212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Three-dimensional integrated circuit device using a wafer scale membrane
#602Semiconductor device having low dielectric insulating film and manufacturing method of the same
#603Electronic substrate, semiconductor device, and electronic device
#604Semiconductor device and semiconductor assembly with lead-free solder
#605Semiconductor package with connecting plate for internal connection
#606Power quad flat no-lead (PQFN) package
#607Electronic system modules and method of fabrication
#608Light-emitting dies incorporating wavelength-conversion materials and related methods
#609Method for manufacturing a circuit board structure
#610Dicing die bond film
#611Semiconductor device with copper wirebond sites and methods of making same
#612Method of manufacturing semiconductor device
#613Conductive lines and pads and method of manufacturing thereof
#614Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#615Semiconductor package for high power devices
#616Semiconductor device and method of manufacturing the same
#617Apparatus, system, and method for wireless connection in integrated circuit packages
#618Semiconductor structures comprising a dielectric material having a curvilinear profile
#619Microelectronic devices and methods for manufacturing microelectronic devices
#620Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#621Semiconductor device and programming method
#622Semiconductor device stack with bonding layer and wire retaining member
#623Semiconductor device and method of manufacturing the same
#624Embedded package security tamper mesh
#625Semiconductor device and manufacturing method thereof
#626Routing method for flip chip package and apparatus using the same
#627Semiconductor device with embedded interconnect pad
#628Microelectronic packages having cavities for receiving microelectronic elements
#629Semiconductor package with single sided substrate design and manufacturing methods thereof
#630Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#631Multilayer ceramic electronic device and method for manufacturing the same
#632Backside processing of semiconductor devices
#633Method of packaging a die
#634Semiconductor device including cooler
#635Method for manufacturing semiconductor package
#636Semiconductor device and method of forming bump-on-lead interconnection
#637Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
#638Mount board and electronic device
#639Semiconductor device capable of switching operation modes and operation mode setting method therefor
#640Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#641Semiconductor structure with thin film resistor and terminal bond pad
#642Stacked packaging improvements
#643Reconstituted wafer stack packaging with after-applied pad extensions
#644Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#645Semiconductor device and method of forming an embedded SOP fan-out package
#646Semiconductor device with output circuit and pad
#647Methods and apparatus for measuring analytes using large scale FET arrays
#648Apparatus, system, and method for wireless connection in integrated circuit packages
#649Bumpless build-up layer package design with an interposer
#650Bonding package components through plating
#651Method of making a stacked microelectronic package
#652Electronic device, method for producing the same, and printed circuit board comprising electronic device
#653Die edge contacts for semiconductor devices
#654Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#655Embedded semiconductive chips in reconstituted wafers, and systems containing same
#656Electronic device and method for production
#657Short and low loop wire bonding
#658Bump-on-lead flip chip interconnection
#659Power semiconductor device and method therefor
#660Semiconductor device and a method of manufacturing the same
#661Power electronic devices
#662Package-in-Package for High Heat Dissipation Having Leadframes and Wire Bonds
#663Multi-chip package and method of manufacturing thereof
#664Semiconductor power module and method of manufacturing the same
#665Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
#666Integrated chip package structure using ceramic substrate and method of manufacturing the same
#667Multi-chip package with offset die stacking and method of making same
#668Integrated circuit apparatus, systems, and methods
#669Reliable area joints for power semiconductors
#670Bonding wire for semiconductor
#671Methods of forming bonded semiconductor structures
#672Bump structure for stacked dies
#673Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV
#674Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure
#675Lead structures with vertical offsets
#676Method of fabricating a power semiconductor chip package
#677Thermally enhanced electronic package
#678Method for the wafer-level integration of shape memory alloy wires
#679Method for housing an electronic component in a device package and an electronic component housed in the device package
#680Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
#681Semiconductor package with embedded die
#682Printed wiring board and method for manufacturing printed wiring board
#683Method of manufacturing leadless integrated circuit packages having electrically routed contacts
#684Interconnection element with posts formed by plating
#685Circuit device
#686Circuit device
#687Circuit device
#688Circuit device and method for manufacturing same
#689Semiconductor module with a semiconductor chip and a passive component and method for producing the same
#690Semiconductor device fabrication method capable of scribing chips with high yield
#691Method for producing a component and device comprising a component
#692Chip pad resistant to antenna effect and method
#693Semiconductor device
#694SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION
#695Method to realize flux free indium bumping
#696Off-chip vias in stacked chips
#697Leadless array plastic package with various IC packaging configurations
#698Process for direct bonding two elements comprising copper portions and portions of dielectric materials
#699Etching solution for copper or copper alloy
#700Indium compositions
#701Connecting elements for producing hybrid electronic circuits
#702Semiconductor packages and methods of fabricating the same
#703RFID tags and processes for producing RFID tags
#704Wireless communication system
#705Deformable network structure
#706Multifunction sensor as PoP microwave PCB
#707Bonded processed semiconductor structures and carriers
#708Semiconductor device
#709Junction material, manufacturing method thereof, and manufacturing method of junction structure
#710Method of cutting semiconductor substrate
#711Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#712Microelectronic package
#713Molded leadframe substrate semiconductor package
#714Integrated circuit chip using top post-passivation technology and bottom structure technology
#715Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die
#716Semiconductor device bonding with stress relief connection pads
#717Semiconductor device including a stress buffer material formed above a low-k metallization system
#718Room temperature metal direct bonding
#719Power semiconductor module with method for manufacturing a sintered power semiconductor module
#720Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
#721Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#722High density sensor array without wells
#723Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#724Misalignment detection devices
#725Package-in-package using through-hole via die on saw streets
#726Method for producing at least one optoelectronic semiconductor component
#727Printed wiring board and method for manufacturing the same
#728Core-jacket bonding wire
#729Methods and apparatus for measuring analytes using large scale FET arrays
#730Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
#731Multilayer printed wiring board
#732Package manufacturing method and semiconductor device
#733Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)
#734Packaged microdevices and methods for manufacturing packaged microdevices
#735Semiconductor component and corresponding production method
#736Semiconductor device
#737System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
#738Semiconductor device and method of manufacturing the same
#739Method of manufacturing a wiring board having pads highly resistant to peeling
#740Molding method for COB-EUSB devices and metal housing package
#741Bump pad structure
#742Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate
#743Electronic component mounting apparatus and the same method thereof
#744Module and production method
#745Power semiconductor device with reduced contact resistance
#746Light emitting device package and method of fabricating the same
#747Semiconductor device and method for manufacturing the same
#748Method of fabricating a packaged semiconductor
#749Alloy wire and methods for manufacturing the same
#750ESD protection device
#751Method of manufacturing printed wiring board
#752Production apparatus of composite silver nanoparticle
#753COMPOSITE ALLOY BONDING WIRE
#754Wafer-to-wafer stack with supporting post
#755MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE
#756Semiconductor package including flip chip controller at bottom of die stack
#757Chip on wafer bonder
#758Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
#759Electrically bonded arrays of transfer printed active components
#760Semiconductor device having a chip mounting portion on which a separated plated layer is disposed
#761Semiconductor package having internal shunt and solder stop dimples
#762Method for forming a reliable solderable contact
#763Semiconductor device including a protective film
#764Solderable contact and passivation for semiconductor dies
#765Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die
#766Monolithic semiconductor switches and method for manufacturing
#767Anisotropic conductive material and method for manufacturing same
#768Bonding material for semiconductor devices
#769Semiconductor device and methods of manufacturing semiconductor devices
#770Semiconductor device including cladded base plate
#771Wafer level chip scale package
#772Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#773Semiconductor device and manufacturing method thereof
#774Wire loops, methods of forming wire loops, and related processes
#775Die power structure
#776Semiconductor device with wireless communication
#777Method for developing a custom device
#778Microelectronic package and method of manufacturing same
#779Resin paste composition
#780Semiconductor device
#781Sensor device manufacturing method and sensor device
#782Resin composition and semiconductor device produced by using the same
#783Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
#784Compact wirebonded power quad flat no-lead (PQFN) package
#785Support mounted electrically interconnected die assembly
#786Hermetic Surface Mount Packages for Diodes and Transistors
#787ESD protection device
#788Semiconductor device
#789Multilayer adhesive sheet and method for manufacturing electronic component
#790Electrical device with protruding contact elements and overhang regions over a cavity
#791Electrochemical deposition apparatus
#792METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
#793Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
#794Tape attaching device and tape attaching method
#795Method of sealing and contacting substrates using laser light and electronics module
#796Semiconductor device
#797Method of manufacturing an electronic device package
#798Chips having rear contacts connected by through vias to front contacts
#799Manufacturing method of semiconductor device
#800Method for producing chip stacks, and a carrier for carrying out the method
#801Mounting method for semiconductor light emitter using resist with openings of different sizes
#802Semiconductor integrated circuit device and method of manufacturing same
#803Semiconductor structure and method for making same
#804Semiconductor device including cladded base plate
#805Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same
#806Semiconductor device
#807RFID antenna modules and methods of making
#808Method of manufacturing esterified substance
#809Semiconductor device and method of manufacturing the same
#810Method for manufacturing a package-on-package type semiconductor device
#811Electronic component and method for producing same
#812Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#813Pillar structure having a non-planar surface for semiconductor devices
#814Inductive loop formed by through silicon via interconnection
#815Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board
#816DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME
#817Method for manufacturing a circuit device
#818FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE
#819Semiconductor chip device with solder diffusion protection
#820STACKED INTEGRATED CIRCUIT PACKAGES THAT INCLUDE MONOLITHIC CONDUCTIVE VIAS
#821Light-reflective anisotropic conductive adhesive agent, and light emitting device
#822Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
#823Method and apparatus for fabricating integrated circuit device using self-organizing function
#824Semiconductor arrangement
#825Semiconductor device including a recess formed above a semiconductor chip
#826METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS
#827Method for permanent connection of two metal surfaces
#828Semiconductor device and method of manufacturing the same
#829LEAD FRAME, AND LIGHT EMITTING DIODE MODULE HAVING THE SAME
#830Light emitting device and method for manufacturing light emitting device
#831Multilayer printed circuit board
#832Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
#833Semiconductor device comprising through-electrode interconnect
#834Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
#835Microelectronic package with terminals on dielectric mass
#836Power semiconductor chip having two metal layers on one face
#837Semiconductor device
#838Wafer-level chip scale package
#839Semiconductor element-embedded wiring substrate
#840Flip chip interconnection having narrow interconnection sites on the substrate
#841PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE
#842Semiconductor device
#843Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#844Dual metal for a backside package of backside illuminated image sensor
#845Copper column
#846Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#847Fused buss for plating features on a semiconductor die
#848Semiconductor device
#849Semiconductor device
#850Method for Making a Stackable Package
#851Semiconductor device and a method of manufacturing the same
#852Semiconductor device
#853Semiconductor device and method of manufacturing the same
#854Method of manufacturing a semiconductor device
#855SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
#856Void-Free Implantable Hermetically Sealed Structures
#857Methods and apparatus for measuring analytes using large scale FET arrays
#858Integrated antennas in wafer level package
#859METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
#860Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#861Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking
#862Bump I/O contact for semiconductor device
#863Electronic assembly including an embedded electronic component
#864Methods and apparatus for measuring analytes using large scale FET arrays
#865Methods and apparatus for measuring analytes using large scale FET arrays
#866IC card and booking-account system using the IC card
#867Electrical barrier layers
#868Method for producing a wafer provided with chips
#869Stackable semiconductor assemblies and methods of manufacturing such assemblies
#870Laminate electronic device
#871Carrier structures for microelectronic elements
#872Circuit board and process for producing the same
#873Semiconductor element-embedded substrate, and method of manufacturing the substrate
#874SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
#875SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
#876Semiconductor device including a contact clip having protrusions and manufacturing thereof
#877Oblique parts or surfaces
#878Ball-limiting-metallurgy layers in solder ball structures
#879Method of manufacturing a circuit substrate
#880Electronic device
#881METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A HEAT SPREADER
#882Method of manufacturing semiconductor device
#883Planar light-emitting module
#884Semiconductor device and manufacturing method thereof
#885Semiconductor device
#886Conductive connecting member and manufacturing method of same
#887Electrically conductive paste, and electrically conducive connection member produced using the paste
#888Semiconductor device and a method of manufacturing the same
#889Stacked semiconductor device and fabrication method for same
#890METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK
#891Die attached to a support member by a plurality of adhesive members
#892PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
#893Connecting film, and joined structure and method for producing the same
#894Method for Predetermined Component Placement to a Target Platform
#895Method for Predetermined Component Placement to a Target Platform
#896Method for manufacturing a through hole electrode substrate
#897Method of cutting semiconductor substrate
#898Through wafer vias and method of making same
#899Semiconductor die package and method for making the same
#900Fabrication method of semiconductor integrated circuit device