductor device manufacturing method
#16469Production method and production apparatus of tin or solder alloy for electronic components, and solder alloy
#16470SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE
#16471Production device, production method, test apparatus and integrated circuit package
#16472SEMICONDUCTOR DEVICE
#16473Semiconductor device with a balun
#16474Semiconductor die with integrated electro-static discharge device
#16475Electrostatic discharge protection device
#16476Integrated circuit with ESD structure
#16477Semiconductor device and method of manufacturing the same
#16478Intrusion protection using stress changes
#16479Semiconductor device having fuse and protection circuit
#16480High voltage semiconductor device with JFET regions containing dielectrically isolated junctions and method of fabricating the same
#16481Semiconductor device
#16482Sensor device having MOS circuits, a gas or humidity sensor and a temperature sensor
#16483Optoelectronic apparatus
#16484SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES
#16485Surface-textured encapsulations for use with light emitting diodes
#16486Light-emitting element
#16487Optoelectronic device
#16488Integrated CMOS porous sensor having sensor electrodes formed with the interconnect conductors of a MOS circuit
#16489Compound semiconductor device and method for fabricating the same
#16490Securities, chip mounting product, and manufacturing method thereof
#16491Thin film transistor array panel
#16492Method for manufacturing an oxide-based semiconductor thin film transistor (TFT) including out diffusing hydrogen or moisture from the oxide semiconductor layer into an adjacent insulating layer which contains a halogen element
#16493Animal transponder tag
#16494METHOD AND SYSTEM FOR EXPOSING DELICATE STRUCTURES OF A DEVICE ENCAPSULATED IN A MOLD COMPOUND
#16495METHOD FOR SORTING INTEGRATED CIRCUIT DEVICES
#16496HEAT TRANSPORT DEVICE, METHOD OF MANUFACTURING A HEAT TRANSPORT DEVICE, AND ELECTRONIC APPARATUS
#16497Loop heat pipe
#16498Memory Heatsink Set With Supplementary Retaining Devices
#16499Modular low stress package technology
#16500Modular low stress package technology