System and method for increasing the ball pitch of an electronic circuit package

Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

Methods of forming solder areas on electronic components and electronic components having solder areas

Wire bonding apparatus and method for clamping a wire

Electronic parts built-in substrate and method of manufacturing the same

Castellation wafer level packaging of integrated circuit chips

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Method of manufacturing a semiconductor device and a semiconductor device

Semiconductor component and method for fabricating

Inverted J-lead for power devices

Structure and method for fabricating a bond pad structure

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device

Semiconductor device and the method of producing the same

Semiconductor device and method for fabricating the same

Solder bump structure for flip chip package and method for manufacturing the same

Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board

Ball grid array package substrates with a modified central opening and method for making the same

Bonding pads with dummy patterns in semiconductor devices and methods of forming the same

Semiconductor packages for enhanced number of terminals, speed and power performance

Microelectronic device signal transmission by way of a lid

Thin, thermally enhanced molded package with leadframe having protruding region

Mounting method of bump-equipped electronic component and mounting structure of the same

Bonding apparatus and bonding external appearance inspection device

Nano-metal composite made by deposition from colloidal suspensions

Method of incorporating interconnect systems into an integrated circuit process flow

Connector for making electrical contact at semiconductor scales

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Method for embedding a component in a base and forming a contact

Fan out type wafer level package structure and method of the same

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Semiconductor device and a method of manufacturing the same

Internally reinforced bond pads

Offset-bonded, multi-chip semiconductor device

Component

Semiconductor device manufacturing method and semiconductor device manufactured thereby

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Configuration for testing the bonding positions of conductive drops and test method for using the same

Method for the hermetic encapsulation of a component

Semiconductor device package utilizing proud interconnect material

Semiconductor device manufacturing method and manufacturing apparatus

Thinned die integrated circuit package

Semiconductor device

Semiconductor device with stacked chips

Method for fabricating chip package

Multi-chips bumpless assembly package and manufacturing method thereof

Stackable integrated circuit packaging

Semiconductor device and method for fabricating the same

Thin package for stacking integrated circuits

Method for making dual gauge leadframe

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Semiconductor device

Multi-part capillary

Electroplating method for a semiconductor device

Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Techniques for joining an opto-electronic module to a semiconductor package

Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip

Stacked semiconductor device

Semiconductor interconnect having conductive spring contacts

Selective deposition of solder ball contacts

Semiconductor device and method of manufacturing the same

Semiconductor testing device

Method of making multichip wafer level packages and computing systems incorporating same

Method of interconnecting die and substrate

Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body

Formation of circuitry with modification of feature height

Semiconductor device and manufacturing method thereof

Light emitting diode lamp

Method of manufacturing a solid state image sensing device

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method

Method for anodic bonding of wafers and device

Semiconductor device and method of fabricating the same

Electronics circuit manufacture

Bonding structure with buffer layer and method of forming the same

Light source apparatus with light-emitting chip which generates light and heat

Semiconductor device and method of making the same

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Bump-on-lead flip chip interconnection

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Multi-concentric pad arrangements for integrated circuit pads

Encapsulated chip and procedure for its manufacture

Opto-electronic element with a metallized carrier

Low temperature solder chip attach structure and process to produce a high temperature interconnection

Low loop height ball bonding method and apparatus

Flip chip bonding tool tip

Bonding apparatus

Bonding tool with resistance

Device having a complaint element pressed between substrates

Film adhesives containing maleimide compounds and methods for use thereof

Wire bonding process for copper-metallized integrated circuits

Method of manufacturing a semiconductor device

Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument

Method of applying a pattern of particles to a substrate

Structure and method for lead free solder electronic package interconnections

Conductive bumps with insulating sidewalls and method for fabricating

Bond pad for flip chip package

Conductive bumps with non-conductive juxtaposed sidewalls

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Seedless wirebond pad plating

Use of palladium in IC manufacturing with conductive polymer bump

Wafer-level package and its manufacturing method

Circuit device and manufacturing method thereof

Semiconductor device with magnetically permeable heat sink

Wafer level stack structure for system-in-package and method thereof

Electronic device with reduced entrapment of material between die and substrate electrical connections

Semiconductor device

Molded leadless package having a partially exposed lead frame pad

Semiconductor device and manufacturing method thereof

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Compliant interconnect assembly

Method of manufacturing a semiconductor device

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Techniques for joining an opto-electronic module to a semiconductor package

Mounting method for a semiconductor component

Semiconductor package

Semiconductor package board using a metal base

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

Semiconductor device

Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

Apparatus and method for mounting electronic components

Ball mounting method

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Fabrication method of semiconductor package with heat sink

Semiconductor device and manufacturing method thereof

Structure and method of making capped chips having vertical interconnects

Process for strengthening semiconductor substrates following thinning

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Fabrication method of semiconductor integrated circuit device

Wire loop height measurement apparatus and method

Stacked semiconductor device including improved lead frame arrangement

Chip scale packaged semiconductor device

Semiconductor device

Bonding pad structure

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Electronic circuit device, and method and apparatus for manufacturing the same

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Semiconductor device and method for fabricating the same

Multi-surface contact IC packaging structures and assemblies

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor device having metal plates and semiconductor chip

Multi-surface IC packaging structures and methods for their manufacture

Flip-chip sub-assembly, methods of making same and device including same

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Modular power semiconductor module

Semiconductor device

Plastic package and method of fabricating the same

Chip package with die and substrate

Semiconductor device and method of fabricating the same

IC package with stacked sheet metal substrate

Technique for attaching die to leads

Semiconductor device and wire bonding method

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Bath and method for high rate copper deposition

Circuit device

Chip package with die and substrate

Method of forming multi-piled bump

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Circuit device

No-flow underfill composition and method

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Back-face and edge interconnects for lidded package

Semiconductor chip package and method for making the same

Circuit device

Microelectronic component and assembly having leads with offset portions

Electronic substrate, power module and motor driver

Chip scale package and method of fabricating the same

Method for fabricating a semiconductor package with multi layered leadframe

Semiconductor device and fabrication method for the same

Automated filament attachment system for vacuum fluorescent display

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

Device for processing a wire

Radio frequency unit analog level detector and feedback control system

Method for forming metal contacts on a substrate

Structure and method of making capped chips using sacrificial layer

Method of electrically connecting a microelectronic component

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

RF amplifier

Method for producing semiconductor device and semiconductor device

Resin-sealed semiconductor device

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor component and production method suitable therefor

Semiconductor device

Simplified stacked chip assemblies

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Chip package and electrical connection structure between chip and substrate

Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus

Large bumps for optical flip chips

Large bumps for optical flip chips

Methods for forming patterns on a filled dielectric material on substrates

Self-locking wire bond structure and method of making the same

Die bonding apparatus and method for bonding semiconductor chip using the same

Method for low temperature bonding and bonded structure

Wirebond structure and method to connect to a microelectronic die

Method for producing a multichip module and multichip module

Semiconductor radiation emitter package

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Semiconductor device having heat radiation plate and bonding member

Integrated circuit package

Package type semiconductor device

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Ball grid array package with patterned stiffener surface and method of assembling the same

Anisotropic conductive film

Bonding tool with polymer coating

Tin deposition

Inter-chip and intra-chip wireless communications systems

Method of manufacturing a semiconductor device including a bump forming process

Process for producing resin-sealed type electronic device

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Pad structure for stress relief

Method for manufacturing solid-state imaging devices

Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

Method of using pre-applied underfill encapsulant

Integrated circuit with dual electrical attachment PAD configuration

Semiconductor device with electrode pad having probe mark

Semiconductor device and method of fabricating the same

Semiconductor device having heat conducting plate

Semiconductor device and method of fabricating the same

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Multichip wafer level packages and computing systems incorporating same

Method of forming low wire loops and wire loops formed using the method

Wafer-level moat structures

Devices and methods employing high thermal conductivity heat dissipation substrates

Method of manufacturing a semiconductor device

Method of manufacturing electronic device and method of manufacturing electro-optical device

Method of producing an electronic component and a panel with a plurality of electronic components

Substrate having built-in semiconductor apparatus and manufacturing method thereof

Electronic parts built-in substrate and method of manufacturing the same

Semiconductor device with multilayered metal pattern

Semiconductor device and method of manufacturing the same

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Pressure-contactable power semiconductor module

Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device

Hybrid integrated circuit device and method of manufacturing the same

Method of manufacturing a module

Manufacturing method of electronic components embedded substrate

ULTRA-FINE CONTACT ALIGNMENT

Methods relating to forming interconnects and resulting assemblies

System having semiconductor component with encapsulated, bonded, interconnect contacts

Electrical or electronic component and method of producing same

Method for manufacturing an electronic circuit device and electronic circuit device

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Resin composition for encapsulating semiconductor device

Integrated circuit die/package interconnect

Microelectronic devices and methods for packaging microelectronic devices

Semiconductor package

Designs and methods for conductive bumps

Bonded structure using conductive adhesives, and a manufacturing method thereof

Pad structure of semiconductor device for reducing or inhibiting wire bonding cracks

Manufacturing a bump electrode with roughened face

Integrating chip scale packaging metallization into integrated circuit die structures

Semiconductor device and method for fabricating the same

Method of fabrication of semiconductor integrated circuit device

Wire bonding method and apparatus

Via placement for layer transitions in flexible circuits with high density ball grid arrays

Method for the lateral contacting of a semiconductor chip

Semiconductor apparatus and method for fabricating the same

Image sensor packages

Method of making an electronic module

Moisture-resistant electronic device package and methods of assembly

Head assembly, disk unit, and bonding method and apparatus

Semiconductor device capable of detecting an open bonding wire using weak current

Discrete semiconductor component

Apparatus and method for mounting or wiring semiconductor chips

Electrical circuit assembly with improved shock resistance

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Semiconductor device having a pair of heat sinks and method for manufacturing the same

High-frequency module and method for manufacturing the same

Semiconductor apparatus with decoupling capacitor

Circuit device and manufacturing method of circuit device

Semiconductor package with through-hole

Process for precise arrangement of micro-bodies

Thermal interface adhesive

Method for manufacturing a piezoelectric oscillator

Semiconductor device and method of manufacturing the same

Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same

Semiconductor device having fuse circuit on cell region and method of fabricating the same

Semiconductor component arrangement with a reduced oscillation tendency

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof