Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same

Four D device process and structure

Semiconductor device having low on resistance

Surface finish for wirebonding

Semiconductor device including a protective film

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program

Semiconductor device and a method of manufacturing the same

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Apparatus for fluid guided self-assembly of microcomponents

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device and method for manufacturing the same

Circuit module and method of manufacturing the same

Microelectronic packages having cavities for receiving microelectronic elements

3D IC method and device

Electrical barrier layers

Semiconductor component with a monocrystalline semiconductor region arranged in a via region

Off-chip vias in stacked chips

Semiconductor device with mechanical lock features between a semiconductor die and a substrate

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Method of making a stacked microelectronic package

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same

Method of manufacturing a carrier tape

Semiconductor device and method of forming bump-on-lead interconnection

Semiconductor device and method for manufacturing semiconductor device

Method for low temperature bonding and bonded structure

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Module comprising a semiconductor chip

Manufacture of a circuit board and circuit board containing a component

Semiconductor device with output circuit and pad arrangements

Three dimensional device integration method and integrated device

Semiconductor device including a buffer layer structure for reducing stress

Semiconductor device

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Semiconductor device

Semiconductor device

Semiconductor package with conductive clip

Power semiconductor package with conductive clip and related method

Semiconductor device and method of manufacturing same

Microelectronic elements with post-assembly planarization

Mixed alloy solder paste

Microelectronic packages with nanoparticle joining

RFID tags and processes for producing RFID tags

Solder paste, joining method using the same and joined structure

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Semiconductor device and a method of manufacturing the same

Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates

Semiconductor device

Semiconductor device

Bonded processed semiconductor structures and carriers

Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap

Mixed alloy solder paste

Impedance controlled electrical interconnection employing meta-materials

Package assembly having a semiconductor substrate

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device with through silicon via and alignment mark

Semiconductor device

Semiconductor device

Semiconductor device

Wireless communication system

Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same

Optoelectronic system

Apparatus, system, and method for wireless connection in integrated circuit packages

Semiconductor device

Grid array connection device and method

Molding method for COB-EUSB devices and metal housing package

Formation of alpha particle shields in chip packaging

Method for manufacturing an electronic module and an electronic module

Light-emitting dies incorporating wavelength-conversion materials and related methods

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package

Semiconductor device with sealed semiconductor chip

Three-dimensional integrated circuit device fabrication including wafer scale membrane

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Stacked microelectronic devices

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Electrochemical deposition method

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Semiconductor element

Semiconductor device and method of manufacturing semiconductor device

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Ball grid array semiconductor package and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device and manufacturing method thereof

Wafer-level flip chip device packages and related methods

Stacked packaging improvements

Semiconductor device for battery power voltage control

Semiconductor device and method of manufacturing

Junction and electrical connection

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Printed wiring board and method for manufacturing the same

Polymeric binders incorporating light-detecting elements

Multiple access over proximity communication

Light-reflective anisotropic conductive adhesive agent, and light emitting device

Method of room temperature covalent bonding

ESD protection device

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor packages and methods of packaging semiconductor devices

Substrateless power device packages

Semiconductor device and method of forming pad layout for flipchip semiconductor die

METHOD OF MANUFACTURING CHIP PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING CHIP PACKAGE

Multilayer pillar for reduced stress interconnect and method of making same

Semiconductor package including multiple chips and separate groups of leads

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

SEMICONDUCTOR DEVICE

Methods to fabricate a radio frequency integrated circuit

Method for manufacturing a fan-out WLP with package

Electronic module

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor device sealed in a resin section and method for manufacturing the same

Pad configurations for an electronic package assembly

Wafer scale package for high power devices

Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation

Bump pad structure

Multi-function and shielded 3D interconnects

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device and method of forming thermal lid for balancing warpage and thermal management

Heat-transfer structure

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Methods of fluxless micro-piercing of solder balls, and resulting devices

Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system

Semiconductor device and method of manufacturing same

Semiconductor device and a method of manufacturing the same

Electronic devices with yielding substrates

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Apparatus for thermal melting process and method of thermal melting process

Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing

Method of forming an integrated inductor by dry etching and metal filling

Semiconductor device and method for fabricating the same

Dual lead frame semiconductor package and method of manufacture

Room temperature metal direct bonding

Method of making a pillar structure having a non-metal sidewall protection structure

Semiconductor device and method for manufacturing the same

Semiconductor device including cooler

Semiconductor device and radio communication device

Light-emitting apparatus

Semiconductor device

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Method for producing reconstituted wafers with support of the chips during their encapsulation

Semiconductor device

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor package with single sided substrate design and manufacturing methods thereof

Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier

Wireless communication system

Apparatus and method for embedding components in small-form-factor, system-on-packages

Compliant interconnects in wafers

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

Method of making a conductive pillar bump with non-metal sidewall protection structure

Bonding structure and method

Method and apparatus for semiconductor device fabrication using a reconstituted wafer

Methods of forming 3-D circuits with integrated passive devices

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Dual lead frame semiconductor package and method of manufacture

Forming semiconductor chip connections

Semiconductor device including DC-DC converter

Semiconductor device

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Wafer backside interconnect structure connected to TSVs

Stackable package by using internal stacking modules

Semiconductor device and method of forming high routing density interconnect sites on substrate

Chip embedded substrate and method of producing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device including a DC-DC converter

Wafer backside interconnect structure connected to TSVs

Semiconductor device and a method of manufacturing the same

Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus

Semiconductor packages and methods of fabricating the same

Resin-sealed semiconductor device and associated wiring and support structure

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Impedance controlled packages with metal sheet or 2-layer rdl

Solder joint flip chip interconnection

Carrier tape for tab-package and manufacturing method thereof

Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same

System and method of sensing current in a power semiconductor device

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

Semiconductor device and method for manufacturing the same

Semiconductor device, method for manufacturing the same, and electronic device

Method of manufacturing semiconductor device

Power module having stacked flip-chip and method for fabricating the power module

Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor component comprising copper metallizations

Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure

Printed circuit board

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Solder in cavity interconnection technology

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device with a connection pad in a substrate and method for production thereof

Window ball grid array (BGA) semiconductor packages

Semiconductor device

Semiconductor device including a plurality of magnetic shields

Wafer level chip scale package and process of manufacture

Semiconductor package and method of forming the same

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Discrete phosphor chips for light-emitting devices and related methods

Semiconductor package including multiple chips and separate groups of leads

Isolation structure for stacked dies

Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer

Semiconductor module system having encapsulated through wire interconnect (TWI)

Structure and method of forming a pad structure having enhanced reliability

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device, semiconductor package, and electronic device

Method for forming a thin semiconductor device

Wafer leveled chip packaging structure and method thereof

Flow underfill for microelectronic packages

Semiconductor device

Semiconductor die mount by conformal die coating

Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program

Circuit module and method of manufacturing the same

Method for low temperature bonding and bonded structure

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Semiconductor device including cooler

Extended redistribution layers bumped wafer

Sonotrode with cutting mechanism

Method of manufacturing semiconductor device

External storage device and method of manufacturing external storage device

3D IC method and device

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Semiconductor device including passivation layer encapsulant

Three-dimensional structure in which wiring is provided on its surface

Semiconductor device with through silicon via and alignment mark

Three-dimensional structure for wiring formation

Polymer matrices for polymer solder hybrid materials

System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates

Semiconductor device and method of manufacturing the same

Dicing tape-integrated film for semiconductor back surface

Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die

Wafer-level flip chip device packages and related methods

Microelectronic package with terminals on dielectric mass

Semiconductor device

Semiconductor die package and method for making the same

Method for top-side cooled semiconductor package with stacked interconnection plates

Semiconductor package and process for fabricating same

Semiconductor device

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Method of manufacturing a semiconductor device using markings on both lead frame and sealing body

Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions

Electronic component device

Semiconductor device and production method therefor

Packaged microelectronic components

Semiconductor device and semiconductor package containing the same

Semiconductor device

Semiconductor device having conductive pads and a method of manufacturing the same

Method for producing an optoelectronic semiconductor component

Semiconductor packages utilizing leadframe panels with grooves in connecting bars

Method of manufacturing semiconductor device

Method for fabricating a semiconductor and semiconductor package

Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values

Memory device, laminated semiconductor substrate and method of manufacturing the same

Semiconductor package having multi-phase power inverter with internal temperature sensor

Microelectronic assembly with impedance controlled wirebond and reference wirebond

Laminate electronic device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device having electrode pads arranged between groups of external electrodes

Control and driver circuits on a power quad flat no-lead (PQFN) leadframe

Power quad flat no-lead (PQFN) package having control and driver circuits

Integrated antennas in wafer level package

Semiconductor device and method for manufacturing thereof

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Wire bondable surface for microelectronic devices

Routing layer for mitigating stress in a semiconductor die

Semiconductor device and a method of manufacturing the same

Semiconductor device and production method therefor

Structures embedded within core material and methods of manufacturing thereof

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Semiconductor package with bonding wires of reduced loop inductance

Semiconductor device and a method of manufacturing the same

Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)

Dual-leadframe multi-chip package

Semiconductor chip device with polymeric filler trench

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Semiconductor device

Power quad flat no-lead (PQFN) package in a single shunt inverter circuit

Open source power quad flat no-lead (PQFN) package

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Semiconductor device with stacked semiconductor chips

Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Semiconductor device

Semiconductor device including semiconductor chip mounted on lead frame

Semiconductor chip and film and tab package comprising the chip and film

Semiconductor packaging method using connecting plate for internal connection

Method for producing semiconductor device

Integrated circuit device

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Microelectronic packages with nanoparticle joining

Semiconductor device and lead frame used for the same

Semiconductor device and method for manufacturing thereof

Semiconductor device with protective layer over exposed surfaces of semiconductor die