Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

Structure and process for the formation of TSVs

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE

Semiconductor chip, method of fabricating the same and semiconductor chip stack package

Wafer level chip scale packaging

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

Dice rearrangement package structure using layout process to form a compliant configuration

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

Semiconductor package with leads on a chip having multi-row of bonding pads

Package with multiple dies

Conductive ball mounting method and surplus ball removing apparatus

Semiconductor device and automotive AC generator

Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus

Forming solder balls on substrates

Low cost high frequency device package and methods

Electronic component manufacturing apparatus

Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes

ROBUST DIE BONDING PROCESS FOR LED DIES

Semiconductor device

Thermal enhanced low profile package structure and method for fabricating the same

Semiconductor device fabricating method and fabricating apparatus

Method of manufacturing a printed wiring board

Semiconductor device

Wiring substrate and display device including the same

Sensor module and method for manufacturing a sensor module

CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

Semiconductor package

Semiconductor package having redistribution layer

Methods of fluxless micro-piercing of solder balls, and resulting devices

Method of forming stacked die package

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Controller chip mounted on a memory chip with re-wiring lines

Semiconductor device and manufacturing method of the same

Electronic device

Electronic device including an inductor

Semiconductor component

WIRE BONDING METHOD

COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE

FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Method of forming a crack stop laser fuse with fixed passivation layer coverage

Dicing die-bonding film

Method of manufacturing flexible semiconductor assemblies

Interconnection element with plated posts formed on mandrel

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Forming large planar structures from substrates using edge Coulomb forces

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

Fabricated adhesive microstructures for making an electrical connection

Semiconductor device

Top layers of metal for high performance IC's

Flip chip interconnection with double post

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER

Chip-stacked package structure with asymmetrical leadframe

Embedded package security tamper mesh

Component attach methods and related device structures

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

Method of fabricating an interconnection element having conductive posts

Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter

Electrode bonding method and part mounting apparatus

Chip on wafer bonder

Method of manufacturing a semiconductor device

Touch screen system with light reflection

Wafer level die integration and method

Flexible column die interconnects and structures including same

Metal foil interconnection of electrical devices

Chip package

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Soft error rate mitigation by interconnect structure

Semiconductor device having improved solder joint and internal lead lifetimes

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

Semiconductor device

Method of fabricating a semiconductor device having a heat sink with an exposed surface

Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

METHOD AND DEVICE FOR WIRE BONDING

Methods for manufacturing semiconductor devices

Isolating chip-to-chip contact

Low fabrication cost, high performance, high reliability chip scale package

Method and apparatus for manufacturing semiconductor module

Chip packaging process including simpification and mergence of burn-in test and high temperature test

Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods

FILM-LIKE ADHESIVE AND METHOD FOR CARRYING THE SAME

STRUCTURE OF THREE-DIMENSIONAL STACKED DICE WITH VERTICAL ELECTRICAL SELF-INTERCONNECTIONS AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device and semiconductor device

Method of producing multiple semiconductor devices

Adhesive on wire stacked semiconductor package

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic component module

Process and Paste for Contacting Metal Surfaces

Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus

Soldering Method and Semiconductor Module Manufacturing Method

Work clamp and wire bonding apparatus

Multilayered Circuit Board for Connection to Bumps

Epoxy Resin Composition and Die Bonding Material Comprising the Composition

Manufacture of a circuit board containing a component

Semiconductor device

METHOD OF FORMING CONDUCTIVE BUMPS

THREE DIMENSIONAL PACKAGING WITH WAFER-LEVEL BONDING AND CHIP-LEVEL REPAIR

Substrate based unmolded package

Stacked dual MOSFET package

High-volume on-wafer heterogeneous packaging of optical interconnects

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

System for electronic components mounted on a circuit board

Stacked-die package for battery power management

METHOD OF COMPRESSION-MOLDING ELECTRONIC COMPONENTS AND MOLD

Drop-mold conformable material as an encapsulation for an integrated circuit package system

Semiconductor module

Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method

Undercut-free BLM process for Pb-free and Pb-reduced C4

Copper pillar tin bump on semiconductor chip and method of forming the same

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

METHOD OF CONNECTING A SEMICONDUCTOR PACKAGE TO A PRINTED WIRING BOARD

Semiconductor power module packages with simplified structure and methods of fabricating the same

Stacking die package structure for semiconductor devices and method of the same

Power device packages and methods of fabricating the same

LEADFRAME FOR LEADLESS PACKAGE

Integrated circuit package system with insulator over circuitry

Integrated circuit package-in-package system with wire-in-film encapsulant

Back to Back Die Assembly For Semiconductor Devices

Electrical device and method

Light-emitting diode

Optoelectronic component with a wireless contacting

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

In-line package apparatuses and methods

Substrate for mounting electronic part and electronic part

Wiring board and method for manufacturing the same

THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME

Flip chip mounting method and method for connecting substrates

Die-to-robot alignment for die-to-substrate bonding

Electronic component mounting method

Integrated circuit with intra-chip clock interface and methods for use therewith

Method of manufacturing semiconductor device with through hole

Semiconductor device with bonding pad

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Low profile stacking system and method

Method for removing bubbles from adhesive layer of semiconductor chip package

Imaging device and method for a bonding apparatus

Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device

Semiconductor device and method for manufacturing thereof

Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device

Semiconductor device and a method of manufacturing the same

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS

Semiconductor device having spacer formed on semiconductor chip connected with wire

Method for manufacturing a printed wiring board

Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance

Method for producing substrate

Manufacturing method of semiconductor integrated device with inverting plating cup

Flip chip mounting method and bump forming method

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Mounting structure

Manufacturing method for RFID tag

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

Flip chip mounting method and method for connecting substrates

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Device mounting board, semiconductor module, and mobile device

Electronic component

Robust multi-layer wiring elements and assemblies with embedded microelectronic elements

SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated circuit package with integrated heat sink

SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME

Integrated circuit package

Reduction of package height in a stacked die configuration

Light emitting device

Electronic device and method of manufacturing same

Method for manufacturing a semiconductor device

SEMICONDUCTOR CHIP MOUNTING METHOD, SEMICONDUCTOR MOUNTING WIRING BOARD PRODUCING METHOD AND SEMICONDUCTOR MOUNTING WIRING BOARD

Fabrication method of semiconductor device

Wafer-level chip scale package and method for fabricating and using the same

Adhesive film composition, associated dicing die bonding film, die package, and associated methods

Packaged gallium nitride material transistors and methods associated with the same

Wafer of circuit board and joining structure of wafer or circuit board

Assembly comprising a functional device and a resonator and method of making same

RFID tag and manufacturing method thereof

JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN

Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus

Device with a plurality of semiconductor chips

Semiconductor device and method for manufacturing the same

Device including a semiconductor chip having a plurality of electrodes

Solder-top enhanced semiconductor device for low parasitic impedance packaging

Chip structure

SEMICONDUCTOR DEVICE HAVING A FINE PITCH BONDPAD

Flip-Chip Interconnect Structure

SELF-ASSEMBLED STRESS RELIEF INTERFACE

Semiconductor device

Semiconductor integrated circuit device, PDP driver, and plasma display panel

SEMICONDUCTOR DEVICE

Apparatus and method configured to lower thermal stresses

SEMICONDUCTOR DEVICE AND ITS FABRICATION PROCESS

Semiconductor device

Semiconductor structure and method of manufacture

Semiconductor chip with coil element over passivation layer

Method of forming micro metal bump

Stacked packaging improvements

Image display unit with light emitting devices having a resin surrounding the light emitting devices

Power recovery circuit based on partial standing waves

Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device

Alignment Marks on the Edge of Wafers and Methods for Same

Electrically enhanced wirebond package

Chip package structure and method of manufacturing the same

BONDING PAD FOR ANTI-PEELING PROPERTY AND METHOD FOR FABRICATING THE SAME

Flip chip connection structure having powder-like conductive substance and method of producing the same

Wafer level stacked die packaging

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Device including a housing for a semiconductor chip including leads extending into the housing

Semiconductor packaging device

Electronic device

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance

Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component

Electronic device

Metallic laminate and method for preparing the same

Wiring terminal-connecting adhesive

Method of forming premolded lead frame

Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component

Optical device for reducing disturbance light and manufacturing method thereof

Semiconductor device comprising a housing containing a triggering unit

Semiconductor device and method of manufacturing the same

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

Semiconductor device and manufacturing method of the same

Semiconductor device

Bump I/O contact for semiconductor device

Semiconductor package, electronic part and electronic device

Semiconductor device

SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME

Semiconductor apparatus with decoupling capacitor

Light-emitting device

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

Multilayer pillar for reduced stress interconnect and method of making same

Single shot molding method for COB USB/EUSB devices with contact pad ribs

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

BONDED SOI SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME

Roll-on encapsulation method for semiconductor packages

Method of manufacturing semiconductor device

Die offset die to bonding

Circuit module and radio communications equipment, and method for manufacturing circuit module

Dicing die attachment film and method for packaging semiconductor using same

Die offset die to die bonding

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR SUBSTRATE

Wafer structure with a buffer layer

Bond pad design for fine pitch wire bonding

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

METHOD FOR FORMING AND RELEASING INTERCONNECTS

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Memory Packages Having Stair Step Interconnection Layers

Lead frame, electronic component including the lead frame, and manufacturing method thereof

Semiconductor device having interconnected contact groups

Dual capillary IC wirebonding

Semiconductor devices

Electroconductive particle placement sheet and anisotropic electroconductive film

Multilayer printed wiring board

FLIP-CHIP MOUNTING APPARATUS

Method for producing an electric component-mounted substrate

Heat-resistant resin paste and method for producing same

Forming method of electrode and manufacturing method of semiconductor device

Manufacturing process of leadframe-based BGA packages

Wafer packaging method

Method for thin semiconductor packages

Piezoelectric devices and methods for manufacturing same

Method of reducing memory card edge roughness by edge coating

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

Method and arrangement for contact-connecting semiconductor chips on a metallic substrate

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

STACK-TYPE SEMICONDUCTOR PACKAGE

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

Power semiconductor arrangement

Semiconductor device

Semiconductor component comprising copper metallizations

Semiconductor device with copper wirebond sites and methods of making same

Semiconductor device

Method for manufacturing an electronic component package and electronic component package

Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor

Nanotube based vapor chamber for die level cooling

Semiconductor device and methods of manufacturing semiconductor devices

Semiconductor device

Method of manufacturing substrate

Comb-shaped power bus bar assembly structure having integrated capacitors

Stackable self-aligning insulative guide tray for holding semiconductor substrates

Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure

MULTI-BAND TUNABLE RESONANT CIRCUIT

Local defect memories on semiconductor substrates in a stack computer

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

Semiconductor device with conductive die attach material

Preventing breakage of long metal signal conductors on semiconductor substrates

BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME

Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards

Semiconductor device having low dielectric insulating film and manufacturing method of the same