Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Semiconductor device

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same

Flip chip substrate design

Semiconductor device having transferred integrated circuit

Semiconductor package

Process of manufacturing a solder-fill for applying to semiconductor package

Method and system for stud bumping

Coupler resource module

Electrical contact and connector and method of manufacture

Electrical contact and connector and method of manufacture

Bond pad techniques for integrated circuits

Diffusion solder position, and process for producing it

Ball film for integrated circuit fabrication and testing

Semiconductor device and manufacturing method thereof

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Microbeam assembly and associated method for integrated circuit interconnection to substrates

Super high density module with integrated wafer level packages

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Electronic part mounting substrate and method for producing same

Direct write™ system

Semiconductor device with staggered electrodes and increased wiring width

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Flip chip stacked package

Multi-dice chip scale semiconductor components

Pad structures including insulating layers having a tapered surface

Adhesive sheet for producing a semiconductor device

Electronic devices with small functional elements supported on a carrier

High-frequency chip packages

Integrated circuit package having inductance loop formed from a bridge interconnect

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween

Thermal conductive material utilizing electrically conductive nanoparticles

Solder-fill application for mounting semiconductor chip on PCB

Wafer-level chip scale package

Wirebonding insulated wire and capillary therefor

Wire bonding for thin semiconductor package

Electronic parts packaging structure and method of manufacturing the same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Process for making contact with and housing integrated circuits

Device transfer method and panel

High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system

Electric circuit substrate

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device

Microelectronic assemblies with springs

Flip chip die bond pads, die bond pad placement and routing optimization

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Ball grid array package, stacked semiconductor package and method for manufacturing the same

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

Encasing arrangement for a semiconductor component

Coolant cooled type semiconductor device

Circuit device

Semiconductor device

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Semiconductor device including a semiconductor chip mounted on a metal base

Interconnections

Method of fabricating a light emitting device

Aqueous based metal etchant

Diode cutoff and safe packaging method for textile detonating cord

Method of metal sputtering for integrated circuit metal routing

Electrical socket having terminals with elongated mating beams

Singulation method used in leadless packaging process

Semiconductor device and production method therefor

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Process for producing a semiconductor device

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Method for manufacturing semiconductor devices

Electronic component and method for manufacturing the same

CSP semiconductor device having signal and radiation bump groups

Semiconductor package using flexible film and method of manufacturing the same

Wire bonding method for copper interconnects in semiconductor devices

Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

Die-up ball grid array package including a substrate having an opening and method for making the same

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Semiconductor package having light sensitive chips

Probe card assembly

Photo detector for weak light

Encapsulated component which is small in terms of height and method for producing the same

Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads

Low fabrication cost, fine pitch and high reliability solder bump

Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Fabrication method of semiconductor device

Method for creating flip-chip conductive-polymer bumps using photolithography and polishing

Lead frame, semiconductor device using the same and method of producing the semiconductor device

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

Method for creating adhesion during fabrication of electronic devices

Semiconductor device and wire bonding apparatus

Tin/indium lead-free solders for low stress chip attachment

Multi-functional solder and articles made therewith, such as microelectronic components

Semiconductor apparatus and method of manufacturing the same

Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

Integrated circuit package with overlapping bond fingers

Stacked mass storage flash memory package

Module with embedded semiconductor IC and method of fabricating the module

Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

Topless semiconductor package

Semiconductor module and DC-DC converter

Protection circuit device using MOSFETs and a method of manufacturing the same

Semiconductor device and method of manufacturing the same

Light-emitting diode array

Method for manufacturing photodetector for weak light

Multi-functional solder and articles made therewith, such as microelectronic components

Wire bonders and methods of wire-bonding

Method for checking the quality of a wedge bond

Circuit board

Process for the production of improved metallized films

Multi-functional solder and articles made therewith, such as microelectronic components

Contact structures and methods for making same

Method for producing a semiconductor device in chip format

Integrated underfill process for bumped chip assembly

Semiconductor processing methods

Fabrication of stacked microelectronic devices

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Bonding structure with pillar and cap

Semiconductor integrated circuit device

Fabrication of stacked microelectronic devices

Conductive block mounting process for electrical connection

Manufacturing method of semiconductor device

Packaged microelectronic components

Method of manufacturing a semiconductor device

Power supply device

Low-inductance circuit arrangement for power semiconductor modules

High frequency circuit using high output amplifier cell block and low output amplifier cell block

Semiconductor device and semiconductor device manufacturing method

Pad over active circuit system and method with meshed support structure

Nickel bonding cap over copper metalized bondpads

High reliability chip scale package

Semiconductor device with strain relieving bump design

Method for assembling a ball grid array package with multiple interposers

Solder pads and method of making a solder pad

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Semiconductor device and its manufacturing method

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Stacked chip-packaging structure

Packaged microelectronic devices and methods of forming same

Method for fabricating semiconductor component with chip on board leadframe

Semiconductor component having chip on board leadframe

Electronic device package

Standoffs for centralizing internals in packaging process

Semiconductor device and manufacturing method thereof

Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps

Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses

Telemetry system for use with microstimulator

Nickel bonding cap over copper metalized bondpads

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Bumping process

Methods of forming conductive structures including titanium-tungsten base layers and related structures

Method and apparatus for attaching microelectronic substrates and support members

Multiple substrate microelectronic devices and methods of manufacture

Methods and devices for providing bias to a monolithic microwave integrated circuit

Module part

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor component having conductors with wire bondable metalization layers

Semiconductor device with connections for bump electrodes

Structure of multi-tier wire bonding for high frequency integrated circuit

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Interconnecting component

Ball grid array structures having tape-based circuitry

Method of stacking semiconductor element in a semiconductor device

Semiconductor device and switching element

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Method for forming a chip package

Light-emitting semiconductor component

Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device

Forming tool for forming a contoured microelectronic spring mold

Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus

Method, system, and apparatus for transfer of dies using a pin plate

Substrate holder and plating apparatus

Method for forming a bond pad interface

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Underfill method

Stencil mask design method and under bump metallurgy for C4 solder bump

Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

Electronic component-built-in module

Semiconductor assembly encapsulation mold and method for forming same

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Semiconductor interconnect having compliant conductive contacts

Semiconductor device including a diffusion layer

Semiconductor device having chip size package with improved strength

Enhanced die-down ball grid array and method for making the same

Modular power semiconductor module

Semiconductor device including inclined cut surface and manufacturing method thereof

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Dual gauge leadframe

Semiconductor device including a potential drawing portion formed at a corner

Semiconductor device

Semiconductor device having a flip-chip construction

Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET

Semiconductor device wiring structure

Method of fabricating an electronic device

Semiconductor manufacturing apparatus, and method for manufacturing semiconductor device

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby

Wafer level bumping process

Method for forming a bonding pad of a semiconductor device including a plasma treatment

Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs

Electronic semiconductor device having a thermal spreader

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument

Manufacturing method of semiconductor device, including differently spaced bump electrode arrays

Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it

Method, system, and apparatus for transfer of dies using a die plate having die cavities

Laminated sheet

Interlayer dielectric and pre-applied die attach adhesive materials

Method, system, and apparatus for authenticating devices during assembly

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and method of manufacturing the same

Semiconductor device, manufacturing method thereof, electronic device, electronic equipment

Packaging assembly and method of assembling the same

Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board

Semiconductor device and method of fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor device having aluminum and metal electrodes and method for manufacturing the same

Pre-back-grind and underfill layer for bumped wafers and dies

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device

Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode

Method for packaging electronic modules and multiple chip packaging

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument

Semiconductor device

Integrated semiconductor power device for multiple battery systems

Semiconductor device and method for manufacturing the same

Fabrication method for stacked multi-chip package

High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same

Semiconductor packages for enhanced number of terminals, speed and power performance

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Surface mount multichip devices

Arrangement comprising a capacitor

Method of fabricating semiconductor memory device and semiconductor memory device driver

Circuit board with built-in electronic component and method for manufacturing the same

Method for opening the plastic housing of an electronic module

Method, system, and apparatus for high volume transfer of dies

Method and apparatus for low temperature copper to copper bonding

Method and apparatus for low temperature copper to copper bonding

Three-dimensional stacked substrate arrangements

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor device

Manufacturing method of a semiconductor device

Micro lead frame package

Semiconductor package production method and semiconductor package

Semiconductor device manufacturing method

Methods relating to the reconstruction of semiconductor wafers for wafer-level processing

Semiconductor device fabrication method

Method and apparatus for non-conductively interconnecting integrated circuits

System and method for controlling integrated circuit die height and planarity

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Corrosion-resistant copper bond pad and integrated device

Chip scale package and method of fabricating the same

Semiconductor module in which a semiconductor package is bonded on a mount substrate

Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device

Leadless leadframe package substitute and stack package

Method for forming semiconductor device including stacked dies

Semiconductor device and lead frame

Method of mounting electronic part and flux-fill

Moly mask construction and process

Wafer bonding using boron and nitrogen based bonding stack

Flip chip cavity package

Molded leadframe substrate semiconductor package

Integrated chip package structure using silicon substrate and method of manufacturing the same

Chip package with die and substrate