Methods of forming solder areas on electronic components and electronic components having solder areas

Flip-chip solder bump formation using a wirebonder apparatus

Wire bonding simulation

Wire bonding apparatus and method for clamping a wire

Chip orientation and attachment method

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Electronic parts built-in substrate and method of manufacturing the same

Castellation wafer level packaging of integrated circuit chips

Method of making a microelectronic assembly

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Method of manufacturing a semiconductor device and a semiconductor device

Semiconductor component and method for fabricating

Inverted J-lead for power devices

Structure and method for fabricating a bond pad structure

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device

Semiconductor device and the method of producing the same

Semiconductor device and method for fabricating the same

Solder bump structure for flip chip package and method for manufacturing the same

Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board

Power semiconductor module and method for producing it

Ball grid array package substrates with a modified central opening and method for making the same

Copper-based chip attach for chip-scale semiconductor packages

Semiconductor package with improved solder joint reliability

Thin, thermally enhanced molded package with leadframe having protruding region

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

[METHOD OF FORMING BOND MICROSTRUCTURE]

Mounting method of bump-equipped electronic component and mounting structure of the same

Bonding apparatus and bonding external appearance inspection device

Nano-metal composite made by deposition from colloidal suspensions

Method of incorporating interconnect systems into an integrated circuit process flow

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Connector for making electrical contact at semiconductor scales

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Method for embedding a component in a base and forming a contact

Method of forming land grid array packaged device

Fan out type wafer level package structure and method of the same

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Semiconductor device and method of manufacturing thereof

Power amplifier module for wireless communication devices

Semiconductor device and a method of manufacturing the same

Internally reinforced bond pads

Offset-bonded, multi-chip semiconductor device

Semiconductor device manufacturing method and semiconductor device manufactured thereby

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Configuration for testing the bonding positions of conductive drops and test method for using the same

Method for the hermetic encapsulation of a component

Semiconductor device package utilizing proud interconnect material

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device

Semiconductor device with stacked chips

Temperature sustaining flip chip assembly process

Semiconductor device and method for fabricating the same

Thin package for stacking integrated circuits

Method for making dual gauge leadframe

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Chip and wafer integration process using vertical connections

Semiconductor device

Capillary with contained inner chamfer

Method of manufacturing circuits

Electroplating method for a semiconductor device

Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Methods of reducing bleed-out of underfill and adhesive materials

Techniques for joining an opto-electronic module to a semiconductor package

Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

Electronic device and method of manufacturing same

Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip

Stacked semiconductor device

Semiconductor interconnect having conductive spring contacts

Support structure for low-k dielectrics

Selective deposition of solder ball contacts

Semiconductor device and method of manufacturing the same

Semiconductor testing device

Method of making multichip wafer level packages and computing systems incorporating same

Method of interconnecting die and substrate

Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body

Formation of circuitry with modification of feature height

Semiconductor device and manufacturing method thereof

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Method of manufacturing a solid state image sensing device

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Roughened bonding pad and bonding wire surfaces for low pressure wire bonding

Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method

Semiconductor device and its manufacturing method, and semiconductor device manufacturing system

Semiconductor device and method of fabricating the same

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Electronics circuit manufacture

Wiring base with wiring extending inside and outside of a mounting region

Bond pad

Bonding structure with buffer layer and method of forming the same

Light source apparatus with light-emitting chip which generates light and heat

Semiconductor device and method of making the same

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Bump-on-lead flip chip interconnection

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Method for mounting semiconductor chip and semiconductor chip-mounted board

Wafer level packages for chips with sawn edge protection

Multi-concentric pad arrangements for integrated circuit pads

Electronic circuit unit with semiconductor components disposed on both surfaces of board

Highly reliable stack type semiconductor package

Encapsulated chip and procedure for its manufacture

Opto-electronic element with a metallized carrier

Low temperature solder chip attach structure and process to produce a high temperature interconnection

Low loop height ball bonding method and apparatus

Flip chip bonding tool tip

Bonding apparatus

Bonding tool with resistance

Film adhesives containing maleimide compounds and methods for use thereof

Wire bonding process for copper-metallized integrated circuits

Method of manufacturing a semiconductor device

Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument

Techniques for packaging multiple device components

Method of applying a pattern of particles to a substrate

Structure and method for lead free solder electronic package interconnections

Power amplifier device

Wafer level chip scale packaging structure and method of fabricating the same

Bond pad for flip chip package

Conductive bumps with non-conductive juxtaposed sidewalls

Flip chip device having supportable bar and mounting structure thereof

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Seedless wirebond pad plating

Barrier layers for tin-bearing solder joints

Corrosion-resistant bond pad and integrated device

Wafer-level package and its manufacturing method

Circuit device and manufacturing method thereof

Semiconductor package

Semiconductor device with magnetically permeable heat sink

Optimum padset for wire bonding RF technologies with high-Q inductors

Semiconductor chip package and method

Wafer level stack structure for system-in-package and method thereof

Methods and apparatus for packaging integrated circuit devices

Semiconductor device

Molded leadless package having a partially exposed lead frame pad

Semiconductor device and manufacturing method thereof

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Compliant interconnect assembly

Integrated circuit device and the manufacturing method thereof

Method of manufacturing a semiconductor device

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Test system with interconnect having conductive members and contacts on opposing sides

Techniques for joining an opto-electronic module to a semiconductor package

Hyperbga buildup laminate

Mounting method for a semiconductor component

Inductor formed in an integrated circuit

Semiconductor device having a bond pad and method therefor

Semiconductor device and method of manufacturing the same

Semiconductor package

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

Semiconductor device

Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

Design of an insulated cavity

Apparatus and method for mounting electronic components

Ball mounting method

Apparatus and method for low pressure wirebond

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Method and system for integrated circuit bonding

Fabrication method of semiconductor package with heat sink

Semiconductor device and manufacturing method thereof

Structure and method of making capped chips having vertical interconnects

Process for strengthening semiconductor substrates following thinning

Wafer level transparent packaging

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

System to couple integrated circuit die to substrate

Fabrication method of semiconductor integrated circuit device

Wire loop height measurement apparatus and method

Stacked semiconductor device including improved lead frame arrangement

Chip scale packaged semiconductor device

Semiconductor device

Bonding pad structure

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Electronic circuit device, and method and apparatus for manufacturing the same

Integrated interconnect package

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Semiconductor device and method for fabricating the same

Semiconductor circuit with multiple contact sizes

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor device having metal plates and semiconductor chip

Multi-surface IC packaging structures and methods for their manufacture

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Power semiconductor device and power semiconductor module

Modular power semiconductor module

Semiconductor device

Plastic package and method of fabricating the same

Chip package with die and substrate

Semiconductor package capable of absorbing electromagnetic wave

Semiconductor device and method of fabricating the same

IC package with stacked sheet metal substrate

Technique for attaching die to leads

Semiconductor device and wire bonding method

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Bath and method for high rate copper deposition

Circuit device

Use of a down-bond as a controlled inductor in integrated circuit applications

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Chip package with die and substrate

Method of forming multi-piled bump

Method of fabricating ultra thin flip-chip package

Method for forming solder bump structure

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Circuit device

No-flow underfill composition and method

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Electronic device

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Back-face and edge interconnects for lidded package

Circuit device

Microelectronic component and assembly having leads with offset portions

Chip package structure and process for fabricating the same

Electronic substrate, power module and motor driver

Chip scale package and method of fabricating the same

Chip structure and process for forming the same

Semiconductor device and fabrication method for the same

Automated filament attachment system for vacuum fluorescent display

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

Device for processing a wire

Radio frequency unit analog level detector and feedback control system

Method for forming metal contacts on a substrate

Processes and tools for forming lead-free alloy solder precursors

Structure and method of making capped chips using sacrificial layer

Method of electrically connecting a microelectronic component

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device manufacturing method

RF amplifier

Method for producing semiconductor device and semiconductor device

Resin-sealed semiconductor device

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor component and production method suitable therefor

Electronic circuit device and porduction method therefor

Radio card

Semiconductor device

Simplified stacked chip assemblies

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Methods of coating and singulating wafers

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Chip package and electrical connection structure between chip and substrate

Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus

Large bumps for optical flip chips

Large bumps for optical flip chips

Methods for forming patterns on a filled dielectric material on substrates

Die bonding apparatus and method for bonding semiconductor chip using the same

Method for low temperature bonding and bonded structure

Wirebond structure and method to connect to a microelectronic die

Gold bonding wires for semiconductor devices and method of producing the wires

Method for producing a multichip module and multichip module

Semiconductor radiation emitter package

Semiconductor device having heat radiation plate and bonding member

Integrated circuit package

Package carrier having multiple individual ceramic substrates

Package type semiconductor device

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Ball grid array package with patterned stiffener surface and method of assembling the same

Anisotropic conductive film

Bonding tool with polymer coating

Tin deposition

Inter-chip and intra-chip wireless communications systems

Method of fabricating a wire bond pad with Ni/Au metallization

Method of manufacturing a semiconductor device including a bump forming process

Process for producing resin-sealed type electronic device

Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for manufacturing solid-state imaging devices

Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

Method of using pre-applied underfill encapsulant

Integrated circuit with dual electrical attachment PAD configuration

Semiconductor electronic device and method of manufacturing thereof

Semiconductor device with electrode pad having probe mark

Semiconductor device and method of fabricating the same

Semiconductor device having heat conducting plate

Semiconductor device and method of fabricating the same

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Multichip wafer level packages and computing systems incorporating same

Method of forming low wire loops and wire loops formed using the method

Electrical circuit assembly with micro-socket

Reliable metal bumps on top of I/O pads after removal of test probe marks

Substrate for pre-soldering material and fabrication method thereof

Wafer-level moat structures

Method of mounting wafer on printed wiring substrate

Devices and methods employing high thermal conductivity heat dissipation substrates

Method of manufacturing a semiconductor device

Method of manufacturing electronic device and method of manufacturing electro-optical device

Method of producing an electronic component and a panel with a plurality of electronic components

Substrate having built-in semiconductor apparatus and manufacturing method thereof

Electronic parts built-in substrate and method of manufacturing the same

Reinforced bond pad