Semiconductor device with multilayered metal pattern

Semiconductor device and method of manufacturing the same

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Method of forming a semiconductor package and structure thereof

Pressure-contactable power semiconductor module

Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device

Fluxes for flip chip assembly using water soluble polymers

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

Fine pitch electronic flame-off wand electrode

Hybrid integrated circuit device and method of manufacturing the same

Method of manufacturing a module

Circuit carrier and production thereof

Manufacturing method of electronic components embedded substrate

ULTRA-FINE CONTACT ALIGNMENT

Methods relating to forming interconnects and resulting assemblies

System having semiconductor component with encapsulated, bonded, interconnect contacts

Electrical or electronic component and method of producing same

Method for manufacturing an electronic circuit device and electronic circuit device

Method for mounting passive components on wafer

Method of manufacturing wafer level chip size package

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Resin composition for encapsulating semiconductor device

Microelectronic devices and methods for packaging microelectronic devices

Semiconductor package

I/C chip suitable for wire bonding

Designs and methods for conductive bumps

Bonded structure using conductive adhesives, and a manufacturing method thereof

Package assembly for electronic device

Manufacturing a bump electrode with roughened face

Substrate with terminal pads having respective single solder bumps formed thereon

Integrating chip scale packaging metallization into integrated circuit die structures

Semiconductor integrated circuit and electronic apparatus having the same

Semiconductor device having heat dissipation layer

Semiconductor device

Semiconductor device and method for fabricating the same

Receptacle for a programmable, electronic processing device

Method of fabrication of semiconductor integrated circuit device

Wire bonding method and apparatus

Via placement for layer transitions in flexible circuits with high density ball grid arrays

Method of fixing a sealing object to a base object

Method for the lateral contacting of a semiconductor chip

Semiconductor apparatus and method for fabricating the same

Image sensor packages

Moisture-resistant electronic device package and methods of assembly

Head assembly, disk unit, and bonding method and apparatus

Semiconductor device capable of detecting an open bonding wire using weak current

Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

Apparatus and method for mounting or wiring semiconductor chips

Electrical circuit assembly with improved shock resistance

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Semiconductor device having a pair of heat sinks and method for manufacturing the same

High-frequency module and method for manufacturing the same

Semiconductor apparatus with decoupling capacitor

Circuit device and manufacturing method of circuit device

Semiconductor package with through-hole

Process for precise arrangement of micro-bodies

Method and device to elongate a solder joint

Thermal interface adhesive

Method for manufacturing a piezoelectric oscillator

Semiconductor device and method of manufacturing the same

Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same

Wire bonding method, semiconductor chip, and semiconductor package

Semiconductor device having fuse circuit on cell region and method of fabricating the same

Solder bump structure and method for forming the same

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

Method for producing display device

Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Semiconductor device

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Semiconductor device and method of manufacturing the same

Method and structure for prevention leakage of substrate strip

Flip chip substrate design

Semiconductor device having transferred integrated circuit

Semiconductor package

Process of manufacturing a solder-fill for applying to semiconductor package

Coupler resource module

Electrical contact and connector and method of manufacture

Electrical contact and connector and method of manufacture

Bond pad techniques for integrated circuits

Method for fabricating thermally enhanced semiconductor device

Diffusion solder position, and process for producing it

Method of forming a bond pad

Method of making a circuitized substrate

Semiconductor device and manufacturing method thereof

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Self-assembled nanometer conductive bumps and method for fabricating

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Electronic part mounting substrate and method for producing same

Direct write™ system

Inorganic thin layer, organic electroluminescence device including the same, and fabrication method thereof

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Multi-dice chip scale semiconductor components

Buried solder bumps for AC-coupled microelectronic interconnects

Zero capacitance bondpad utilizing active negative capacitance

Pad structures including insulating layers having a tapered surface

Adhesive sheet for producing a semiconductor device

Electronic devices with small functional elements supported on a carrier

Chip stack package and manufacturing method thereof

High-frequency chip packages

Integrated circuit package having inductance loop formed from a bridge interconnect

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween

Thermal conductive material utilizing electrically conductive nanoparticles

Solder-fill application for mounting semiconductor chip on PCB

Wafer-level chip scale package

Wirebonding insulated wire and capillary therefor

Circuit board and method of manufacturing the same

Process for forming lead-free bump on electronic component

Wire bonding for thin semiconductor package

Method of enhancing the adhesion between photoresist layer and substrate and bumping process

Active area bonding compatible high current structures

Fluxless assembly of chip size semiconductor packages

Electronic parts packaging structure and method of manufacturing the same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Process for making contact with and housing integrated circuits

Device transfer method and panel

High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system

Electric circuit substrate

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device

Microelectronic assemblies with springs

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Ball grid array package, stacked semiconductor package and method for manufacturing the same

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

Package module for an IC device and method of forming the same

Heat dissipation apparatus for package device

Coolant cooled type semiconductor device

Semiconductor package with improved chip attachment and manufacturing method thereof

Circuit device

Semiconductor device

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Semiconductor device including a semiconductor chip mounted on a metal base

Interconnections

Method of fabricating a light emitting device

Aqueous based metal etchant

Diode cutoff and safe packaging method for textile detonating cord

Electrical socket having terminals with elongated mating beams

Singulation method used in leadless packaging process

Semiconductor device and production method therefor

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Flip chip on lead frame

Process for producing a semiconductor device

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Method for manufacturing semiconductor devices

CSP semiconductor device having signal and radiation bump groups

Semiconductor package using flexible film and method of manufacturing the same

Wire bonding method for copper interconnects in semiconductor devices

Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

Semiconductor chip with bumps and method for manufacturing the same

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Power semiconductor module with deflection-resistant base plate

Semiconductor light emitting diode and semiconductor light emitting device

Probe card assembly

Encapsulated component which is small in terms of height and method for producing the same

Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition

Asymmetric plating

Low fabrication cost, fine pitch and high reliability solder bump

Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Fabrication method of semiconductor device

Method for creating flip-chip conductive-polymer bumps using photolithography and polishing

Lead frame, semiconductor device using the same and method of producing the semiconductor device

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

Method for creating adhesion during fabrication of electronic devices

Semiconductor memory module

Cooler for cooling electric part

Tin/indium lead-free solders for low stress chip attachment

Apparatus and method for packaging circuits

Multi-functional solder and articles made therewith, such as microelectronic components

Semiconductor apparatus and method of manufacturing the same

Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

Integrated circuit package with overlapping bond fingers

Stacked mass storage flash memory package

Module with embedded semiconductor IC and method of fabricating the module

Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

Topless semiconductor package

Semiconductor module and DC-DC converter

Protection circuit device using MOSFETs and a method of manufacturing the same

Semiconductor device and method of manufacturing the same

Light-emitting diode array

Multi-functional solder and articles made therewith, such as microelectronic components

Wire bonders and methods of wire-bonding

Method for checking the quality of a wedge bond

Circuit board

Surface mounted electronic circuit module

Process for the production of improved metallized films

Multi-functional solder and articles made therewith, such as microelectronic components

Method for producing a semiconductor device in chip format

Integrated underfill process for bumped chip assembly

Semiconductor processing methods

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Bonding structure with pillar and cap

Semiconductor integrated circuit device

Conductive block mounting process for electrical connection

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Manufacturing method of semiconductor device

Packaged microelectronic components

Method of manufacturing a semiconductor device

Method of bonding semiconductor devices

Power supply device

Low-inductance circuit arrangement for power semiconductor modules

High frequency circuit using high output amplifier cell block and low output amplifier cell block

Semiconductor device and semiconductor device manufacturing method

Pad over active circuit system and method with meshed support structure

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Nickel bonding cap over copper metalized bondpads

High reliability chip scale package

Semiconductor device with strain relieving bump design

Method for assembling a ball grid array package with multiple interposers

Solder pads and method of making a solder pad

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Semiconductor device and its manufacturing method

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Stacked chip-packaging structure

Packaged microelectronic devices and methods of forming same

Electronic device package

Standoffs for centralizing internals in packaging process

Semiconductor device and manufacturing method thereof

Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps

Method of making a semiconductor device having an opening in a solder mask

Nickel bonding cap over copper metalized bondpads

Stable electroless fine pitch interconnect plating

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Method for forming bump protective collars on a bumped wafer

Bumping process

Methods of forming conductive structures including titanium-tungsten base layers and related structures

Method and apparatus for attaching microelectronic substrates and support members

Method for making electronic devices including silicon and LTCC and devices produced thereby

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Metallized films

Methods and devices for providing bias to a monolithic microwave integrated circuit

Module part

IC chip with improved pillar bumps

Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor component having conductors with wire bondable metalization layers

Semiconductor device with connections for bump electrodes

Structure of multi-tier wire bonding for high frequency integrated circuit

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Interconnecting component

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Semiconductor device and switching element

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Method for forming a chip package

Module for high voltage power for converting a base of IGBT components

Light-emitting semiconductor component

[PROCESS FOR FABRICATING BUMPS]

Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device

Forming tool for forming a contoured microelectronic spring mold

Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus

Method, system, and apparatus for transfer of dies using a pin plate

Substrate holder and plating apparatus

Method for forming a bond pad interface

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Method of making a semiconductor device having an opening in a solder mask

Stencil mask design method and under bump metallurgy for C4 solder bump

Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

Electronic component-built-in module

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Semiconductor interconnect having compliant conductive contacts

Semiconductor device including a diffusion layer

Reconnectable chip interface and chip package

Semiconductor device having chip size package with improved strength

Method of surface-mounting semiconductor chip on PCB

Semiconductor unit with cooling system

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Enhanced die-down ball grid array and method for making the same

Cutting method and method of manufacturing semiconductor device

Reconnectable chip interface and chip package

Modular power semiconductor module

Semiconductor device including inclined cut surface and manufacturing method thereof

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Dual gauge leadframe

Semiconductor device including a potential drawing portion formed at a corner

Semiconductor device

Semiconductor device having a flip-chip construction

Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET

Semiconductor device wiring structure

Low temperature bonding of multilayer substrates

Method of fabricating an electronic device

Semiconductor manufacturing apparatus, and method for manufacturing semiconductor device

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device