212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME
#1202POWER SEMICONDUCTOR DEVICE PACKAGING
#1203Semiconductor die package and method for making the same
#1204Multilayer printed wiring board
#1205Multilayer pillar for reduced stress interconnect and method of making same
#1206Increasing dielectric strength by optimizing dummy metal distribution
#1207Dummy metal design for packaging structures
#1208Semiconductor device having a semiconductor chip, and method for the production thereof
#1209Device including two mounting surfaces
#1210Routable array metal integrated circuit package fabricated using partial etching process
#1211WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL
#1212Optical element package and method of manufacturing the same
#1213SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1214Semiconductor device and method of forming integrated passive device
#1215Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices
#1216Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
#1217Achieving mechanical and thermal stability in a multi-chip package
#1218Method for the production of an electronic component and electronic component produced according to this method
#1219Semiconductor device having separated heatsink and chip mounting portion
#1220Semiconductor device
#1221Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
#1222Lead frame and semiconductor package including the same
#1223Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus
#1224SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER
#1225Chip-exposed semiconductor device
#1226Radio frequency identification device in polycarbonate and its manufacturing method
#1227Method of manufacturing semiconductor device
#1228Dicing die bonding film, semiconductor wafer, and semiconductor device
#1229INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME
#1230Semiconductor packages and methods of fabricating the same
#1231IC card and booking-account system using the IC card
#1232METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVIDING AN ELECTRONIC COMPONENT THEREIN
#1233Field barrier structures within a conformal shield
#1234SPACER FORMATION FILM, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE
#1235Semiconductor device and a method of manufacturing the same
#1236Semiconductor device
#1237Substrate bonding method and semiconductor device
#1238Semiconductor device and production method therefor
#1239Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
#1240Semiconductor device
#1241Anti-reflection structures for CMOS image sensors
#1242ADHESIVE COMPOSITION
#1243Apparatus for transporting substrates for bonding
#1244Fabrication of through-silicon vias on silicon wafers
#1245Fabrication of through-silicon vias on silicon wafers
#1246Ultrasonic wire bonding method for a semiconductor device
#1247Method of manufacturing semiconductor device including plural semiconductor chips stacked together
#1248Light-emitting diode package and wafer-level packaging process of light-emitting diode
#1249Die power structure
#1250Dual-leadframe multi-chip package and method of manufacture
#1251Integrated circuit package architecture
#1252Method for connecting a plurality of unpackaged substrates
#1253Chip pad resistant to antenna effect and method
#1254Electronic component employing a layered frame
#1255Solder paste, joining method using the same and joined structure
#1256ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
#1257CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE
#1258Semiconductor package and manufacturing method therefor
#1259SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1260Integrated circuit having a three dimensional stack package structure
#1261Light emitting semiconductor element bonded to a base by a silver coating
#1262Method of assembling two integrated circuits and corresponding structure
#1263SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
#1264Semiconductor device and method of manufacturing semiconductor device
#1265SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE
#1266Self-organizing network with chip package having multiple interconnection configurations
#1267Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
#1268SEMICONDUCTOR DEVICE
#1269Void-free wafer bonding using channels
#1270Semiconductor device, manufacturing method thereof, and electronic apparatus
#1271Metal paste with co-precursors
#1272Metal paste with oxidizing agents
#1273Apparatus for thermal melting process and method of thermal melting process
#1274Electronic assemblies including mechanically secured protruding bonding conductor joints
#1275Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus
#1276Semiconductor device and method of manufacturing the same
#1277Semiconductor device for battery power voltage control
#1278Semiconductor device with wireless communication
#1279Method for packaging semiconductor dies having through-silicon vias
#1280Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof
#1281Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
#1282SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
#1283Solder bump connections
#1284Semiconductor device including a DC-DC converter with schottky barrier diode
#1285Compliant interconnects in wafers
#1286Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections
#1287SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES
#1288Die arrangement and method of forming a die arrangement
#1289INTEGRATED CIRCUITS AND FABRICATION PROCESS THEREOF
#1290Overmolded semiconductor package with wirebonds for electromagnetic shielding
#1291Semiconductor component with a semiconductor via
#1292Chip package and method for forming the same
#1293Wiring board and electronic component device
#1294Integrated circuits secure from invasion and methods of manufacturing the same
#1295Semiconductor device including a DC-DC converter
#1296Wire bonding method and semiconductor device
#1297Multi-chip package and method of manufacturing thereof
#1298Bumpless build-up layer and laminated core hybrid structures and methods of assembling same
#1299Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof
#1300Electronic component
#1301SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE CHIP
#1302Semiconductor device and a method of manufacturing the same
#1303MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
#1304Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
#1305WIRE BONDING METHOD
#1306Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding
#1307Soft error rate mitigation by interconnect structure
#1308Thermosetting die-bonding film
#1309ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
#1310Semiconductor device having semiconductor substrate electrode pads, and external electrodes
#1311Semiconductor device and method for manufacturing the same
#1312Semiconductor device and method of manufacturing the same
#1313Solder joint flip chip interconnection
#1314MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
#1315Clip interconnect with encapsulation material locking feature
#1316TCP-type semiconductor device and method of testing thereof
#1317Compensation network for RF transistor
#1318Micro-fluidic injection molded solder (IMS)
#1319Method and device for discharging a fixed amount of liquid
#1320Methods for wafer bonding, and for nucleating bonding nanophases
#1321ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE
#1322STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES
#1323Semiconductor packages and methods of manufacturing the same
#1324Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
#1325Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
#1326Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
#1327METHOD OF MANUFACTURING WAFER LEVEL PACKAGE
#13284D Device, process and structure
#1329IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM
#1330SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME
#1331CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME
#1332Pressure application apparatus and pressure application method
#1333Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment
#1334Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die
#1335Memory device, laminated semiconductor substrate and method of manufacturing the same
#1336Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip
#1337SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
#1338Wafer level chip package and a method of fabricating thereof
#1339Solder interconnect pads with current spreading layers
#1340Semiconductor device including chip with complementary I/O cells
#1341STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING
#1342THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY
#1343Integrated circuit package and physical layer interface arrangement
#1344Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
#1345Electronic devices
#1346ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#1347DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
#1348ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET
#1349LED PACKAGE
#1350Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#1351Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
#1352Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure
#1353Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
#1354Solder mold plates used in packaging process and method of manufacturing solder mold plates
#1355Connecting and bonding adjacent layers with nanostructures
#1356Method of manufacturing a printed circuit board with an embedded electronic component
#1357METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
#1358Method Of Manufacturing Semiconductor Package Board
#1359SEMICONDUCTOR DEVICE
#1360LEAD-FREE HIGH TEMPERATURE COMPOUND
#1361SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#1362Semiconductor package with bonding wires of reduced loop inductance
#1363SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1364Stacked integrated circuit package having recessed sidewalls
#1365Microelectronic package with terminals on dielectric mass
#1366Electric part package and manufacturing method thereof
#1367Semiconductor packages and methods of packaging semiconductor devices
#1368METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#1369Conductive pads defined by embedded traces
#1370Adding cap to copper passivation flow for electroless plating
#1371Grain refinement by precipitate formation in Pb-free alloys of tin
#1372Ni plating of a BLM edge for Pb-free C4 undercut control
#1373Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
#1374Semiconductor device
#1375SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#1376Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology
#1377Semiconductor device and method of manufacturing semiconductor device
#1378Wiring method and device
#1379BONDING WIRE FOR SEMICONDUCTOR
#1380Apparatus for manufacturing a hierarchical structure
#1381Packaging or mounting a component
#1382METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM
#1383Semiconductor device manufacturing method and semiconductor device
#1384Multi-chip stacking method to reduce voids between stacked chips
#1385Laser assisted transfer welding process
#1386Composite nanometal paste of two-metallic-component type, bonding method, and electronic part
#1387BONDING SHEET
#1388In-package microelectronic apparatus, and methods of using same
#1389Quad flat package with exposed paddle
#1390Light emitting device with electrode having recessed concave portion
#1391Chip structure having redistribution layer
#1392Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#1393Flexible electronic devices and related methods
#1394Dual lead frame semiconductor package and method of manufacture
#1395Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die
#1396Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
#1397Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
#1398SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#1399Anisotropic conductive adhesive
#1400Etching composition for an under-bump metallurgy layer
#1401ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
#1402Electronic element unit and reinforcing adhesive agent
#1403Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus
#1404MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#1405Apparatus, system, and method for wireless connection in integrated circuit packages
#1406FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#1407Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#1408ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD
#1409Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
#1410Pattern layout in semiconductor device
#1411Electronic component and electronic device
#1412Multilayered printed circuit board and method for manufacturing the same
#1413CHIP PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOF
#1414Electronic device and electronic apparatus
#1415Semiconductor module
#1416Semiconductor packages
#1417LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
#1418Bonding wire for semiconductor device
#1419Interconnect assemblies and methods of making and using same
#1420Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device
#1421Semiconductor device and method of forming wafer level ground plane and power ring
#1422Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof
#1423Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#1424CHIP-ON-CHIP STRUCTURE AND MANUFACTURING METHOD THEROF
#1425No flow underfill
#1426Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure
#1427Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
#1428Substrateless power device packages
#1429SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#1430Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#1431FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE
#1432Joining method and device produced by this method and joining unit
#1433Method of operating a clamping system of a wire bonding machine
#1434Apparatus for mounting semiconductor chip
#1435Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
#1436METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE
#1437FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#1438Semiconductor package and method of manufacturing the same
#1439Semiconductor device and method of forming the same
#1440METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE
#1441Power/ground layout for chips
#1442SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#1443Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer
#1444Light emitting device and method for manufacturing same
#1445Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)
#1446ANISOTROPIC CONDUCTIVE PARTICLES
#1447System and method for packaging electronic devices
#1448Method For Low Temperature Bonding And Bonded Structure
#1449Method and system for bonding electrical devices using an electrically conductive adhesive
#1450TAPE APPLYING APPARATUS
#1451Process for realizing a connecting structure
#1452Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#1453WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME
#1454Copper alloy bonding wire for semiconductor
#1455COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF
#1456Method of producing a chip package, and chip package
#1457Integrated circuit device and structure
#1458Semiconductor device and method of manufacturing the same
#1459Semiconductor device
#1460Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die
#1461Bonding apparatus and bonding method
#1462Bonding apparatus
#1463Semiconductor device and the method of manufacturing the same
#1464Dicing/die-bonding film, method of fixing chipped work and semiconductor device
#1465Semiconductor multi-project or multi-product wafer process
#1466Semiconductor device comprising thin-film terminal with deformed portion
#1467Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same
#1468Manufacturing of a device including a semiconductor chip
#1469Semiconductor having chip stack, semiconductor system, and method of fabricating the semiconductor apparatus
#1470Semiconductor device and semiconductor package having the same
#1471Method for manufacturing semiconductor device, and semiconductor device
#1472Electronic component device, method of manufacturing the same and wiring substrate
#1473SEMICONDUCTOR DEVICE
#1474Semiconductor device including shielding layer and fabrication method thereof
#1475Massively parallel interconnect fabric for complex semiconductor devices
#1476Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device
#1477ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER
#1478Wiring board and method for manufacturing the same
#1479Method of manufacturing semiconductor device
#1480Manufacturing method of semiconductor device
#1481Semiconductor die package including low stress configuration
#1482Off-chip VIAS in stacked chips
#1483POWER MODULE AND METHOD FOR MANUFACTURING THE SAME
#1484Metal wiring structures for uniform current density in C4 balls
#1485Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad
#1486SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)
#1487Delamination resistant device package having raised bond surface and mold locking aperture
#1488Semiconductor device having a pad and plurality of interconnects
#1489Sheet-molded chip-scale package
#1490LED package
#1491ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
#1492Method of Contacting a Semiconductor Substrate
#1493Multilayered printed circuit board and method for manufacturing the same
#1494Semiconductor package having buried post in encapsulant and method of manufacturing the same
#1495Manufacturing method of semiconductor device
#1496PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT
#1497Embedded printed circuit board and method of manufacturing the same
#1498Semiconductor device and manufacturing method thereof
#1499Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
#1500Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element