Semiconductor structure and method for making same

Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same

Semiconductor structure and method for making same

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Semiconductor power module and method of manufacturing the same

Method and system for improving reliability of a semiconductor device

Circuit device having an improved heat dissipitation, and the method of manufacturing the same

Lead frame, semiconductor device, and method of manufacturing semiconductor device

Multi-chip semiconductor packages and assembly thereof

Semiconductor device and manufacturing method therefor

Semiconductor device and a method of manufacturing the same

Semiconductor package with integrated metal pillars and manufacturing methods thereof

Semiconductor device

Semiconductor module including a switch and non-central diode

METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS

Embedded printed circuit board and method of manufacturing the same

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Methods and apparatus for measuring analytes using large scale FET arrays

Chip packaging method and structure thereof

Stacked die assemblies including TSV die

Method of making a light emitting device having a molded encapsulant

Apparatus and method for mounting semiconductor light-emitting element

Integrated circuit with intra-chip clock interface and methods for use therewith

Metal can impedance control structure

Device and method for manufacturing a device

Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer

SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE

Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist

Stacked chip assembly having vertical vias

Chip assembly having via interconnects joined by plating

Ball grid array semiconductor package and method of manufacturing the same

Impedance controlled packages with metal sheet or 2-layer RDL

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Multi-function and shielded 3D interconnects

Anti-tamper microchip package based on thermal nanofluids or fluids

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Electronic device comprising a chip disposed on a pin

Resin composition and semiconductor device produced by using the same

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

Printed wiring board

Method of making a high frequency device package

Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops

Method for reducing UBM undercut in metal bump structures

Copper bonding compatible bond pad structure and method

Method of manufacture of integrated circuit packaging system with stacked integrated circuit

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE

MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Semiconductor chip device with polymeric filler trench

Simulated wirebond semiconductor package

Semiconductor device and method of manufacturing the same

Semiconductor package and method for manufacturing the same

Die structure, die arrangement and method of processing a die

Embedded ball grid array substrate and manufacturing method thereof

Semiconductor device

Semiconductor device

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Method for manufacturing electronic component, and electronic component

Semiconductor device having a pin mounted heat sink

POWER SEMICONDUCTOR MODULE HAVING SINTERED METAL CONNECTIONS, PREFERABLY SINTERED SILVER CONNECTIONS, AND PRODUCTION METHOD

Package structure for DC-DC converter

Power semiconductor chip package

Apparatus and method configured to lower thermal stresses

DICING DIE BOND FILM

Systems and methods for enabling ESD protection on 3-D stacked devices

Programmable anti-fuse wire bond pads

Power semiconductor package

Fabrication method of semiconductor integrated circuit device

Multi-chip package with offset die stacking

Layered chip package and method of manufacturing same

Die edge contacts for semiconductor devices

Semiconductor device and manufacturing method of semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Contacting means and method for contacting electrical components

Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes

Self-filleting die attach paste

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING EXPOSING A DICING LINE ON A WAFER

Method for manufacturing semiconductor device

Leadless array plastic package with various IC packaging configurations

METHOD FOR MANUFACTURING CHIP PACKAGE

Process for assembling two parts of a circuit

Method of manufacturing semiconductor device

Method for manufacturing semiconductor devices

Method of manufacturing light-emitting device

FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING THE FILM AND SEMICONDUCTOR DEVICE

Stretchable electronic device

Semiconductor apparatus, inspection method thereof and electric device

Bond pad for semiconductor die

Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulation

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same

Semiconductor storage device and a method of manufacturing the semiconductor storage device

Method and system for routing electrical connections of semiconductor chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Structures embedded within core material and methods of manufacturing thereof

Semiconductor device and method for manufacturing thereof

Bump structure with underbump metallization structure and integrated redistribution layer

Semiconductor apparatus

Stress reduction in chip packaging by using a low-temperature chip-package connection regime

Semiconductor device

Semiconductor package for forming a leadframe package

Singulation method for semiconductor package with plating on side of connectors

Semiconductor device, method for manufacturing same, and semiconductor apparatus

Semiconductor device

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Wiring board and method of manufacturing a semiconductor device

Multilevel interconnection system

Method of manufacturing semiconductor package

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Semiconductor memory device and semiconductor memory card

Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)

IMPLEMENTING MULTIPLE DIFFERENT TYPES OF DIES FOR MEMORY STACKING

Semiconductor device production method and semiconductor device

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

Mechanisms for forming copper pillar bumps using patterned anodes

Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame

Manufacturing method of printed circuit board embedded chip

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD FOR ENCAPSULATING SEMICONDUCTOR, AND SOLVENT-BORNE SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION

Method for producing a semiconductor element

Component arrangement and method for production thereof

DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD

VERTICALLY CONTACTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

Impedance controlled electrical interconnection employing meta-materials

Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP

MANUFACTURING FAN-OUT WAFER LEVEL PACKAGING

Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner

Capillary and ultrasonic transducer for ultrasonic bonding

Method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE

Process for chip capacitive coupling

Semiconductor package and method of attaching semiconductor dies to substrates

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS

Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board

Stacked assembly including plurality of stacked microelectronic elements

Chip scale package and fabrication method thereof

Semiconductor package and manufacturing method thereof

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor integrated circuit device

Semiconductor device

Semiconductor device having a conductive layer reliably formed under an electrode pad

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electrical contact alignment posts

Flexible micro-system and fabrication method thereof

Semiconductor device and semiconductor circuit substrate

Semiconductor device and method for producing such a device

Compact semiconductor package with integrated bypass capacitor

Package and fabrication method of the same

DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL SENSOR APPARATUS

Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds

Printed wiring board and a method of manufacturing a printed wiring board

ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Method of manufacturing component embedded printed circuit board

ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY

Manufacturing method of semiconductor apparatus and semiconductor apparatus

Semiconductor device and manufacturing method thereof

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Semiconductor device having a semiconductor chip, and method for the production thereof

LIQUID ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID ENCAPSULATING RESIN COMPOSITION, AND METHOD OF MANUFACTURING THE SAME

Film for flip chip type semiconductor back surface

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Semiconductor device with die stack arrangement including staggered die and efficient wire bonding

Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module

Three-dimensional integrated circuit structure having improved power and thermal management

Electronic device and method for production

Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure

Solder interconnect on IC chip

Routable array metal integrated circuit package fabricated using partial etching process

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device

Semiconductor device cover mark

Method for manufacturing semiconductor device

Microelectronic packages with nanoparticle joining

Package structure

Semiconductor device, lead frame assembly, and method for fabricating the same

Wafer level chip scale package

Power semiconductor device

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME

PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME

Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

Method and apparatus for manufacturing three-dimensional integrated circuit

Method for forming terminal of stacked package element and method for forming stacked package

Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles

Device and manufacturing method of the same

Microelectronic elements with post-assembly planarization

RESIN SUPPLY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Semiconductor device with conductive vias between saw streets

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Methods of forming semiconductor elements using micro-abrasive particle stream

Semiconductor device

CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Multi-die stacking using bumps with different sizes

Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch

Method and package for circuit chip packaging

BONDING STRUCTURE AND METHOD

TAPE CARRIER SUBSTRATE

Semiconductor device and method of manufacturing the same

Method of assembling shielded integrated circuit device

Method of chip package build-up

Semiconductor device for driving electric motor

Thermal compress bonding

Ultrasonic horn

Ultrasonic horn

Ultrasonic horn

Method of manufacturing PCB having electronic components embedded therein

Semiconductor package and mobile device using the same

Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

Method of manufacturing wafer level package

Semiconductor device package and method of assembly thereof

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

PCB-mounted integrated circuits

DC-DC CONVERTER

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor and a method of manufacturing the same

Layered chip package and method of manufacturing same

Die package structure

Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region

Methods of forming bonded semiconductor structures

Conductive lines and pads and method of manufacturing thereof

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die

Chip package and method for forming the same

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

THERMAL FLEX CONTACT CARRIERS #2

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer

Method of manufacturing semiconductor device

Semiconductor device assembly and method thereof

Power semiconductor module and fabrication method

Electronic component module and method of manufacturing the same

Semiconductor chip and stack package having the same

Multi-chip package including chip address circuit

Backside processing of semiconductor devices

Semiconductor device and package

Microelectronic packages with dual or multiple-etched flip-chip connectors

High density chip stacked package, package-on-package and method of fabricating the same

Semiconductor device

Semiconductor device

Multi-chip package module and a doped polysilicon trench for isolation and connection

Semiconductor device having a capacitor

Conductive bumps, wire loops, and methods of forming the same

Wiring board and method for manufacturing the same

Multilayered printed circuit board and method for manufacturing the same

Method of manufacturing printed wiring board

Method of manufacturing a flexible electronic product

Thermally enhanced semiconductor package

ACTIVE ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE FOR RE-RELEASE AND DICING DIE-BONDING FILM

SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND

Semiconductor device for DC-DC converter including high side and low side semiconductor switches

Internal packaging of a semiconductor device mounted on die pads

BUMPLESS BUILD-UP LAYER PACKAGE DESIGN WITH AN INTERPOSER

Structure and process for the formation of TSVs

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Semiconductor package cooled by grounded cooler

Package for high power devices

Semiconductor package with an embedded printed circuit board and stacked die

Semiconductor device and manufacturing method thereof

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

CIRCUIT MODULE

Printed circuit board manufacturing method

Thermally and electrically enhanced ball grid array package

Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip

Contact spring application to semiconductor devices

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Manufacturing method of semiconductor packages

Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package

SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME

Wafer level package (WLP) device having bump assemblies including a barrier metal

Mold compounds in improved embedded-die coreless substrates, and processes of forming same

Testing die-to-die bonding and rework

Semiconductor integrated circuit device

Semiconductor package and manufacturing method thereof

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

Semiconductor device having semiconductor substrate, and method of manufacturing the same

Protection film having a plurality of openings above an electrode pad

Semiconductor package having a silicon reinforcing member embedded in resin

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Method of mounting electronic component and mounting substrate

Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD THEREOF

Layered chip package and method of manufacturing same

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

Semiconductor device with the leads projected from sealing body

Semiconductor device attached to island having protrusion

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Semiconductor device

Wafer scale package for high power devices