Semiconductor unit having a power semiconductor and semiconductor apparatus using the same

WAFER LEVEL INTEGRATION MODULE WITH INTERCONNECTS

Method for interconnecting electrical device to a module

Wire bonding apparatus and wire bonding method

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

Magnetic attachment structure

Method for disposing a microstructure

Method of manufacturing a printed circuit board (PCB)

CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR

PATTERNED CONTACT

Semiconductor package having ink-jet type dam and method of manufacturing the same

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS

Semiconductor device

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material

Stacked die assembly having reduced stress electrical interconnects

Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors

Wafer level package and methods of fabricating the same

Semiconductor device and method for fabricating semiconductor device

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

Semiconductor package and method of manufacturing same

IC CHIP AND IC CHIP MANUFACTURING METHOD THEREOF

Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture

Pre-molded clip structure

Apparatus for applying solder to semiconductor chips using decals with aperatures present therein

Dual capillary IC wirebonding

Cushion and Method for Manufacturing the Same

Hermetic wafer-to-wafer bonding with electrical interconnection

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

Biocompatible Bonding Method

Gold-tin etch using combination of halogen plasma and wet etch

Method of manufacturing an electronic component

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Nanotube based vapor chamber for die level cooling

LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS

Semiconductor device and a manufacturing method of the same

Mixed alloy solder paste

Substrate having laser sintered underplate

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL

Semiconductor device and manufacturing method thereof

Etch-back type semiconductor package, substrate and manufacturing method thereof

Circuit board including a heat radiating plate

Wire bond interconnection and method of manufacture thereof

Electronic part package

TCE compensation for package substrates for reduced die warpage assembly

Electronic elements and devices with trench under bond pad feature

Semiconductor device and method of manufacturing the same

Selective die electrical insulation by additive process

Stackable power MOSFET, power MOSFET stack, and process of manufacture

Carbon nanotube circuit component structure

Semiconductor device having trench-isolated element formation region

Laser etch via formation

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD

INTEGRATED-CIRCUIT ATTACHMENT STRUCTURE WITH SOLDER BALLS AND PINS

MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY

Cu pillar bump with non-metal sidewall protection structure

Circuit board with built-in semiconductor chip and method of manufacturing the same

Lead frame based semiconductor package and a method of manufacturing the same

LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

Semiconductor device

Cutting blade for a wire bonding system

Method for embedding a component in a base

Preventing breakage of long metal signal conductors on semiconductor substrates

Magnetic intermetallic compound interconnect

Method for manufacturing interposer

Method for forming an adhesive layer and adhesive composition

Method of forming nanoscale three-dimensional patterns in a porous material

Method for manufacturing semiconductor device

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION

Photosensitive composition

Die package

CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING THE SAME

Semiconductor device

Semiconductor device with stacked semiconductor chips

Semiconductor device having double side electrode structure

Electronic device package and method of manufacture

Flip chip interconnection structure

Three-dimensional stacked substrate arrangements

Cu pillar bump with electrolytic metal sidewall protection

Power block and power semiconductor module using same

DIE PACKAGE AND CORRESPONDING METHOD FOR REALIZING A DOUBLE SIDE COOLING OF A DIE PACKAGE

Semiconductor device and lead frame used for the same

Integrated circuit including bond wire directly bonded to pad

Semiconductor device packages with electromagnetic interference shielding

THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF

Semiconductor device connection

APPARATUS FOR MONITORING BONDING SURFACE BOUNCING, WIRE BONDING APPARATUS HAVING THE SAME AND METHOD FOR MONITORING BONDING SURFACE BOUNCING

Reaction absorber and semiconductor assembling system

Semiconductor device fabricating method and fabricating apparatus

Method of manufacturing a power transistor module and package with integrated bus bar

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

Method of manufacturing semiconductor apparatus

Stacked wafer manufacturing method

THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR DEVICE

STACKED WAFER MANUFACTURING METHOD

Chip embedded substrate and method of producing the same

Method for manufacturing LED package and substrate thereof

Semiconductor device and method of forming conductive vias with trench in saw street

Integrated method for high-density interconnection of electronic components through stretchable interconnects

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor device and method of wafer level package integration

Wafer level die integration and method therefor

Die structure and die connecting method

CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF

Semiconductor device having multiple semiconductor elements

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

Stacked semiconductor package

Chip package structure and method of making the same

Forming functionalized carrier structures with coreless packages

Semiconductor device capable of switching operation modes

Method of forming a micro pin hybrid interconnect array

Apparatus with a multi-layer coating and method of forming the same

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Inverse chip connector

Thru silicon enabled die stacking scheme

Power semiconductor module

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION

Package substrate and fabricating method thereof

Method of manufacturing semiconductor device

Dummy pattern in wafer backside routing

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress

Semiconductor device

Leadframe package for high-speed data rate applications

Lead frame for semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods and apparatus for measuring analytes using large scale FET arrays

Methods and apparatus for measuring analytes using large scale FET arrays

Adhesive for bonding circuit members, circuit board and process for its production

Adhesive for bonding circuit members, circuit board and process for its production

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

Adhesive for bonding circuit members, circuit board and process for its production

CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME

Circuit board with embedded component and method of manufacturing same

Process for the wafer-scale fabrication of electronic modules for surface mounting

Structure and method of forming pillar bumps with controllable shape and size

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime

THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE

IRON PARTICULATE-REINFORCED TIN BASED MATRIX COMPOSITE SOLDER BALL AND FLIP CHIP BALL PLACEMENT METHOD USING SAME

Mount board and electronic device

APPARATUS FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM

EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Wire bonding structure of semiconductor device and wire bonding method

Semiconductor package and multichip arrangement having a polymer layer and an encapsulant

Semiconductor device with improved resin configuration

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Semiconductor device including coupling ball with layers of aluminum and copper alloys

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS

Dummy metal design for packaging structures

Radiate under-bump metallization structure for semiconductor devices

Power semiconductor module

Forming in-situ micro-feature structures with coreless packages

Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof

Semiconductor device packages including connecting elements

Semiconductor package

Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Monolithic semiconductor switches and method for manufacturing

Semiconductor device and communication method

Methods and apparatus for measuring analytes using large scale FET arrays

Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device

PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

MULTIPLE DIE STRUCTURE AND METHOD OF FORMING A CONNECTION BETWEEN FIRST AND SECOND DIES IN SAME

Thermo-compression bonded electrical interconnect structure and method

SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of making semiconductor package having redistribution layer

Semiconductor device and manufacturing method of the same

Die level integrated interconnect decal manufacturing method and apparatus

Method of manufacturing semiconductor device

Electronic device wafer level scale packages and fabrication methods thereof

Chipstack package and manufacturing method thereof

ALUMINUM FOR ULTRASONIC BONDING

Integrated circuit package component with ball conducting joints

Conformal shielding process using process gases

Voltage converter

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method for manufacturing the same

Methods and systems for material bonding

Sacrificial material to facilitate thin die attach

Semiconductor device

Electronic device package and fabrication method thereof

Semiconductor chip with coil element over passivation layer

Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices

Manufacturing process and structure of through silicon via

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor device and method of manufacturing the same

Semiconductor device package having a buffer structure and method of fabricating the same

Integrated circuit system with stress redistribution layer and method of manufacture thereof

Wafer level integrated interconnect decal and manufacturing method thereof

Cu pillar bump with non-metal sidewall protection structure

Semiconductor device

SEMICONDUCTOR DEVICE

Method for facilitating the stacking of integrated circuits having different areas and an integrated circuit package constructed by the method

WAFER LEVEL PACKAGING WITH HEAT DISSIPATION

Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure

Semiconductor device package having a jumper chip and method of fabricating the same

Integrated circuit packaging system with stacking option and method of manufacture thereof

Integrated circuit packages

Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device

Semiconductor device and lead frame

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor chip having double bump structure and smart card including the same

Micro-fluidic injection molded solder (IMS)

Method of attaching die to circuit board with an intermediate interposer

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Apparatus for mounting semiconductor device

Methods and apparatus for measuring analytes using large scale FET arrays

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer

Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure

Method for disposing a component

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same

Method for disposing a component

Coupling heat sink to integrated circuit chip with thermal interface material

MULTI-FUNCTION CARD DEVICE

Packaged electronic device having metal comprising self-healing die attach material

FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

Embedded die with protective interposer

Surface-mounted electronic component

Electronic device having interconnections, openings, and pads having greater width than the openings

Silicon substrate for package

Under-Bump Metallization Structure for Semiconductor Devices

Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut

Stacked dual chip package and method of fabrication

Alignment structures for integrated-circuit packaging

Vertical MOSFET with through-body via for gate

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same

Die stacking with an annular via having a recessed socket

Electronic component package and method for producing electronic component package

Conformal shielding employing segment buildup

Multi-chip module with multi-level interposer

Silicon nitride passivation layer for covering high aspect ratio features

Electronic component manufacturing method

Method of fabricating a capillary-flow underfill compositions

Fabrication method for resin-encapsulated semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device and automotive ac generator

Pin-type chip tooling

Distributed semiconductor device methods, apparatus, and systems

Electronic assembly with detachable components

Method of sensing magnitude of current through semiconductor power device

Semiconductor device

Method of manufacturing electronic device and electronic device

Layered chip package with wiring on the side surfaces

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

Process for fabricating electronic components using liquid injection molding

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP

Leadframe based multi terminal IC package

Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device

Semiconductor device and method of forming insulating layer around semiconductor die

High power semiconductor device for wireless applications and method of forming a high power semiconductor device

Semiconductor packaging and fabrication method using connecting plate for internal connection

Integrated circuit package for semiconductior devices with improved electric resistance and inductance

Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same

Ferroelectric component and manufacturing the same

Method for metalizing blind vias

METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS

CONNECTING PAD PRODUCING METHOD

Method for singulating electronic components from a substrate

Semiconductor device

Method for fabricating circuit component

Multi-surface IC packaging structures

Through Silicon via Bridge Interconnect

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

Bump-on-lead flip chip interconnection

Stacked semiconductor chips with separate encapsulations

Semiconductor device capable of switching operation mode and operation mode setting method therefor

Chip package and method for fabricating the same

Stacked semiconductor package having discrete components

LED packaging with integrated optics and methods of manufacturing the same

ROTARY DIE BONDING APPARATUS AND METHODOLOGY THEREOF

Nanotube Materials for Thermal Management of Electronic Components

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor device with copper wirebond sites and methods of making same

SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE

Processing method for package substrate

Rigid-backed, membrane-based chip tooling

Semiconductor device support for bonding