SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN

Method for embedding a component in a base

Semiconductor integrated circuit device

Semiconductor apparatus having improved thermal fatigue life

Web process interconnect in electronic assemblies

Semiconductor device and method for manufacturing the same

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Conductive connection structure formed on the surface of circuit board and manufacturing method thereof

WIREBOND-LESS SEMICONDUCTOR PACKAGE

High density electronic packages

Bond Wireless Package

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Electronic device and method for producing a device

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Lead frame with included passive devices

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Light emitting diode package

Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Mounting device for electrical component

Acceleration sensor

Ball transferring method and apparatus

SEMICONDUCTOR MEMORY DEVICE

Semiconductor device and method of manufacturing same

Structure and method of making sealed capped chips

Method of manufacturing a semiconductor device

Chip scale package and method for manufacturing the same

Semiconductor device with stacked chips and method for manufacturing thereof

Method of fabricating microelectronic devices

Method of assembling displays on substrates

Multiplexed RF isolator

Differential signaling system and method of controlling skew between signal lines thereof

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

Power semiconductor devices having integrated inductor

Semiconductor switching module and method

Chip-stacked package structure

Carrier board structure with embedded semiconductor chip and fabrication method thereof

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

Solder Interconnect Joints For A Semiconductor Package

Electronic device including a conductive stud over a bonding pad region

Versatile Si-based packaging with integrated passive components for mmWave applications

METHOD FOR SEPARATING PACKAGE OF WLP

Bump pattern design for flip chip semiconductor package

Integrated circuit component with a surface-mount housing

Plate structure having chip embedded therein and the manufacturing method of the same

Semiconductor package device

Electronic Device and Method For Producing the Same

Electrical through contact

Method for placing material onto a target board by means of a transfer board

On-chip magnetic components

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Wiring substrate and manufacturing method thereof, and semiconductor device

Methods of forming electronic structures including conductive shunt layers and related structures

Solder Ball Pad Structure

Electronic system modules and method of fabrication

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Film splicer

Multiplexed RF isolator circuit

Substrate structure integrated with passive components

Image alignment method for binocular eyewear displays

Multi-die DC-DC buck power converter with efficient packaging

Methods for providing and using grid array packages

Microelectronic device connection structure

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Semiconductor device

Semiconductor device with interface peeling preventing rewiring layer

Solder bumps in flip-chip technologies

Semiconductor device and manufacturing method for the same

Substrate and process for semiconductor flip chip package

Solder connector structure and method

Substrate structure integrated with passive components

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME

Contact device for use in a power semiconductor module or in a disc-type thyristor

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Semiconductor device

Fabrication method and structure of PCB assembly, and tool for assembly thereof

Bonding apparatus

Method for self-assembling microstructures

Bonding apparatus and method for cleaning tip of a bonding tool

ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Single chip USB packages by various assembly methods

Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle

Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device

Structure of image sensor module and a method for manufacturing of wafer level package

Method to build robust mechanical structures on substrate surfaces

Electronic component module and radio comunications equipment

Flip chip mounting process and flip chip assembly

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR CHIP

Semiconductor integrated circuit device

Semiconductor device with reduced contact resistance

Electronic component of VQFN design and method for producing the same

Flip-chip semiconductor package and chip carrier for preventing corner delamination

Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device

Compliant Bumps for Integrated Circuits Using Carbon Nanotubes

Chip having two groups of chip contacts

Semiconductor device and manufacturing method therefor

Electronic circuit in a package-on-package configuration and method for producing the same

Pillar Bump Package Technology

Chip package structure and manufacturing method thereof

Surface mount multichip devices

Structure of image sensor module and a method for manufacturing of wafer level package

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Power semiconductor apparatus

Methods and apparatus for packaging integrated circuit devices

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Semiconductor device and an information management system therefor

Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package

Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof

Automatic level adjustment for die bonder

Conductive adhesive rework method

Method and apparatus for microstructure assembly

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bonding

Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

Packaging structure with protective layers and packaging method thereof

System and method of attenuating electromagnetic interference with a grounded top film

Diffusion soldered semiconductor device

Process for manufacture of thin wafer

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

ESD protection circuit for semiconductor device

Component and method for producing a component

Method for producing chip packages, and chip package produced in this way

Chip structure with redistribution traces

Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction

Semiconductor device and method of producing the same

Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween

Semiconductor device, electro-optical device, and method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device having pillar-shaped terminal

Methods and apparatus for packaging integrated circuit devices

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device

EMI ABSORBING GAP FILLING MATERIAL

Semiconductor Package Having Improved Adhesion and Solderability

Semiconductor with reduced pad pitch

Semiconductor device and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Wire bonding apparatus

Electronic parts packaging structure and method of manufacturing the same

Sheet Peeling Apparatus and Peeling Method

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film

Compressible films surrounding solder connectors

Structure of high performance combo chip and processing method

Integrated circuit package, panel and methods of manufacturing the same

Semiconductor device with electrode pad having probe mark

Electronic device with EMI screen and packing process thereof

Multilayer printed circuit board

Power semiconductor module with connection elements electrically insulated from one another

Thermally conductive composite and uses for microelectronic packaging

Misalignment detection devices

Copper bonding compatible bond pad structure and method

Semiconductor package including dummy board and method of fabricating the same

Semiconductor package and method of manufacturing the same

Method for bonding wafers to produce stacked integrated circuits

Solderability Improvement Method for Leaded Semiconductor Package

Superfine-circuit semiconductor package structure

Flip chip package including a non-planar heat spreader and method of making the same

Semiconductor constructions and assemblies, and electronic systems

SEMICONDUCTOR PACKAGE

Composite multi-layer substrate and module using the substrate

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Electronic module with switching functions and method for producing the same

Thermal release adhesive-backed carrier tapes

Flip chip package and method of fabricating the same

Method of Manufacturing a Semiconductor Device

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with back surface electrode including a stress relaxation film

Method and apparatus for measuring oscillation amplitude of an ultrasonic device

Bond and method for bonding two contact surfaces

Method for production of a semiconductor component

Bonding pad structure and method for making the same

Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages

Detachable stiffener for ultra-thin die

Nickel tin bonding system for semiconductor wafers and devices

Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices

Wafer-level bonding for mechanically reinforced ultra-thin die

Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture

Semiconductor device and method of manufacturing the semiconductor device

Fine pitch microcontacts and method for forming thereof

High density nanostructured interconnection

Stack package having pattern die redistribution

Multiple-dies semiconductor device with redistributed layer pads

Integrated circuit (IC) chip and method for fabricating the same

Semiconductor package having embedded passive elements and method for manufacturing the same

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Electronic package and semiconductor device using the same

System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System

Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same

Ball forming device in a bonding apparatus and ball forming method

Printed circuit board and method of manufacturing the same

Circuit-connecting material and circuit terminal connected structure and connecting method

SURFACE TREATMENT, SORTING AND ASSEMBLING METHODS OF MICROELECTRONIC DEVICES AND STORAGE STRUCTURE THEREOF

Capping of metal interconnects in integrated circuit electronic devices

Die configurations and methods of manufacture

Method for applying solder to redistribution lines

Method of manufacturing a semiconductor device

Method for bonding semiconductor chip

Au bonding wire for semiconductor device

BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE

Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same

Die package and probe card structures and fabrication methods

Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Module Having Low Thermal Load

RF power transistor having an encapsulated chip package

Three dimensional integrated circuit and method of making the same

Semiconductor apparatus with decoupling capacitor

Semiconductor device, and life prediction circuit and life prediction method for semiconductor device

Micro universal serial bus (USB) memory package

Semiconductor device, manufacturing method and apparatus for the same

Molding methods to manufacture single-chip chip-on-board USB device

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Microelectronic assembly with back side metallization and method for forming the same

Manufacturing method of semiconductor device

METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Micro power converter and method of manufacturing same

Integrated circuit (IC) package stacking and IC packages formed by same

Multilayer bonding ribbon

SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Resin Paste For Die Bonding And Its Use

Top layers of metal for high performance IC's

Embedded chip package structure

INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING

Via layout with via groups placed in interlocked arrangement

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Structure and method for producing multiple size interconnections

Electronic component, semiconductor device employing same, and method for manufacturing electronic component

Semiconductor device having semiconductor element with back electrode on insulating substrate

Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same

Electrically conductive connection, electronic component and method for their production

Semiconductor package having dimpled plate interconnections

Thermal improvement for hotspots on dies in integrated circuit packages

IC chip package, and image display apparatus using same

Method of wafer plating

Top layers of metal for high performance IC's

Semiconductor device capable of suppressing current concentration in pad and its manufacture method

Composition for removing a photoresist and method of forming a bump electrode

Substrate treating method and method of manufacturing semiconductor apparatus

Fabrication method of semiconductor integrated circuit device

Electronic device and production method thereof

Semiconductor package and method of assembling the same

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Method of manufacturing an integrated circuit

Method of fixing curved circuit board and wire bonding apparatus

Wiring module

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Chip and flat panel display apparatus comprising the same

Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag

Electronics package and associated method

Electronic circuit arrangement

Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Semiconductor device having improved contacts

Top layers of metal for high performance IC's

Wiring board and method for manufacturing the same, and semiconductor device

Semiconductor Device

Method of making thermally enhanced substrate-base package

Mounting integrated circuit dies for high frequency signal isolation

Semiconductor device package utilizing proud interconnect material

Semiconductor device and method for producing the semiconductor device

Semiconductor device

Electronic Part And Method Of Producing The Same

Semiconductor integrated circuit device, and method of designing and manufacturing the same

Semiconductor device with improved high current performance

Semiconductor device

Interconnections resistant to wicking

Methods and apparatus for a semiconductor device package with improved thermal performance

SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT

INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE

Wire bonding method for forming low-loop profiles

HIGHLY COMPLIANT PLATE FOR WAFER BONDING

Resonating conductive traces and methods of using same for bonding components

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Semiconductor device and method for fabricating the same