212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Top layers of metal for high performance IC's
#8402Top layers of metal for high performance IC's
#8403Method of Dissipating heat, Packaging and Shaping for Light Emitting Diodes
#8404Method and system for fabricating a semiconductor device
#8405METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#8406Chip stack package and manufacturing method thereof
#8407Semiconductor device encapsulated with resin composition
#8408Backages with buried electrical feedthroughs
#8409METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#8410Encapsulated electronic device
#8411Microelectronic element chips
#8412Semiconductor device
#8413Top layers of metal for high performance IC's
#8414Top layers of metal for high performance IC's
#8415Top layers of metal for high performance IC's
#8416Top layers of metal for high performance IC's
#8417Top layers of metal for high performance IC's
#8418Top layers of metal for high performance IC's
#8419Top layers of metal for high performance IC's
#8420Top layers of metal for high performance IC's
#8421Interlayer dielectric and pre-applied die attach adhesive materials
#8422Top layers of metal for high performance IC's
#8423Semiconductor device and method for fabricating the same
#8424System and method to reduce metal series resistance of bumped chip
#8425Semiconductor circuit arrangement
#8426Semiconductor package structure having enhanced thermal dissipation characteristics
#8427Electronic assemblies and systems with filled no-flow underfill
#8428Producing thin integrated semiconductor devices
#8429Semiconductor integrated circuit device
#8430Semiconductor device having a bonding wire and method for manufacturing the same
#8431Side stacking apparatus and method
#8432Circuit Arrangement, System Carrier and Methods for Producing Same
#8433Lead frame and method of manufacturing the same and semiconductor device
#8434Leadframe IC packages having top and bottom integrated heat spreaders
#8435Semiconductor device and method for manufacturing the same
#8436Light-emitting device manufacturing method and light-emitting device
#8437Method for producing a chip-substrate connection
#8438Spring connector for making electrical contact at semiconductor scales
#8439Barrier layer for fine-pitch mask-based substrate bumping
#8440Contact surrounded by passivation and polymide and method therefor
#8441Fabrication method of semiconductor device
#8442Separation method of semiconductor device
#8443Electronic Component Mounting Structure
#8444Non-cyanide gold electroplating for fine-line gold traces and gold pads
#8445Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#8446Top layers of metal for high performance IC's
#8447Top layers of metal for high performance IC's
#8448Top layers of metal for high performance IC's
#8449Top layers of metal for high performance IC's
#8450Top layers of metal for high performance IC's
#8451Top layers of metal for high performance IC's
#8452Top layers of metal for high performance IC's
#8453Top layers of metal for high performance IC's
#8454Top layers of metal for high performance IC's
#8455Top layers of metal for high performance IC's
#8456Method of wire bonding over active area of a semiconductor circuit
#8457Device Comprising Circuit Elements Connected By Bonding Bump Structure
#8458Integrated circuit package having exposed thermally conducting body
#8459Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate
#8460Semiconductor device
#8461SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#8462Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
#8463Semiconductor device and method for manufacturing the same
#8464Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
#8465System and Method for Low Temperature Plasma Enhanced Bonding
#8466Conductive adhesive composition
#8467Electronic components with plurality of contoured microelectronic spring contacts
#8468Method of providing solder bumps using reflow in a forming gas atmosphere
#8469WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
#8470Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)
#8471Temporary chip attach using injection molded solder
#8472Apparatus For Aligning Microchips On Substrate And Method For The Same
#8473METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
#8474Stub-tuned wirebond package
#8475Integrated circuit having pads and input/output (I/O) cells
#8476Semiconductor device having pad structure for preventing and buffering stress of silicon nitride film
#8477INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
#8478Dual-sided chip attached modules
#8479Manufacturing a bump electrode with roughened face
#8480Semiconductor device having low dielectric insulating film and manufacturing method of the same
#8481Semiconductor device and method of manufacturing the same
#8482Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
#8483No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#8484Wafer level semiconductor chip packages and methods of making the same
#8485Flip chip MLP with folded heat sink
#8486Copper straps
#8487Top layers of metal for high performance IC's
#8488Methods and apparatus having an integrated circuit attached to fused silica
#8489Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component
#8490Method for manufacturing an electronics module
#8491Method of producing an electronic component
#8492Integrated circuit chip packaging
#8493Method and apparatus for locating and/or forming bumps
#8494Method for forming a semiconductor on insulator structure
#8495Micro-package, multi-stack micro-package, and manufacturing method therefor
#8496Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#8497Method of manufacturing a semiconductor device
#8498Module With Built-In Semiconductor And Method For Manufacturing The Module
#8499Method for fabricating semiconductor package with multi-layer die contact and external contact
#8500SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8501Semiconductor device having a chip stack on a rewiring plate
#8502Semiconductor device
#8503Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
#8504Semiconductor device and method of producing the same
#8505Top layers of metal for high performance IC's
#8506Top layers of metal for high performance IC's
#8507Top layers of metal for high performance IC's
#8508Top layers of metal for high performance IC's
#8509Top layers of metal for high performance IC's
#8510Top layers of metal for high performance IC's
#8511Electronic component built-in substrate and method of manufacturing the same
#8512Circuit board, method for manufacturing the same, and semiconductor device
#8513COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
#8514Method of fabricating microelectronic devices
#8515THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE
#8516INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS
#8517Integrated circuit device with semiconductor device components embedded in plastic housing composition
#8518Semiconductor device having shifted stacked chips
#8519Lead frame and semiconductor device using the same
#8520Component mounting apparatus and component mounting method
#8521Method and system for fabricating a semiconductor device
#8522METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABLE OF PREVENTING ADHESIVES FROM ABSORBING WATER
#8523Process for fabricating chip package structure
#8524Printed circuit board
#8525Semiconductor module
#8526SEMICONDUCTOR MODULE
#8527Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips
#8528Semiconductor device including a buffer layer structure for reducing stress
#8529Process for forming bumps and solder bump
#8530Test pads on flash memory cards
#8531Wafer level stack structure for system-in-package and method thereof
#8532Arrangement for welding workpieces by means of an ultrasonic device
#8533CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD
#8534ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS
#8535Method of making a radio frequency identification (RFID) tag
#8536Process for bonding and electrically connecting microsystems integrated in several distinct substrates
#8537Systems and methods for high density multi-component modules
#8538Method of forming stackable package
#8539Method of making wirebond electronic package with enhanced chip pad design
#8540Method of preventing dielectric breakdown of semiconductor device and semiconductor device preventing dielectric breakdown
#8541Oriented self-location of microstructures with alignment structures
#8542INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#8543Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#8544Semiconductor device having a smaller electrostatic capacitance electrode
#8545Bump structure, method of forming bump structure, and semiconductor apparatus using the same
#8546SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME
#8547Circuit apparatus and method of fabricating the apparatus
#8548Packaging of integrated circuits to lead frames
#8549System and method for providing a power bus in a wirebond leadframe package
#8550Semiconductor device
#8551Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
#8552Polymer matrices for polymer solder hybrid materials
#8553Semiconductor device with via hole of uneven width
#8554Method of manufacturing semiconductor apparatus
#8555Method of dividing an adhesive film bonded to a wafer
#8556Method for fabricating semiconductor package free of substrate
#8557Method for fabricating multi-chip semiconductor package
#8558Semiconductor device and method of manufacturing the semiconductor device
#8559Semiconductor die package including multiple dies and a common node structure
#8560Surface mounting electronic component and manufacturing method thereof
#8561Filter device substrate and filter device
#8562Semiconductor device
#8563Semiconductor power module including epoxy resin coating
#8564Semiconductor device and method for producing the same
#8565Semiconductor device and method of manufacturing the same
#8566Wafer level semiconductor module and method for manufacturing the same
#8567Utra-thin substrate package technology
#8568Semiconductor components having encapsulated through wire interconnects (TWI)
#8569Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
#8570Package for optical device and method of manufacturing the same
#8571Power semiconductor module having surface-mountable flat external contacts and method for producing the same
#8572Memory circuit system having semiconductor devices and a memory
#8573MULTI-DIE INDUCTOR
#8574MOSFET power package
#8575Semiconductor device using semiconductor chip
#8576Fill head for injection molding of solder
#8577Universal mold for injection molding of solder
#8578Tail wire cutting method and bonding apparatus
#8579Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film
#8580Method for Electroplating and Contact Projection Arrangement
#8581Fabrication method for electronic system modules
#8582FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD
#8583Method of manufacturing a through electrode
#8584POP Semiconductor Device Manufacturing Method
#8585Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
#8586Flip-chip mounting method and bump formation method
#8587Thin semiconductor device package
#8588Semiconductor memory device and defect remedying method thereof
#8589Solder joint flip chip interconnection having relief structure
#8590Wiring board, semiconductor device using the same, and method for manufacturing wiring board
#8591Conductive structures including titanium-tungsten base layers
#8592Semiconductor device, substrate for producing semiconductor device and method of producing them
#8593Stacked semiconductor device
#8594Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
#8595Optical display package and the method thereof
#8596Adhesive sheet, semiconductor device, and process for producing semiconductor device
#8597Alternative flip chip in leaded molded package design and method for manufacture
#8598Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes
#8599Semiconductor light emitting device with first and second leads
#8600PROCESS FOR PRODUCING POWER SEMICONDUCTOR COMPONENTS USING A MARKER
#8601Semiconductor device and method of producing the same
#8602NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING
#8603Method for bonding a semiconductor substrate to a metal substrate
#8604Transfer tape strap process
#8605Apparatus and method for signal bus line layout in semiconductor device
#8606Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
#8607Bilayer Laminated Film for Bump Formation and Method of Bump Formation
#8608Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same
#8609Bonding Wire and Integrated Circuit Device Using the Same
#8610Semiconductor die packages using thin dies and metal substrates
#8611Chip with power and signal pads connected to power and signal lines on substrate
#8612Space transformer having multi-layer pad structures
#8613Hybrid flip-chip and wire-bond connection package system
#8614Methods and apparatus for a reduced inductance wirebond array
#8615ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#8616Electronic device with selective nickel palladium gold plated leadframe and method of making the same
#8617Power semiconductor module and fabrication method
#8618Chip scale surface mount package for semiconductor device and process of fabricating the same
#8619Semiconductor device and method of manufacturing the same
#8620Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement
#8621SEMICONDUCTOR DEVICE HAVING CARBON NANOTUBE INTERCONNECTS AND METHOD OF FABRICATION
#8622Wire bonding capillary tool having multiple outer steps
#8623Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#8624Devices with microjetted polymer standoffs
#8625Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device
#8626QFN housing having optimized connecting surface geometry
#8627Semiconductor device having adhesion increasing film to prevent peeling
#8628Semiconductor device and method for manufacturing the same
#8629Semiconductor device and manufacturing method thereof
#8630Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#8631Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#8632Methods and materials useful for chip stacking, chip and wafer bonding
#8633Singulating surface-mountable semiconductor devices and fitting external contacts to said devices
#8634Room temperature metal direct bonding
#8635Semiconductor device fabricating method
#8636Semiconductor device manufacturing method
#8637Process for fabricating a semiconductor package
#8638Method for making a wedge wedge wire loop
#8639Method of manufacturing semiconductor device
#8640Gold/silicon eutectic die bonding method
#8641Flexible interconnect pattern on semiconductor package
#8642Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
#8643Barrier for use in 3-D integration of circuits
#8644Functional blocks for assembly
#8645Fabrication method of semiconductor integrated circuit device
#8646Method of correcting bonding coordinates using reference bond pads
#8647Flip chip bonding structure
#8648Adjustable thickness thermal interposer and electronic package utilizing same
#8649Carbon nanotube via interconnect
#8650Piezoelectric device and method for manufacturing the same
#8651SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#8652Isolating chip-to-chip contact
#8653Semiconductor device with guard rings that are formed in each of the plural wiring layers
#8654Flip chip bonded package applicable to fine pitch technology
#8655High-performance semiconductor package
#8656Semiconductor device and manufacturing method thereof
#8657Semiconductor device that improves electrical connection reliability
#8658Power semiconductor component with a power semiconductor chip and method for producing the same
#8659Interconnect structure with stress buffering ability and the manufacturing method thereof
#8660Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#8661Method for fabricating chip package structure
#8662Semiconductor device including a DC-DC converter
#8663Folding chip planar stack package
#8664Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader
#8665Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#8666Method and arrangement for forming a microelectronic package
#8667Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#8668Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
#8669Solder layer and electronic device bonding substrate and submount using the same
#8670Connecting device for electronic components
#8671Multilayer printed circuit board
#8672Heat conduction from an embedded component
#8673HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#8674SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB
#8675Resin Paste for Die Bonding
#8676Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip
#8677PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#8678System for making a semiconductor device using bump material including liquid
#8679Semiconductor device and medium of fabricating the same
#8680Single passivation layer scheme for forming a fuse
#8681Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
#8682Method for fabricating a BGA device and BGA device
#8683Die bonding
#8684Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
#8685INDIUM FEATURES ON MULTI-CONTACT CHIPS
#8686Method of manufacturing display device using LED chips formed in a porous template
#8687Conductor composition, a mounting substrate and a mounting structure utilizing the composition
#8688Reactive foil assembly
#8689Semiconductor device
#8690SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
#8691Semiconductor device and fabrication process thereof
#8692Semiconductor integrated circuit device
#8693Chip package
#8694Method for precision assembly of integrated circuit chip packages
#8695Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
#8696Semiconductor components with through wire interconnects
#8697Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions
#8698Electronic component having exposed surfaces
#8699Semiconductor devices and electrical parts manufacturing using metal coated wires
#8700Semiconductor device and manufacturing method of a semiconductor device