212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Method for manufacturing semiconductor device, and semiconductor device
#6902Semiconductor module manufacturing method, semiconductor module, and mobile device
#6903Dimple free gold bump for drive IC
#6904Semiconductor device
#6905Semiconductor package having die with recess and discrete component embedded within the recess
#6906Methods of assembling integrated circuit packages
#6907Compact multi-port CAM cell implemented in 3D vertical integration
#6908Semiconductor Device and Its Fabrication Method
#6909Semiconductor device
#6910Method for bonding electronic components
#6911METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEMICONDUCTOR DEVICE FABRICATION
#6912Systems and methods for post-circuitization assembly
#6913METHODS FOR FORMING PACKAGE STRUCTURES
#6914CONVEX DIE ATTACHMENT METHOD
#6915Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#6916Semiconductor package and method of forming the same, and printed circuit board
#6917RF-coupled digital isolator
#6918RF-coupled digital isolator
#6919Semiconductor device
#6920Semiconductor device with improved resin configuration
#6921Semiconductor package and method of forming the same
#6922Semiconductor device and a method of manufacturing the same
#6923Package structure for integrated circuit device
#6924Semiconductor chip and manufacturing method thereof
#6925Flash memory card
#6926Substrate and multilayer circuit board
#6927POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE
#6928Methods of packaging a semiconductor die and package formed by the methods
#6929Semiconductor device
#6930Package integrated soft magnetic film for improvement in on-chip inductor performance
#6931Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure
#6932Semiconductor device for high frequency
#6933Method of manufacturing a semiconductor device having an insulating protective film covering at least a portion of a tile-shaped element
#6934Electronic device manufacturing method and supporter
#6935Methods of forming a semiconductor device including a diffusion barrier film
#6936Structure and method for enhancing resistance to fracture of bonding pads
#6937Semiconductor package having through-hole via on saw streets formed with partial saw
#6938Semiconductor device package with multi-chips and method of the same
#6939Process and apparatus for wafer-level flip-chip assembly
#6940Manufacturing method of semiconductor device
#6941Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
#6942SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT
#6943Package-in-package using through-hole via die on saw streets
#6944Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
#6945Semiconductor device and method for manufacturing semiconductor device
#6946Package substrate and its solder pad
#6947Semiconductor Device
#6948Package-on-package using through-hole via die on saw streets
#6949Through-hole via on saw streets
#6950Semiconductor packaging device comprising a semiconductor chip including a MOSFET
#6951Same size die stacked package having through-hole vias formed in organic material
#6952Semiconductor die with through-hole via on saw streets and through-hole via in active area of die
#6953Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
#6954Extended redistribution layers bumped wafer
#6955METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE
#6956Substrate with feedthrough and method for producing the same
#6957SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
#6958Manufacturing method of a semiconductor device
#6959SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#6960METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#6961Method and system for bonding 3D semiconductor devices
#6962Chip package
#6963Fabricating process of a chip package structure
#6964Adhesive composition and a method of using the same
#6965Bidirectional multiplexed RF isolator
#6966Pressure-contact power semiconductor module and method for producing the same
#6967Method transparent member, optical device using transparent member and method of manufacturing optical device
#6968Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same
#6969Semiconductor device and method of manufacturing the same
#6970Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure
#6971Die bonding agent and a semiconductor device made by using the same
#6972Package equipped with semiconductor chip and method for producing same
#6973MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE
#6974Semiconductor package and method of manufacturing the semiconductor package
#6975Semiconductor device
#6976Structure for electrostatic discharge in embedded wafer level packages
#6977Semiconductor device
#6978Wafer level package
#6979Highly reliable low cost structure for wafer-level ball grid array packaging
#6980WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE
#6981Integrated chip package structure using organic substrate and method of manufacturing the same
#6982Semiconductor device and method of fabricating the semiconductor device
#6983WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF
#6984STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME
#6985Semiconductor device and method for manufacturing the same
#6986Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications
#6987Semiconductor device
#6988Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
#6989IC chip and its manufacturing method
#6990Magnetically alignable integrated circuit device
#6991Semiconductor device and method for producing the same
#6992Structure and method for self protection of power device with expanded voltage ranges
#6993Semiconductor device
#6994Electronic flame-off electrode with ball-shaped tip
#6995Interconnect structure with stress buffering ability and the manufacturing method thereof
#6996Selective etch of TiW for capture pad formation
#6997Method for manufacturing printed circuit board having embedded component
#6998METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY
#6999Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
#7000Semiconductor device and manufacturing method thereof
#7001Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device
#7002Sheet to Form a Protective Shield for Chips
#7003Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion
#7004Power semiconductor module
#7005Connecting microsized devices using ablative films
#7006Semiconductor device
#7007Integration type semiconductor device and method for manufacturing the same
#7008Semiconductor Device and Method for Fabricating the Same
#7009Low fabrication cost, fine pitch and high reliability solder bump
#7010Semiconductor device and manufacturing method of the same
#7011Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
#7012Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
#7013SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#7014Method of making solder pad
#7015SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND GROUND SHIELD
#7016Leadframe for leadless package, structure and manufacturing method using the same
#7017Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#7018Semiconductor device comprising a semiconductor chip stack and method for producing the same
#7019Semiconductor package and method
#7020Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same
#7021Semiconductor device with improved pads
#7022Semiconductor device and method for manufacturing the same
#7023Semiconductor device with power noise suppression
#7024Semiconductor device
#7025Integrated circuits and interconnect structure for integrated circuits
#7026Integrated circuits and interconnect structure for integrated circuits
#7027Wiring board manufacturing method
#7028Semiconductor device and a method of manufacturing the same
#7029Interconnection designs and materials having improved strength and fatigue life
#7030Semiconductor device and process for manufacturing the same
#7031Encapsulation method
#7032Manufacturing method of a tray, a socket for inspection, and a semiconductor device
#7033ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
#7034Chip package structure
#7035Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
#7036Semiconductor device
#7037Flip chip with interposer, and methods of making same
#7038Semiconductor device and manufacturing method thereof
#7039Chip package
#7040SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
#7041SEMICONDUCTOR DEVICE
#7042Low shrinkage polyester thermosetting resins
#7043Wire Bonds Having Pressure-Absorbing Balls
#7044UBM structure for strengthening solder bumps
#7045Semiconductor device
#7046SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER
#7047Curing layers of a semiconductor product using electromagnetic fields
#7048Plastic package and method of fabricating the same
#7049Semiconductor device
#7050Semiconductor device
#7051Semiconductor device
#7052Mounted body and method for manufacturing the same
#7053LOW-STRESS HERMETIC DIE ATTACH
#7054Semiconductor module including semiconductor chips coupled to external contact elements
#7055Semiconductor Device with Improved Contact Pad and Method for Fabrication Thereof
#7056Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
#7057Wafer-level package having test terminal
#7058Substrate and method for manufacturing the same
#7059Mounting substrate and electronic device
#7060Electrical interconnect structure and method
#7061Wiring design support apparatus for bond wire of semiconductor devices
#7062Method to create a metal pattern using a damascene-like process
#7063Solder connector structure and method
#7064Wafer level package with good CTE performance
#7065MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#7066THERMAL BONDING PROCESS FOR CHIP PACKAGING
#7067Display device
#7068Method And System for Output Matching of Rf Transistors
#7069Semiconductor device and method of manufacturing same
#7070Interconnect for chip level power distribution
#7071Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic Component
#7072Semiconductor device with a semiconductor chip connected in a flip chip manner
#7073Top layers of metal for high performance IC's
#7074Novel substrate design for semiconductor device
#7075Mobile binding in an electronic connection
#7076Integrated circuit device and method for the production thereof
#7077Chips having rear contacts connected by through vias to front contacts
#7078Semiconductor device and method of manufacturing semiconductor device
#7079Semiconductor package structure having enhanced thermal dissipation characteristics
#7080Arrangement for high frequency application
#7081Semiconductor device including redistribution line structure and method of fabricating the same
#7082Semiconductor light-emitting device
#7083Heat cycle-able connection
#7084Joining method and device produced by this method and joining unit
#7085FABRICATION METHOD AND STRUCTURE OF PCB ASSEMBLY, AND TOOL FOR ASSEMBLY THEREOF
#7086Manufacturing method of tape carrier for TAB
#7087Flux for soldering and soldering process
#7088METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND
#7089Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
#7090Inkjet printed wirebonds, encapsulant and shielding
#7091Method for fabricating a low cost integrated circuit (IC) package
#7092Manufacturing method of semiconductor device
#7093Print mask and method of manufacturing electronic components using the same
#7094Method of assembling chips
#7095GANG FLIPPING FOR FLIP-CHIP PACKAGING
#7096Semiconductor device with electrode pad having probe mark
#7097INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME
#7098Semiconductor device
#7099Semiconductor device and method of manufacturing the same
#7100RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE
#7101Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same
#7102Semiconductor device
#7103SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS
#7104Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device
#7105Semiconductor package
#7106Semiconductor Package and Method for Fabricating the Same
#7107SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#7108Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
#7109Semiconductor device
#7110Semiconductor device and manufacturing method thereof
#7111Packaging substrate structure with a semiconductor chip embedded therein
#7112Semiconductor device
#7113SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME
#7114Controlling substrate surface properties via colloidal coatings
#7115Semiconductor device and method of manufacturing the same
#7116Composite semiconductor device
#7117Integrated circuits and interconnect structure for integrated circuits
#7118Semiconductor device with different sized ESD protection elements
#7119Apparatus and method for semiconductor wafer bumping via injection molded solder
#7120Die backside wire bond technology for single or stacked die package
#7121Circuit board and circuit device
#7122APPARATUSES AND METHODS FOR FORMING SMART LABELS
#7123Method for producing electrically conductive bushings through non-conductive or semiconductive substrates
#7124Method of wire bonding over active area of a semiconductor circuit
#7125METHOD OF MANUFACTURING DEVICE
#7126Manufacturing method for devices
#7127Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
#7128Method of making semiconductor package with plated connection
#7129Method for manufacturing a semiconductor device
#7130MARKED BODY AND MANUFACTURING METHOD THEREOF
#7131Antenna device and radio communication device
#7132Contact carriers (tiles) for populating larger substrates with spring contacts
#7133Module comprising a semiconductor chip
#7134SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD
#7135Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
#7136Semiconductor device and its manufacturing method
#7137Wire-bonded semiconductor component with reinforced inner connection metallization
#7138Semiconductor element connected to printed circuit board
#7139Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure
#7140Semiconductor device with Al pad
#7141Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
#7142Flip chip semiconductor device including an unconnected neutralizing electrode
#7143Method of forming solder bump on high topography plated Cu
#7144STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CAPTURED PADS
#7145Semiconductor device and manufacturing method thereof
#7146Semiconductor device and method for manufacturing thereof
#7147Method of manufacturing electronic device, substrate and semiconductor device
#7148Copper die bumps with electromigration cap and plated solder
#7149Chip and wafer integration process using vertical connections
#7150Semiconductor package
#7151Semiconductor device including mounting board with stitches and first and second semiconductor chips
#7152Methods and apparatus for flip-chip-on-lead semiconductor package
#7153Paste for forming an interconnect and interconnect formed from the paste
#7154Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor
#7155Self chip redistribution apparatus and method for the same
#7156System for fabricating semiconductor components with conductive interconnects
#7157Fibrous laminate interface for security coatings
#7158Method of making an interconnect structure
#7159Wirebond structure and method to connect to a microelectronic die
#7160Method of joining chips utilizing copper pillar
#7161ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
#7162Power delivery package having through wafer vias
#7163TEMPORARY CHIP ATTACH USING INJECTION MOLDED SOLDER
#7164Microelectronic substrate including bumping sites with nanostructures
#7165Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board
#7166Semiconductor module with multiple semiconductor chips
#7167Electronic device and method for producing electronic devices
#7168SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#7169Device having a bonding structure for two elements
#7170Method for manufacturing semiconductor device
#7171SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD THEREOF
#7172Semiconductor package and fabricating method thereof
#7173MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME
#7174Lead structure for a semiconductor component and method for producing the same
#7175Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
#7176Apparatus comprising a device and method for producing it
#7177Article and panel comprising semiconductor chips, casting mold and methods of producing the same
#7178Method and apparatus for fabricating a plurality of semiconductor devices
#7179Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#7180Low cost lead-free preplated leadframe having improved adhesion and solderability
#7181Power module having stacked flip-chip and method of fabricating the power module
#7182Semiconductor device and method of manufacturing the same
#7183Semiconductor device and method of manufacturing same
#7184Lead frame, semiconductor device, and method of manufacturing the semiconductor device
#7185Vertical electrical interconnect formed on support prior to die mount
#7186CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
#7187Packaging methods for imager devices
#7188Semiconductor device and manufacturing method of the same
#7189Ultrahigh-purity copper and process for producing the same
#7190BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME
#7191Wiring substrate and electronic device
#7192Solar Cell (Sliver) Sub-Module Formation
#7193Method of opening reservoir of containment device
#7194Wireless communication system
#7195Method of manufacturing device having a UV-curable adhesive
#7196MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#7197Semiconductor module
#7198Method and structure for magnetically-directed, self-assembly of three-dimensional structures
#7199Class D amplifier arrangement
#7200Semiconductor device and method of manufacturing the same