Structure for reduction of soft error rates in integrated circuits

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Semiconductor device capable of switching operation modes

Device interconnects

Method for manufacturing a multilayer printed wiring board for providing an electronic component therein

Method of manufacturing an embedded printed circuit board

Method for mounting semiconductor device

Method of manufacturing wiring substrate

Bump bonding method

METHOD OF STACKING DIES FOR DIE STACK PACKAGE

Method of forming an interconnect on a semiconductor substrate

Method for manufacturing microelectronic devices

Sheet structure and method of manufacturing sheet structure

High frequency power amplifier

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

Package-on-package system with via Z-interconnections

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Microelectronic devices

Semiconductor device

PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE

Semiconductor device including a pressure-contact section

Method of making and designing lead frames for semiconductor packages

COL SEMICONDUCTOR PACKAGE

Apparatus and method for series connection of two die or chips in single electronics package

Semiconductor device and manufacturing method of the same

Wire bond and redistribution layer process

SEMICONDUCTOR DEVICE WITH CAPACITOR

Method of electrically connecting a microelectronic component

Method of manufacturing wiring substrate and method of manufacturing semiconductor device

Method for manufacturing multilayer film

Wafer level IC assembly method

GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, HIGH RESIN FLOWABILITY RESISTANCE, AND LOW SPECIFIC RESISTANCE

Broadband Power Amplifier with A High Power Feedback Structure

Adhesive Film for Semiconductor and Semiconductor Device Therewith

Semiconductor device including adhesive covered element

Bump-on-lead flip chip interconnection

Semiconductor device

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor die package including embedded flip chip

Semiconductor die package including multiple semiconductor dice

Semiconductor module

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Support mounted electrically interconnected die assembly

Multi-chips package structure and the method thereof

Leadframe package with dual lead configurations

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LID FRAME

Method of bonding

Device for mounting electric component

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Bump forming method and bump forming apparatus

Method of forming an inlay substrate having an antenna wire

Dicing tape and die attach adhesive with patterned backing

Semiconductor device and method of manufacturing the same

Method and device for fabricating an assembly of at least two microelectronic chips

Methods of fabricating a composite carbon nanotube thermal interface device

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor device and manufacturing method thereof

Semiconductor module molded by resin with heat radiation plate opened outside from mold

Semiconductor package having side walls and method for manufacturing the same

Chip package with a dam structure on a die pad

Semiconductor device with wire-bonding on multi-zigzag fingers

Semiconductor light-emitting device, light-emitting module and lighting unit

ELECTRONIC COMPONENT MOUNTING METHOD

Lead frame isolation using laser technology

Apparatus and methods for forming wire bonds

Low impedance gold electrode, apparatus, method and electrolyte solution for fabricating the same

Method of manufacturing wiring board having a semiconductor thereon

Adjusting Apparatus of Gap Width and Method Thereof

Etching Solution And Method For Structuring A UBM Layer System

Method of forming a metal bump on a semiconductor device

Method of manufacturing a semiconductor device

Power electronics assembly with cooling element

Semiconductor integrated circuit device

Methods for bonding and micro-electronic devices produced according to such methods

SEMICONDUCTOR DEVICE INCLUDING A PADDING UNIT

Flip chip semiconductor assembly with variable volume solder bumps

OPTIMIZED PASSIVATION SLOPE FOR SOLDER CONNECTIONS

Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween

Semiconductor module and method of producing the same

Semiconductor device

Semiconductor IC-embedded substrate and method for manufacturing same

SEMICONDUCTOR DEVICE

Semiconductor module

Semiconductor package having a bridge plate connection

Storage medium and semiconductor package

Device comprising electrode pad

Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device

WIRE BONDER

METHOD OF PRODUCING ELECTRONIC COMPONENT

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

Semiconductor device and method for manufacturing the same

Semiconductor device manufacturing method

Method of manufacturing electronic component built-in substrate

Manufacturing method of resin-sealed semiconductor device

Capacitive isolation circuitry

Semiconductor device

Carbon nanotube-based conductive connections for integrated circuit devices

Semiconductor device and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Integrated circuit package system with external interconnects within a die platform

Ball grid array package layout supporting many voltage splits and flexible split locations

SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING

Resin sealed semiconductor device and manufacturing method therefor

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF

SURFACE TREATMENT METHOD

SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE

DICING DIE-BONDING FILM

Method for forming lead frame land grid array

Method of manufacturing semiconductor package

Semiconductor device

High voltage isolation dual capacitor communication system

Semiconductor device with recessed registration marks partially covered and partially uncovered

Semiconductor device and a method of manufacturing the same

FABRICATING LOW COST SOLDER BUMPS ON INTEGRATED CIRCUIT WAFERS

Solder interconnect pads with current spreading layers

Flip chip device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM

Electronic parts packaging structure and method of manufacturing the same

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Module including a sintered joint bonding a semiconductor chip to a copper surface

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

Semiconductor device and a method of manufacturing the same

Method of manufacturing printed wiring board with built-in electronic component

Method of mounting electronic components

Method of manufacturing printed wiring board with built-in electronic component

SEMICONDUCTOR DEVICE FABRICATING METHOD

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Treatment of items

Adhesive film

Multi-component electrical module

Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same

Semiconductor device

Integrated circuit having wide power lines

Manufacturing method of semiconductor apparatus and semiconductor apparatus

Semiconductor package and method of making the same

3D smart power module

Semiconductor device and manufacturing method thereof

Method of electrically connecting a microelectronic component

Method of electrically connecting a microelectronic component

Semiconductor device and manufacturing method of the same

Package substrate with built-in capacitor and manufacturing method thereof

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport

Electric Component with Two-Phase Cooling Device and Method for Manufacturing

Method for manufacturing board with built-in electronic elements

Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them

Method of fabricating chip package structure

Semiconductor device singulation method

Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device

Device mounting board and manufacturing method therefor, and semiconductor module

Device mounting board, and semiconductor module and manufacturing method therefor

Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Semiconductor device including wiring and manufacturing method thereof

Semiconductor device having wiring line and manufacturing method thereof

Electronic device

Method for manufacturing a wafer level package

Wafer level chip scale package and process of manufacture

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES

Panel level methods and systems for packaging integrated circuits with integrated heat sinks

Semiconductor device having wiring line and manufacturing method thereof

Semiconductor package and methods of fabricating the same

MOLDED PACKAGE ASSEMBLY

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

Semiconductor Device Having Element Portion and Method of Producing the Same

Semiconductor device having antenna over thin film integrated circuit

Wire bonding method

Bondwire design

Wafer processing method for processing wafer having bumps formed thereon

Semiconductor device and manufacturing method thereof

METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Electronic device and method of manufacturing same

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCTS THEREOF

Semiconductor device

SEMICONDUCTOR DEVICE

STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module

Multi-chip module

Fine pitch solder bump structure with built-in stress buffer

Integrated circuit package system with wafer scale heat slug

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method of the same

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

Semiconductor device

Manufacturing process of semiconductor device and semiconductor device

Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure

Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method

Bonding wire for semiconductor device

Method for manufacturing electronic device

Dual metal stud bumping for flip chip applications

Manufacturing method of semiconductor device

Light-emitting device and its manufacturing method

Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler

Semiconductor power device with bias circuit

Liquid epoxy resin composition and flip chip semiconductor device

Module with stacked semiconductor devices

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Post bump and method of forming the same

Flip chip interconnect solder mask

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME

INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE INSULATIVE WIRING BOARD

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

Semiconductor device including semiconductor chips with different thickness

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

Method of forming bonding pad opening

Lamination device manufacturing method

Method for fabricating a flip chip system in package

Method for processing a base that includes connecting a first base to a second base with an insulating film

Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip

Solder contacts and methods of forming same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Packaging structure, method for manufacturing the same, and method for using the same

Flex clip connector for semiconductor device

Contact element and a contact arrangement

Wiring board for semiconductor device

METHOD OF ARRANGING STACKED CHIP BY PHOTO-CURING ADHESIVE

Solar cell and magnetically self-assembled solar cell assembly

Multiple access over proximity communication

Micropad formation for a semiconductor

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Method of forming a bump structure using an etching composition for an under bump metallurgy layer

Removable layer manufacturing method

Method of manufacturing a semiconductor device

Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portion

Method for forming a die-attach layer during semiconductor packaging processes

Method for processing a base that includes connecting a first base to a second base

Package substrate with built-in capacitor and manufacturing method thereof

METHOD OF MANUFACTURING TRANSPONDER FOR WIRELESS CARD, METHOD OF MANUFACTURING WIRELESS CARD, WIRELESS CARD TRANSPONDER, AND WIRELESS CARD

High power integrated RF amplifier

Semiconductor device and method of manufacturing the same

Semiconductor device and the method of manufacturing the same

Semiconductor device

Three-dimensional stacked substrate arrangements

Semiconductor device, circuit board, and electronic instrument

Semiconductor device and method of manufacturing the same

Semiconductor Device

Conductive chip-scale package

Semiconductor device and programming method

Module with Flat Construction and Method for Placing Components

Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

Semiconductor package with an embedded printed circuit board and stacked die

Radio frequency over-molded leadframe package

ESD protection semiconductor device having an insulated-gate field-effect transistor

Interposer and method for manufacturing interposer

Method of manufacturing semiconductor device

Adhesive composition and adhesive sheet

Electronic apparatus manufacturing method

METHOD FOR MANUFACTURING A FLIP CHIP PACKAGE

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

Thermally and electrically conductive interconnect structures

Pad in semicondcutor device and fabricating method thereof

RFID tags and processes for producing RFID tags

Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same

SEMICONDUCTOR DEVICE

Method for cutting and molding in small windows to fabricate semiconductor packages

PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS

Semiconductor package including flip chip controller at bottom of die stack

ELECTRICAL BONDING PAD

Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead

Method of manufacturing semiconductor device including mounting and dicing chips

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Power semiconductor module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD

Etched surface mount islands in a leadframe package

Semiconductor device and manufacturing method thereof

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility

Semiconductor chip

Microball attachment using self-assembly for substrate bumping

Circuit board and process for producing the same

AVOIDING ELECTRICAL SHORTS IN PACKAGING

Electronic assembly manufacturing method

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Method of forming a wafer level package

Semiconductor package board using a metal base

Method for manufacturing metal chips by plasma from a layer comprising several elements

Nanoscale metal paste for interconnect and method of use

METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

Semiconductor device

ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTING ADHESIVE, ELECTRONIC COMPONENTS MOUNTED STRUCTURE, AND MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTED STRUCTURE

Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip

Surface-mount type crystal oscillator

Die rearrangement package structure using layout process to form a compliant configuration

Semiconductor element, semiconductor device, and fabrication method thereof

Reconstituted wafer level stacking