Embedded chip package process

Flip chip mounting method and bump forming method

Method and apparatus for fabricating integrated circuit device using self-organizing function

PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME

BONDING WIRE

Semiconductor device with offset stacked integrated circuits

Method for making contact with a contact surface on a substrate

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Semiconductor device sealed in a resin section and method for manufacturing the same

Semiconductor apparatus having side surface wiring

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

Semiconductor device having double side electrode structure and method of producing the same

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

HIGH TEMPERATURE PACKAGING FOR SEMICONDUCTOR DEVICES

Semiconductor device and method for manufacturing semiconductor device

Method of manufacturing a semiconductor apparatus

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

Method for packaging semiconductor dies having through-silicon vias

Semiconductor device and manufacturing method of the same

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

Method for stacking serially-connected integrated circuits and multi-chip device made from same

Semiconductor chip bonding apparatus

Method of manufacturing printed wiring board

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE

Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Manufacturing method of semiconductor integrated circuit device

Semiconductor assembly

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Semiconductor module, and hybrid vehicle drive device including the same

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Solder cap application process on copper bump using solder powder film

Flip-chip package structure, and the substrate and the chip thereof

Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip

Stacked semiconductor device and semiconductor memory device

Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereof

Semiconductor package with reduced length interconnect and manufacturing method thereof

Electronic device and manufacturing method

Method for manufacturing a circuit board structure, and a circuit board structure

Semiconductor device

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Flip-Chip Packaging with Stud Bumps

Manufacturing process and structure of through silicon via

Semiconductor device and semiconductor device fabrication method

Method for connecting an electronic chip to a radiofrequency identification device

Method and apparatus for placing conductive balls

COMPRESSION BONDING DEVICE

Film substrate, fabrication method thereof, and image display substrate

Hybrid integrated circuit device and manufacturing method thereof

Method of fabricating chip package

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Mounting system

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Semiconductor device suitable for a stacked structure

Stackable microelectronic device carriers, stacked device carriers and methods of making the same

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Composite carbon nanotube-based structures and methods for removing heat from solid-state devices

Chip package

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

Semiconductor device with welded leads and method of manufacturing the same

Semiconductor switching module

Method of fabricating a power semiconductor module

Chip embedded substrate and method of producing the same

Ultra-Thin Wafer-Level Contact Grid Array

Ultra slim semiconductor package and method of fabricating the same

Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Semiconductor device and method for manufacturing thereof

Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method

Heating device, reflow device, heating method, and bump forming method

ELECTRONIC APPARATUS

Capacitor device and method of manufacturing the same

Adhesive composition and adhesive sheet

Method of fabricating a two-sided die in a four-sided leadframe based package

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Semiconductor device and manufacturing method therefor

Mount Board and Electronic Device

Method of manufacturing a module

Process for manufacturing a module

Conformal shielding process using process gases

FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD

Electronic module and fabrication method thereof

Circuit board with an attached die and intermediate interposer

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

Semiconductor device and wire bonding method

Semiconductor package and trenched semiconductor power device using the same

Semiconductor Package and Method for Producing Same

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING A FRONT AND BACKSIDE THEREOF AND A METHOD OF MANUFACTURE THEREFOR

Integrated circuit package system with overhanging connection stack

Ta-TaN selective removal process for integrated device fabrication

Semiconductor device and method of manufacturing the same

Semiconductor device with flip-chip connection that uses gallium or indium as bonding material

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor device, a method of manufacturing the same and an electronic device

Forming a semiconductor package including a thermal interface material

LOW TEMPERATURE THERMAL INTERFACE MATERIALS

Semiconductor device having metal cap divided by slit

Semiconductor device including semiconductor chips having contact elements

CHIP STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Stackable package by using internal stacking modules

Semiconductor module for a switched-mode power supply and method for its assembly

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device including fuse elements and bonding pad

Packaged device and method of manufacturing the same

Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module

Semiconductor device

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

Using a simultaneously tilting and moving bonding apparatus

Micro-ball loading device and loading method

Conformal shielding process using flush structures

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

Heat sink formed with conformal shield

Method of machining substrate

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS

Formation of alpha particle shields in chip packaging

Stack circuit member and method

Manufacturing Method of Semiconductor Integrated Circuit Device

Semiconductor apparatus and method for manufacturing the same

Manufacturing method for semiconductor integrated device

RECOVERABLE ELECTRONIC COMPONENT

LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT

Demountable interconnect structure

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Apparatus for non-conductively interconnecting integrated circuits

Semiconductor device including a stress buffer

Tape wiring substrate and chip-on-film package using the same

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Self-aligned wafer or chip structure, and self-aligned stacked structure

Substrate bonding method and semiconductor device

Structure and manufactruing method of chip scale package

Semiconductor device

Metal pad formation method and metal pad structure using the same

Semiconductor package with passive elements embedded within a semiconductor chip

Semiconductor device and manufacturing method thereof

Electronic device manufacturing method and electronic device

Electronic device manufacturing method and electronic device

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Direct edge connection for multi-chip integrated circuits

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Bumpless flip-chip assembly with a complaint interposer contractor

Array molded package-on-package having redistribution lines

Semiconductor device with surface mounting terminals

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Method of assembly using array of programmable magnets

Method of making demountable interconnect structure

ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Parallel chip embedded printed circuit board and manufacturing method thereof

Device For Pressing On Semiconductor Chips Arranged On A Substrate

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS

Power composite integrated semiconductor device and manufacturing method thereof

METHOD OF FORMING AN INTERCONNECT JOINT

Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding Layer

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Method for fabricating semiconductor package

Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material

Apparatus for Producing Ic Chip Package

Connected body and optical transceiver module

Semiconductor power device having a stacked discrete inductor structure

Fabricated adhesive microstructures for making an electrical connection

Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing Apparatus

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Die offset die to die bonding

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Solder bump interconnect for improved mechanical and thermo-mechanical performance

SEMICONDUCTOR PACKAGE STRUCTURES

Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device

METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Embedded chip package

Chip package

CHIP PACKAGE

CHIP PACKAGE

Photoelectric conversion element having a semiconductor and semiconductor device using the same

Semiconductor device

Camera module with window mechanical attachment

BOND HEAD FOR A WIRE BONDER

Implementation structure of semiconductor package

Ubm Pad, Solder Contact and Methods for Creating a Solder Joint

Electronic component and manufacturing method thereof

Bonding structure with buffer layer and method of forming the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of manufacturing a semiconductor device

Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support

Power semiconductor packaging method and structure

Reducing stress in a flip chip assembly

In-situ functionalization of carbon nanotubes

Au—Sn alloy bump including no large void and method of producing same

SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES ON A SUBSTRATE

Patterned die attach and packaging method using the same

METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STACK PRODUCED BY THE METHOD

Circuit arrangement and integrated circuit

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE PRODUCT

Contact pad and method of forming a contact pad for an integrated circuit

Electronic Component

HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR

Process for manufacturing substrate with bumps and substrate structure

Structure, method and system for assessing bonding of electrodes in FCB packaging

Semiconductor device and method for manufacturing same

Electrically interconnected stacked die assemblies

Semiconductor subassemblies with interconnects and methods for manufacturing the same

Concave face wire bond capillary and method

Wiring method and device

WIRE CLAMP FOR A WIRE BONDER

Conductive ball arraying apparatus

Printed wiring board and a method of manufacturing a printed wiring board

Fill head for injection molding of solder

Circuit device and manufacturing method therefor

Integrated circuit die with logically equivalent bonding pads

Front-end processing of nickel plated bond pads

Current sensor

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

SEMICONDUCTOR DEVICE

Method of Manufacturing Electrical Conductors for a Semiconductor Device

Arrangement including a semiconductor device and a connecting element

Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts

Semiconductor element and method of manufacturing the same

Enhanced copper posts for wafer level chip scale packaging

Semiconductor device

Cylindrical bonding structure and method of manufacture

Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same

Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA

Metal interconnect System and Method for Direct Die Attachment

Semiconductor chip mounting board with multiple ports

Method of manufacturing electronic component package

Manufacture of a layer including a component

Prevention and control of intermetallic alloy inclusions

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Semiconductor device and manufacturing method of the same

Standoff height improvement for bumping technology using solder resist

Reactive solder material

Method of bonding aluminum electrodes of two semiconductor substrates

Method for mounting anisotropically-shaped members

Method of fabricating a semiconductor device package

Semiconductor device with integrated coils

Semiconductor device and process for fabrication thereof

SEMICONDUCTOR DEVICE WITH BONDING PAD SUPPORT STRUCTURE

Semiconductor device and fabrication method thereof

Chip Assembly and Method of Manufacturing Thereof

Mold design and semiconductor package

Compliant thermal contactor

Wafer level system in package and fabrication method thereof

Semiconductor packages with enhanced joint reliability and methods of fabricating the same

Semiconductor device and a method of manufacturing the same

LEAD FRAME FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE

LEAD-FRAME ARRAY PACKAGE STRUCTURE AND METHOD

Semiconductor integrated circuit with solder bump

Transistor package with wafer level dielectric isolation

Integrated circuit for various packaging modes

MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD

Solderable top metal for silicon carbide semiconductor devices

Semiconductor device and a method of manufacturing the same

METHOD FOR FABRICATING METAL PAD

Downhill Wire Bonding for QFN L - Lead

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

Method for manufacturing semiconductor package

Semiconductor device packaged into chip size and manufacturing method thereof

Method of manufacturing a semiconductor device

Method of making integrated circuit package with transparent encapsulant

Method for adhering semiconductor devices

Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler

Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

Temporary chip attach carrier

Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same

Flip chip mounting method and bump forming method

Semiconductor device and method of manufacturing same

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Semiconductor device with multilayered metal pattern

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA

METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS

Reliable metal bumps on top of I/O pads after removal of test probe marks

Chip assembly with interconnection by metal bump