ALIGNMENT MARK

Semiconductor device and manufacturing method of semiconductor device

Semiconductor with Bottom-Side Wrap-Around Flange Contact

Method of manufacturing semiconductor device and semiconductor device

Via gouged interconnect structure and method of fabricating same

Structure of power grid for semiconductor devices and method of making the same

Sheet structure, semiconductor device and method of growing carbon structure

Semiconductor package and method of forming the same

Apparatus for stacking integrated circuits

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Semiconductor device comprising capacitive element

Inductor structures for integrated circuit devices

Semiconductor chip, semiconductor wafer, method of manufacturing semiconductor chip

Fuse structure for high integrated semiconductor device

Fuse of semiconductor device

FUSE STRUCTURE AND FABRICATION METHOD THEREOF

Electrically programmable fuse using anisometric contacts and fabrication method

Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same

Contact optimization for enhancing stress transfer in closely spaced transistors

Process of forming an electronic device including an integrated circuit with transistors coupled to each other

Semiconductor device and method of manufacturing the same

Process of forming an electronic device including a well region

Semiconductor device and method for forming the same

Semiconductor device

THERMAL PYROLYTIC GRAPHITE LAMINATES WITH VIAS

Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same

PHASE-CHANGE-TYPE HEAT SPREADER, FLOW-PATH STRUCTURE, ELECTRONIC APPARATUS,AND METHOD OF PRODUCING A PHASE-CHANGE-TYPE HEAT SPREADER

HEAT SPREADER WITH VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME

VAPOR CHAMBER WITH SEPARATOR

Heat sink assembly

COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Fiber Optic Solar Nanogenerator Cells

Self-cleaning protective coatings for use with photovoltaic cells

Analyte Monitoring Device and Methods of Use

Analyte monitoring device and methods of use

Analyte monitoring device and methods of use

Analyte Monitoring Device and Methods of Use

Analyte Monitoring Device and Methods of Use

Modifier for low dielectric constant film, and method for production thereof

Method of manufacturing semiconductor device suitable for forming wiring using damascene method

Microstructure modification in copper interconnect structure

Semiconductor device and manufacturing method thereof

Fabrication method of semiconductor device having conductive bumps

System and Process for Producing Nanowire Composites and Electronic Substrates Therefrom

Method for manufacturing semiconductor device

Circuit Device and Method of Manufacturing Thereof

Semiconductor device and method of manufacturing the same

INTERCONNECTIONS OF AN INTEGRATED ELECTRONIC CIRCUIT

Process environment variation evaluation

Defect inspecting method

Apparatus and method for measuring local surface temperature of semiconductor device

Electronic device with improved heat dissipation properties

Electrical power component attached to chassis of an electrical power apparatus

Heatsink mounting system

Avionics chassis

ELECTROSTATIC DISCHARGE (ESD) PROTECTION METHOD AND STRUCTURE FOR ELECTRONIC PRODUCT

Electrostatic discharge structures and methods of manufacture

SURFACE INSPECTING APPARATUS AND SURFACE INSPECTING METHOD

SOLID-STATE IMAGING UNIT

REFERENCE VOLTAGE OUTPUT CIRCUIT

Integrated circuit chip identification element

Method and apparatus to select a parameter/mode based on a time measurement

Configurable voltage regulator

Organic/inorganic composite

Method of manufacturing a piezoelectric vibrator

Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device, and radio-controlled watch

Method of manufacturing a pipe coupling component

Interconnection substrate having first and second insulating films with an adhesion enhancing layer therebetween

Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer

Integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks

Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer

Method for manufacturing a semiconductor device, semiconductor chip and semiconductor wafer

Fluid ejection device comprising substrate contact via

Application of Mn for damage restoration after etchback

Thru silicon enabled die stacking scheme

Wafer and method for improving yield rate of wafer

Electronic fuses in semiconductor integrated circuits

Semiconductor device

Method for forming a one-time programmable metal fuse and related structure

Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof

Semiconductor device comprising stack of pn junction diode and schottky barrier diode

Semiconductor device with electrostatic protection device

NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor integrated circuit device and a method of manufacturing the same

Method for forming and integrating metal gate transistors having self-aligned contacts and related structure

Semiconductor device

Light-emitting device array with individual cells

Light-emitting device array with individual cells

System for separation of an electrically conductive connection

Integrated image sensor system on common substrate

Multicolor detectors and applications thereof

Heat Sink and Thermal Plate Apparatus for Electronic Components

AUTOMOTIVE POWER ELECTRONICS WITH WIDE BAND GAP POWER TRANSISTORS

Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating

COMPOSITE MATERIAL HAVING HIGH THERMAL CONDUCTIVITY ND PROCESS OF FABRICATING SAME

HEAT SINK AND METHOD OF MANUFACTURE THEREOF

THERMAL INTERCONNECT AND INTEGRATED INTERFACE SYSTEMS, METHODS OF PRODUCTION AND USES THEREOF

High-performance heat dissipation substrate with monoparticle layer

HEAT SPREADER STRUCTURE AND METHOD OF MANUFACTURING THE SAME

HEAT SPREADER WITH VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME

HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF

Method and device for interleaving a module or chip

Method of generating a leadframe IC package model, a leadframe modeler and an IC design system

Off-Chip Supply Of Calibration Data

Silane compound, production method thereof, and resin composition containing silane compound

METHOD FOR FABRICATING AN APERTURE

Integrated circuit fabrication

METHOD FOR MAKING INTEGRATED CIRCUIT DEVICE

Remote plasma processing of interface surfaces

High-gain bipolar junction transistor compatible with complementary metal-oxide-semiconductor (CMOS) process and method for fabricating the same

Warpage resistant semiconductor package and method for manufacturing the same

Method for manufacturing a reflective surface sub-assembly for a light-emitting device

COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC COMPONENTS

LOW DISTORTION PACKAGE FOR A MEMS DEVICE INCLUDING MEMORY

SEMICONDUCTOR INTEGRATED CIRCUIT

Light emitting diode package, and backlight unit and display device using the same

Light source and vehicle lamp

Reflective surface sub-assembly for a light-emitting device

FASTENING CLAMP

Heat spreader and method of making the same

Integral heat sink with spiral manifolds

ANTI-GRAVITY THERMOSYPHON HEAT EXCHANGER AND A POWER MODULE

Electric vehicle and method of cooling vehicular DC/DC converter

Lens mounting assembly and method of aligning lenses in a mounting assembly

Semiconductor fabrication method and system

Circuit configurations having four terminal devices

Hermeticity testing

Device for detecting the thinning down of the substrate of an integrated circuit chip

Overlay key, method of forming the overlay key and method of measuring overlay accuracy using the overlay key

Semiconductor device and method for manufacturing same

Reliable interconnects

SEMICONDUCTOR DEVICE INCLUDING AN IMPROVED LITHOGRAPHIC MARGIN

Improvements for reducing electromigration effect in an integrated circuit

Interconnect structure fabricated without dry plasma etch processing

Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same

ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer

INTERCONNECTION STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR MAKING THE SAME

Hybrid metallic wire and methods of fabricating same

Integrated circuit system employing low-k dielectrics and method of manufacture thereof

Interconnect structures having lead-free solder bumps

Integrated circuit package having security feature and method of manufacturing same

Electronic device package and method of manufacture

Semiconductor package

Apparatus for restricting moisture ingress

Faraday cage for circuitry using substrates

Circuit configuration and manufacturing processes for vertical transient voltage suppressor (TVS) and EMI filter

Integrated circuit inductors with reduced magnetic coupling

Latch-up prevention structure and method for ultra-small high voltage tolerant cell

Methods of manufacturing metal-silicide features

Semiconductor device having a stress-inducing layer between channel region and source and drain regions

Sidewall-Free CESL for Enlarging ILD Gap-Fill Window

Local metallization and use thereof in semiconductor devices

Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Device with integrated circuit and encapsulated N/MEMS and method for production

Light emitting package having screen layer

INTEGRATED CIRCUIT PACKAGE

Silicon carbide semiconductor device

HEMT WITH IMPROVED QUANTUM CONFINEMENT OF ELECTRONS

Sheet formable monomer composition, heat conductive sheet and production method of the heat conductive sheet

HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS

VARIABLE HEAT EXCHANGER

HEAT DISSIPATION DEVICE

Cooler with ground heated plane and grinding method and apparatus thereof

HEAT DISSIPATION DEVICE AND CLIP ASSEMBLY THEREOF

BASE PLATE WITH TAILORED INTERFACE

Semiconductor application installation adapted with a temperature equalization system

Analyte Monitoring Device and Methods of Use

Method and system for a leaky wave antenna as a load on a power amplifier

STRUCTURED LAYER DEPOSITION ON PROCESSED WAFERS USED IN MICROSYSTEM TECHNOLOGY

Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium

Compounds Having A Diphenyl Oxide Backbone and Maleimide Functional Group

SOLID POWDER FORMULATIONS FOR THE PREPARATION OF RESIN-COATED FOILS AND THEIR USE IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS

HEAT DISSIPATION APPARATUS

Pattern inspection method and pattern inspection system

PHOTOELECTRONIC DEVICE HAVING A VARIABLE RESISTOR STRUCTURE

Light emitting device

LIGHT-EMITTING DEVICE AND DISPLAY UNIT AND LIGHTING UNIT USING THE SAME

Mounting structure for an electronic element

Thermal interface with non-tacky surface

Electronic circuit composed of sub-circuits and method for producing

MOTHERBOARD WITH MOUNTING HOLES

INTEGRATED HEAT EXCHANGER

Capacitor arrangement and method for making same

Three-terminal metal-oxide-metal capacitor

WAFER-LEVEL LENS MODULE AND IMAGE PICKUP MODULE INCLUDING THE SAME

Fuse layout structure of semiconductor device

Monolithic low impedance dual gate current sense MOSFET

Method for testing a container warning device of a compensation container, and testing apparatus for testing a container warning device

Electronic device identifying method and electronic device comprising identification means

Test systems and methods for semiconductor devices

LED MODULE AND METHOD OF FABRICATION THEREOF

Method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio clock

ARRANGEMENT OF POWER SUPPLY CELLS WITHIN CELL-BASE INTEGRATED CIRCUIT

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME

Method for manufacturing semiconductor device

Semiconductor device and inductor

Method and apparatus of forming a via

Semiconductor device and method for fabricating the same

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD THEREOF

Semiconductor device, semiconductor wafer and manufacturing method of the same

Marking COlaser-transparent materials by using absorption-material-assisted laser processing

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Through silicon via with embedded decoupling capacitor

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and method of manufacturing same

Semiconductor device having air gaps in multilayer wiring structure

Recessed gate dielectric antifuse

Solid state image pickup device and method of producing solid state image pickup device

DUAL DAMASCENE PROCESSING FOR GATE CONDUCTOR AND ACTIVE AREA TO FIRST METAL LEVEL INTERCONNECT STRUCTURES

Method of forming a dielectric layer on a semiconductor light emitting device

Optoelectronic component

Wavelength conversion chip for use with light emitting diodes and method for making same

High light extraction efficiency solid state light sources

LED chip-based lighting products and methods of building

Light-emitting device and the manufacturing method thereof

INTEGRATED CIRCUIT LIGHT EMISSION DEVICE, MODULE AND FABRICATION PROCESS

Carrier Structure for Electronic Components and Fabrication Method of the same

Liquid-cooled heat dissipating device and method of making the same

HEAT DISSIPATION DEVICE

HEAT EXCHANGER

HEAT PIPE

HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING THE SAME

HEAT SINK

PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR MANUFACTURING THE SAME

Photoelectric conversion device and method for manufacturing the same

VAPOR CHAMBER STRUCTURE WITH IMPROVED WICK AND METHOD FOR MANUFACTURING THE SAME

Multi-fluid cooling of an electronic device

FLEXIBLE CIRCUIT AND METHOD FOR FORMING THE SAME

ETCHING METHOD AND METHOD FOR MANUFACTURING OPTICAL/ELECTRONIC DEVICE USING THE SAME

Semiconductor processing methods

Method of production of a contact structure

Semiconductor device including semiconductor thin film, which is subjected to heat treatment to have alignment mark, crystallizing method for the semiconductor thin film, and crystallizing apparatus for the semiconductor thin film

Method of sensing a high voltage

Contactless technique for evaluating a fabrication of a wafer

Energy conversion device with support member having pore channels

Electrical fuse, semiconductor device having the same, and method of programming and reading the electrical fuse

Semiconductor module and data memory module having the same

Illumination device with anti-glare function

Power electronics power module with imbedded gate circuitry

ELECTRONIC APPARATUS

HEATSINK AND METHOD OF FABRICATING SAME

Stacked busbar assembly with integrated cooling

Heat-dissipating mechanism for use with memory module

ACTIVE THERMAL MODULE

Vapor chamber heat sink with cross member and protruding boss

Defect correcting method and defect correcting device for an electronic circuit pattern

Piezoelectric resonator with control film to increase a degree of vacuum inside the package

LIGHT SOURCE HAVING A REFRACTIVE ELEMENT

Piezoelectric vibrator with hermetically closed casing and filler comprising non-spherical conductive particles

Photovoltaic Power Generation System and Photovoltaic Power Generation Device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Microstructure device including a metallization structure with self-aligned air gaps formed based on a sacrificial material

Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method

SRAM bit cell with self-aligned bidirectional local interconnects

Semiconductor device having a conductive structure including oxide and non oxide portions

Reduced soft error rate through metal fill and placement

Method and apparatus providing air-gap insulation between adjacent conductors using nanoparticles

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

Integrated nano-farad capacitors and method of formation

Semiconductor device with lower layer wiring

Solid-state imaging device and method of manufacturing solid-state imaging device

Gap control for die or layer bonding using intermediate layers

ELECTROSTATIC DISCHARGE PROTECTION DEVICE

Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device

Monolithic vertically integrated composite group III-V and group IV semiconductor device and method for fabricating same

Semiconductor device and method for its production

Formulations for improved electrodes for electronic devices

Power surface mount light emitting die package

Light emitting diode

Semiconductor integrated circuit device and manufacture thereof

Display device having oxide thin film transistor and fabrication method thereof

ELECTROMAGNETIC WAVE ABSORBING AND HEAT DISSIPATION MATERIAL

Thermal interface material having a patterned carbon nanotube array and method for making the same

RETAINING DEVICE FOR HEAT-DISSIPATING APPARATUS

Encapsulation process and structure for electronic devices

Substrate having leads

ELECTRONIC APPARATUS AND REINFORCING COMPONENT

NANOWIRES USING A CARBON NANOTUBE TEMPLATE

FIXING APPARATUS FOR HEAT SINK

HEAT DISSIPATING DEVICE AND FIXING BRACKET THEREOF

EBULLIENT COOLING DEVICE

HEAT TRANSFER DEVICE COMBINED A FLATTEN LOOP HEAT PIPE AND A VAPOR CHAMBER

MODIFIED HEAT PIPE FOR PHASE CHANGE COOLING OF ELECTRONIC DEVICES

Heat dissipating system

Solar photovoltaic modules with integral wireless telemetry

SUBSTRATE SIDE MARKING AND IDENTIFICATION

Analyte Monitoring Device and Methods of Use

Analyte Monitoring Device and Methods of Use

Method and system for dynamic link control for a chip to chip communication system

Switching element, antenna switch circuit and radio frequency module using the same

Method and system for chip-to-chip mesh networks

Methods of using optical metrology for feed back and feed forward process control

Method of manufacture an integrated circuit system with through silicon via

Method of Temporarily Attaching a Rigid Carrier to a Substrate

Method of fabricating stacked semiconductor chips

Passive components in the back end of integrated circuits

Semiconductor devices having pFET with SiGe gate electrode and embedded SiGe source/drain regions and methods of making the same

Image capture unit