212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
BONDING WIRE FOR SEMICONDUCTOR DEVICES
#2SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS FOR FORMING THE SAME
#3SEMICONDUCTOR PACKAGE
#4SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#5MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME
#6OPTOELECTRONIC SYSTEM
#7PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME
#8METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
#9BONDING WIRE FOR SEMICONDUCTOR DEVICES
#10BONDING WIRE FOR SEMICONDUCTOR DEVICES
#11BONDING WIRE FOR SEMICONDUCTOR DEVICES
#12BONDING WIRE FOR SEMICONDUCTOR DEVICES
#13SEMICONDUCTOR DEVICE
#14Bonding wire for semiconductor devices
#15SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
#16SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONNECTED
#17SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
#18ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
#19METAL PILLAR FOR CONDUCTIVE CONNECTION
#20Multi-chip package and method of providing die-to-die interconnects in same
#21BONDING WIRE FOR SEMICONDUCTOR DEVICES
#22EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FORMING SAME
#23SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#24Bonding wire for semiconductor devices
#25Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#26Semiconductor device and a method of manufacturing the same
#27Connection structure and manufacturing method therefor
#28Impedance controlled electrical interconnection employing meta-materials
#29Copper alloy bonding wire for semiconductor devices
#30Multi-chip package and method of providing die-to-die interconnects in same
#31Universal Surface-Mount Semiconductor Package
#32Semiconductor device with sealed semiconductor chip
#33Semiconductor device
#34Semiconductor device having electrode pads arranged between groups of external electrodes
#35EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#36Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#37Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the same
#38EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#39Method for permanent connection of two metal surfaces
#40Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#41PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME
#42BONDING WIRE FOR SEMICONDUCTOR DEVICES
#43Semiconductor device
#44Semiconductor device having through silicon vias and manufacturing method thereof
#45Core material, electronic component and method for forming bump electrode
#46DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#47SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#48Circuit board structure and method for manufacturing a circuit board structure
#49Semiconductor device and method for production of semiconductor device
#50Method for manufacturing an electronic module and electronic module
#51ELECTRONIC MODULE
#52Semiconductor device and method for manufacturing semiconductor device
#533D IC method and device
#54Semiconductor device and a method of manufacturing the same
#553D IC method and device
#56Multi-chip package and method of providing die-to-die interconnects in same
#57Semiconductor device with sealed semiconductor chip
#58Electronic module
#59Semiconductor device and a method of manufacturing the same
#60Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame
#61Multi-chip package and method of providing die-to-die interconnects in same
#62Semiconductor device and a method of manufacturing the same
#63COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
#64Method for fabricating a semiconductor and semiconductor package
#65Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#66Semiconductor device having through silicon vias and manufacturing method thereof
#67Universal surface-mount semiconductor package
#68Embedded semiconductive chips in reconstituted wafers, and systems containing same
#69Semiconductor device
#70Semiconductor device having electrode pads arranged between groups of external electrodes
#71Semiconductor device and a method of manufacturing the same
#72METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#73Semiconductor device and a method of manufacturing the same
#74Semiconductor device and method for production of semiconductor device
#75Impedance controlled electrical interconnection employing meta-materials
#76Multi-chip package and method of providing die-to-die interconnects in same
#77Semiconductor device and method of manufacturing the same
#78Method for fabricating a semiconductor and semiconductor package
#79Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#80Four D device process and structure
#81Semiconductor device and method for manufacturing semiconductor device
#82Semiconductor device with island and associated leads
#83Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#84Method of manufacturing semiconductor device
#85Method of room temperature covalent bonding
#86METHOD OF ROOM TEMPERATURE COVALENT BONDING
#87Bonding wire for semiconductor device
#88Multilayer pillar for reduced stress interconnect and method of making same
#89Multilayer pillar for reduced stress interconnect and method of making same
#90Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#91Semiconductor device with sealed semiconductor chip
#92Grid array connection device and method
#93Semiconductor devices and semiconductor devices including a redistribution layer
#94Packaged semiconductor components having substantially rigid support members
#95SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#96Semiconductor device and method of manufacturing the same
#97Method of forming a semiconductor device having through silicon vias
#98Method of manufacturing a semiconductor device
#99Designs and methods for conductive bumps
#100Semiconductor device and a method of manufacturing the same
#101Multilayer pillar for reduced stress interconnect and method of making same
#102Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#1033D IC method and device
#104Semiconductor memory device
#105Semiconductor device
#106ROOM TEMPERATURE METAL DIRECT BONDING
#107Semiconductor device and a method of manufacturing the same
#108Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#109Semiconductor device, manufacturing method thereof, and electronic apparatus
#110Radar module with wafer level package and underfill
#111MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#112Semiconductor device having electrode pads arranged between groups of external electrodes
#113A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use
#114Semiconductor device
#115Semiconductor device
#116Methods of fluxless micro-piercing of solder balls, and resulting devices
#117Semiconductor device including a buffer layer structure for reducing stress
#118Electronic module
#119Bonding wire for semiconductor devices
#120Multiple-chip package with multiple thermal interface materials
#121Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#122A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#123Methods and apparatus for measuring analytes using large scale FET arrays
#124Universal surface-mount semiconductor package
#125ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#126Implantable electrode array assembly including a carrier with packaged control modules
#127Microelectronic elements with post-assembly planarization
#128Grid array connection device and method
#129RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
#130Light emitting device
#131Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#132Semiconductor device and method for production of semiconductor device
#133Semiconductor device and a method of manufacturing the same
#134Chip package
#135Method for applying a bonding layer
#136Multi-chip package and method of providing die-to-die interconnects in same
#137Manufacturing method of semiconductor device
#138Semiconductor device with island and associated leads
#139Bonding wire for semiconductor device
#140Bonding wire for semiconductor device
#141Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#142Light emitting device and method for manufacturing light emitting device
#143Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#144Bonding wire for semiconductor device
#145Semiconductor device and method for manufacturing the same
#146Semiconductor device and method of forming interposer with opening to contain semiconductor die
#147SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#148Power module and fabrication method for the same
#149Semiconductor device including a buffer layer structure for reducing stress
#150SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
#151Semiconductor device and method of manufacturing the same
#152Method of manufacturing a semiconductor device
#153Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#154Semiconductor device
#155Tooling for coupling multiple electronic chips
#156Embedded semiconductive chips in reconstituted wafers, and systems containing same
#157Semiconductor device and a method of manufacturing the same
#158Semiconductor device, manufacturing method thereof, and electronic apparatus
#159SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#160Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
#161Semiconductor device
#162Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#163Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#164Bonding wire for semiconductor device
#165Electronic part embedded substrate and method of producing an electronic part embedded substrate
#166Semiconductor devices including conductive pillars
#167Bonding structure and method
#168Semiconductor device and a method of manufacturing the same
#169OPTOELECTRONIC SYSTEM
#170Bonding wire for semiconductor device
#171Stacked semiconductor devices
#1723D IC method and device
#173Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#174Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#175Semiconductor device and method for production of semiconductor device
#176Dual lead frame semiconductor package and method of manufacture
#177Semiconductor device and a method of manufacturing the same
#178Semiconductor device having electrode pads arranged between groups of external electrodes
#179Microelectronic elements with post-assembly planarization
#180Semiconductor package having multi-phase power inverter with internal temperature sensor
#181Inter-chip alignment
#182Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#183Bonding wire for semiconductor device
#184Bonding wire for semiconductor device
#185Multilayer pillar for reduced stress interconnect and method of making same
#186Three dimensional device integration method and integrated device
#187Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same
#188Semiconductor device
#189Semiconductor device and method for manufacturing semiconductor device
#190Semiconductor package including a device and lead frame used for the same
#191Multilayer pillar for reduced stress interconnect and method of making same
#192ELECTRICAL BARRIER LAYERS
#193Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#194Semiconductor device and a method of manufacturing the same
#195Semiconductor device and production method therefor
#196Designs and methods for conductive bumps
#197Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#198Semiconductor device including semiconductor chip, wiring, conductive material, and contact part
#199Circuit board structure and method for manufacturing a circuit board structure
#200Radio frequency integrated circuit module
#201Semiconductor device
#202High quality electrical contacts between integrated circuit chips
#203Semiconductor device having through silicon vias and manufacturing method thereof
#204Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#205Bonding wire for semiconductor device
#206Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#207Semiconductor device and a method of manufacturing the same
#208Semiconductor device
#209Semiconductor device with trench-like feed-throughs
#210Process for producing a structure by assembling at least two elements by direct adhesive bonding
#211Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#212Semiconductor device
#213Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
#214Optoelectronic component and method of producing an optoelectronic component
#215Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#216Wafer backside interconnect structure connected to TSVs
#217Semiconductor device and a method of manufacturing the same
#218Semiconductor integrated circuit device
#219Apparatus, system, and method for wireless connection in integrated circuit packages
#220Grid array connection device and method
#221Light-emitting apparatus
#222Electronic part embedded substrate and method of producing an electronic part embedded substrate
#223Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#224Semiconductor device
#225Semiconductor device including at least one element
#226Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#227Rigid-flex electronic module
#228Power semiconductor device and method therefor
#229Methods and apparatus for measuring analytes using large scale FET arrays
#230Method for low temperature bonding and bonded structure
#231Tooling for coupling multiple electronic chips
#232Method for permanent connection of two metal surfaces
#233Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
#234Semiconductor device and method for manufacturing the same
#235Semiconductor device
#236Bonding wire for semiconductor devices
#237Semiconductor device
#238Semiconductor package with conductive clip
#239Semiconductor device including a protective film
#240Chip package and method for fabricating the same
#241Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#242Semiconductor device and method of forming wafer level ground plane and power ring
#243Semiconductor device and a method of manufacturing the same
#244Semiconductor device having electrode pads arranged between groups of external electrodes
#245Electronic device and method for production
#246Semiconductor device and a method of manufacturing the same
#247Semiconductor package and mobile device using the same
#248Semiconductor device having semiconductor chip affixed to substrate via insulating resin adhesive film
#249Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#250SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
#251Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#252Integrated antennas in wafer level package
#253Singulation method for semiconductor package with plating on side of connectors
#254Method of producing a hybridized device including microelectronic components
#255Power module and fabrication method for the same
#256Circuit module and method of manufacturing the same
#257Method of producing a semiconductor package
#258Embedded semiconductive chips in reconstituted wafers, and systems containing same
#259Semiconductor device and method of manufacturing same
#260Three dimensional device integration method and integrated device
#261Method for applying a bonding layer
#262Laser assisted transfer welding process
#263Semiconductor device and method for manufacturing semiconductor device
#264Semiconductor device and production method therefor
#265Bonding method using bonding material
#266Semiconductor device, method for manufacturing the same, and electronic device
#267Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#268Semiconductor package and method of forming the same
#269Method of manufacturing a semiconductor device
#270Semiconductor device and method for production of semiconductor device
#271Method of making a semiconductor device having a functional capping
#272Fabrication method of embedded chip substrate
#273Methods of forming 3-D circuits with integrated passive devices
#274Semiconductor die mount by conformal die coating
#275Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#276LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#277Bonding material and bonding method using the same
#278Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#279Wafer-level flip chip device packages and related methods
#280Method for low temperature bonding and bonded structure
#281Semiconductor device and a method of manufacturing the same
#282Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#283Chip mounting
#284Room temperature metal direct bonding
#285Pressure application apparatus and pressure application method
#286Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#287Semiconductor device and a method of manufacturing the same
#288Semiconductor device and a method of manufacturing the same
#289Template and pattern forming method
#290Method of manufacturing semiconductor device
#291Light emitting device and method for manufacturing light emitting device
#292Stacked packaging improvements
#293Bump pad structure
#294Electronic component mounting apparatus and method
#295Light emitting device and method for manufacturing same
#296Semiconductor device and lead frame used for the same
#297Selective die electrical insulation by additive process
#298Adhesive composition, adhesive sheet and production process for semiconductor device
#299Light-emitting apparatus
#300Semiconductor devices with recessed interconnects