212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Assembled multi-component electronic apparatus using alignment and reference marks
#2702Carbon nanotubes for the selective transfer of heat from electronics
#2703High Frequency Power Supply Module Having High Efficiency and High Current
#2704Die bond film, dicing die bond film, and semiconductor device
#2705Methods of forming a metal pattern and semiconductor device structure
#2706CHIP PACKAGE
#2707Stackable electronic package and method of fabricating same
#2708Thermal vias in an integrated circuit package with an embedded die
#2709Semiconductor chip and film and TAB package comprising the chip and film
#2710SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2711Method for placing a component onto a target platform by an apparatus using a probe
#2712SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#2713Method for manufacturing a semiconductor structure
#2714Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatus
#2715Integrated chip package structure using organic substrate and method of manufacturing the same
#2716Electronic component
#2717Wireless communication system
#2718Circuit component with conductive layer structure
#2719Device including an encapsulated semiconductor chip and manufacturing method thereof
#2720Wirebondless wafer level package with plated bumps and interconnects
#2721Chip structure
#2722Semiconductor device and method of forming IPD in fan-out level chip scale package
#2723Thermal interface material design for enhanced thermal performance and improved package structural integrity
#2724Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#2725Method of manufacturing a semiconductor device
#2726Device having wire bond and redistribution layer
#2727Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame
#2728Semiconductor device
#2729Low temperature bonding material comprising coated metal nanoparticles, and bonding method
#2730Printed wiring board and method for manufacturing same
#2731Method for mounting a component
#2732Method for integrating an electronic component into a printed circuit board
#2733System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
#2734Flip chip mounting method and bump forming method
#2735Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates
#2736Method of making a semiconductor device having a conductive particle on an electric pad
#2737METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
#2738Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#2739Manufacturing method of semiconductor device
#2740Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
#2741Semiconductor device with a selection circuit selecting a specific pad
#2742Wiring board and liquid crystal display device
#2743RFID integrated circuit with integrated antenna structure
#2744PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC
#2745Solder alloy and semiconductor device
#2746Wafer level chip scale package without an encapsulated via
#2747Lead frame ball grid array with traces under die
#2748Semiconductor chip, electrode structure therefor and method for forming same
#2749Method of fabricating a conductive post on an electrode
#2750Wafer-level packaged device having self-assembled resilient leads
#2751Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#2752Semiconductor device and electronic device
#2753Semiconductor storage device and manufacturing method thereof
#2754Method for manufacturing a microelectronic package comprising at least one microelectronic device
#2755Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
#2756Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
#2757Semiconductor device and method of patterning resin insulation layer on substrate of the same
#2758Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same
#2759Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#2760III-nitride power device with solderable front metal
#2761Semiconductor chip with a bonding pad having contact and test areas
#2762Nitride semiconductor element and method for production thereof
#2763Flux-free chip to wafer joint serial thermal processor arrangement
#2764METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD
#2765ADHESIVE BONDING METHOD
#2766Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
#2767FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING
#2768Semiconductor device and a method of manufacturing the same
#2769Rule-based semiconductor die stacking and bonding within a multi-die package
#2770Light emitting device, method for manufacturing the same, and backlight unit
#2771Polymer matrices for polymer solder hybrid materials
#2772ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE
#2773Bonded structure with enhanced adhesion strength
#2774Electronic device package and method for fabricating the same
#2775Lead free solder interconnections for integrated circuits
#2776Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#2777SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE
#2778Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus
#2779Pillar structure having a non-planar surface for semiconductor devices
#2780Semiconductor device and semiconductor assembly with lead-free solder
#2781Solder interconnect with non-wettable sidewall pillars and methods of manufacture
#2782Manufacturing of a device including a semiconductor chip
#2783SEMICONDUCTOR PACKAGE
#2784LEAD FRAME FOR SEMICONDUCTOR DIE
#2785Semiconductor device and method of manufacturing the same
#2786Micro-fluidic injection molded solder (IMS)
#2787WIREBONDING PROCESS
#2788Semiconductor device
#2789Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
#2790Interconnection tape providing a serial electrode pad connection in a semiconductor device
#2791Power semiconductor device
#2792Integrated circuits having TSVs including metal gettering dielectric liners
#2793Solder bump interconnect
#2794Semiconductor module and portable apparatus provided with semiconductor module
#2795Protruding TSV tips for enhanced heat dissipation for IC devices
#2796Method of manufacturing a semiconductor device
#2797Semiconductor device and method of manufacturing the same
#2798LED package and method for manufacturing same
#2799LED package, method for manufacturing LED package, and packing member for LED package
#2800LED assembly with a protective frame
#2801LED PACKAGE
#2802Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device
#2803Stable electroless fine pitch interconnect plating
#2804Semiconductor device and a method of manufacturing the same
#2805Electronic device and manufacturing method of the same
#2806Method of manufacturing a semiconductor device
#2807Integrated semiconductor substrate structure using incompatible processes
#2808Semiconductor device
#2809Array-molded package-on-package having redistribution lines
#2810Dual carrier for joining IC die or wafers to TSV wafers
#2811Interconnection structure and its design method
#2812Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same
#2813Semiconductor device
#2814SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#2815Method of manufacturing layered chip package
#2816Etched recess package on package system
#2817Co-axial restraint for connectors within flip-chip packages
#2818Multi-chip package having frame interposer
#2819Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof
#2820Method of stacking flip-chip on wire-bonded chip
#2821Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
#2822Semiconductor device
#2823Packaged semiconductor product and method for manufacture thereof
#2824Encapsulation, MEMS and encapsulation method
#2825Semiconductor device and a method of manufacturing the same
#2826Method of making a mounted gallium nitride device
#2827Method of manufacturing semiconductor device and wire bonding apparatus
#2828Enhanced magnetic self-assembly using integrated micromagnets
#2829Pad layout method for surface mount circuit board and surface mount circuit board thereof
#2830Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP
#2831PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE
#2832Stable Gold Bump Solder Connections
#2833Semiconductor device
#2834Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof
#2835Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#2836Multilayer printed circuit board
#2837Semiconductor device and manufacturing method thereof
#2838Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip
#2839Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
#2840Semiconductor integrated circuit
#2841Semiconductor device
#2842Post passivation interconnection schemes on top of the IC chips
#2843Bonded structure and manufacturing method for bonded structure
#2844Stacked semiconductor components having conductive interconnects
#2845SEMICONDUCTOR PACKAGE
#2846Semiconductor device having conductive pads and a method of manufacturing the same
#2847PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE
#2848Integrated void fill for through silicon via
#2849EMI shielding package structure and method for fabricating the same
#2850Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#2851Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#2852ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#2853Method and system for drug delivery to the eye
#2854Method of manufacturing an interconnect structure for a semiconductor device
#2855SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2856Semiconductor device manufacturing method
#2857Method of manufacturing semiconductor device
#2858Reworkable electronic device assembly and method
#28594D device process and structure
#2860System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#2861WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAGE HAVING THE WIRING SUBSTRATE
#2862Dual Interconnection in Stacked Memory and Controller Module
#2863Semiconductor device sealed in a resin section and method for manufacturing the same
#2864SEMICONDUCTOR DEVICE
#2865Wiring substrate, manufacturing method thereof, and semiconductor package
#2866Attaching passive components to a semiconductor package
#2867Semiconductor device
#2868REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY
#2869Chip package and fabrication method thereof
#2870Microelectronic devices
#2871Semiconductor package with single sided substrate design and manufacturing methods thereof
#2872Manufacturing method of lead frame substrate and semiconductor apparatus
#2873Die package including multiple dies and lead orientation
#2874Semiconductor device including a DC-DC converter having a metal plate
#2875System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages
#2876System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#2877Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#2878Nanotube modified solder thermal intermediate structure, systems, and methods
#2879Plating method, semiconductor device fabrication method and circuit board fabrication method
#2880Bond pad connection to redistribution lines having tapered profiles
#2881MANUFACTURING METHOD OF SEMI-CONDUCTOR CHIP PACKAGE
#2882Method of manufacturing semiconductor device
#2883METHOD OF PACKAGING SEMICONDUCTOR DEVICE
#2884Apparatus and method for predetermined component placement to a target platform
#2885ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#2886METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE
#2887Integrated circuit micro-module
#2888Electronic packages with fine particle wetting and non-wetting zones
#2889Semiconductor device having elastic solder bump to prevent disconnection
#2890Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#2891PB-free solder bumps with improved mechanical properties
#2892Semiconductor device
#2893SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#2894Semiconductor package and method of manufacturing the same
#2895Wiring board, semiconductor device and method for manufacturing the same
#2896Lead frame substrate and method of manufacturing the same, and semiconductor device
#2897Lead frame substrate, manufacturing method thereof, and semiconductor apparatus
#2898Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof
#2899Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration
#2900Semiconductor device
#2901Method for stacking serially-connected integrated circuits and multi-chip device made from same
#2902Semiconductor device and method of manufacturing the same
#2903Method for Soldering Contact Wires to Solar Cells
#2904Flip-chip mounting method and bump formation method
#2905INTEGRATED DEVICE
#2906Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
#2907Acrylic insulating adhesive
#2908SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#2909Method of manufacturing semiconductor device
#2910Method for making a stackable package
#2911PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT
#2912DIE-ATTACH FILM AND METHOD OF MANUFACTURING THE SAME
#2913INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME
#2914Inductive relayed coupling circuit between substrates
#2915Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages
#2916Dicing tape-integrated film for semiconductor back surface
#2917SEMICONDUCTOR DEVICE
#2918Semiconductor module
#2919Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element
#2920INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME
#2921Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip
#2922CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS
#2923Micro-bump structure
#2924Semiconductor device and method for manufacturing the same
#2925Semiconductor package and method of manufacturing the same
#2926RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE
#2927METHOD FOR MANUFACTURING A FAN-OUT EMBEDDED PANEL LEVEL PACKAGE
#2928Fan-out chip scale package
#2929Stack package
#2930Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips
#2931Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs
#2932SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2933Circular shield of a circuit-substrate laminated module and electronic apparatus
#2934Integrated circuit device and electronic instrument
#2935ELECTRICAL MODULE
#2936Manufacturing method for composite substrate
#2937Bonding apparatus
#2938Wiring board capable of containing functional element and method for manufacturing same
#2939Circuit board and its wire bonding structure
#2940Structure of circuit board and method for fabricating the same
#2941Manufacturing method of semiconductor device
#2942Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet
#2943Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#2944Method for manufacturing chips
#2945METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES
#2946PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION
#2947Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element
#2948Systems employing a stacked semiconductor package
#2949Method for producing a non-plane element
#2950Apparatus and method for embedding components in small-form-factor, system-on-packages
#2951Radio frequency amplifier with effective decoupling
#2952Dicing die-bonding film
#2953METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE
#2954Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process
#2955Contact-based encapsulation
#2956Lead frame land grid array with routing connector trace under unit
#2957Semiconductor component of semiconductor chip size with flip-chip-like external contacts
#2958Semiconductor device and method for fabricating the same
#2959Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
#2960Pre-soldered leadless package
#2961Structures and methods to reduce maximum current density in a solder ball
#2962Apparatus and method for embedding components in small-form-factor, system-on-packages
#2963Window ball grid array (BGA) semiconductor packages
#2964Integrated circuit package with embedded components
#2965Semiconductor chip device with solder diffusion protection
#2966Combined power mesh transition and signal overpass/underpass
#2967Stackable circuit structures and methods of fabrication thereof
#2968METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE
#2969Integrated Circuit Comprising Light Absorbing Adhesive
#2970SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2971Solder in cavity interconnection technology
#2972Printed wiring board and method for manufacturing printed wiring board
#2973Method and apparatus for pass/fail determination of bonding and bonding apparatus
#2974Semiconductor device and communication method
#2975Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet
#2976Semiconductor processing methods
#2977Packaging conductive structure and method for manufacturing the same
#2978Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#2979Manufacturing method for semiconductor device
#2980Semiconductor connection component
#2981Method of room temperature covalent bonding
#2982External storage device and method of manufacturing external storage device
#2983DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS
#2984Semiconductor device having a microcomputer chip mounted over a memory chip
#2985Semiconductor device and electronic device
#2986Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same
#2987Semiconductor devices including voltage switchable materials for over-voltage protection
#2988Ball grid array package enhanced with a thermal and electrical connector
#2989Semiconductor device and method for manufacturing the same
#2990High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same
#2991Semiconductor device and manufacturing method thereof
#2992Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps
#2993Semiconductor device, substrate and semiconductor device manufacturing method
#2994Panel based lead frame packaging method and device
#2995DAP GROUND BOND ENHANCEMENT
#2996Semiconductor device and manufacturing method thereof
#2997Integrated circuit with pads connected by an under-bump metallization and method for production thereof
#2998Bonding structure and method for manufacturing same
#2999Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
#3000Method for manufacturing an electronic assembly