Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components

Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device

Fixture to constrain laminate and method of assembly

Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore

Accurate alignment for stacked substrates

System and method for producing devices including a semiconductor part and a non-semiconductor part

Method of manufacturing semiconductor device

Method of room temperature covalent bonding

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL

Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package

PACKAGE STRUCTURE, PACKAGING SUBSTRATE AND CHIP

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices

Materials, structures and methods for microelectronic packaging

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE

Semiconductor device

Semiconductor module

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

POWER SEMICONDUCTOR DEVICE PACKAGING

Semiconductor die package and method for making the same

ADHESIVE FILM FOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LED PACKAGE USING THE SAME

Multilayer printed wiring board

Multilayer pillar for reduced stress interconnect and method of making same

Dummy metal design for packaging structures

Semiconductor device having a semiconductor chip, and method for the production thereof

Device including two mounting surfaces

Routable array metal integrated circuit package fabricated using partial etching process

WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL

Test contact system for testing integrated circuits with packages having an array of signal and power contacts

Optical element package and method of manufacturing the same

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and method of forming integrated passive device

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Achieving mechanical and thermal stability in a multi-chip package

Method for the production of an electronic component and electronic component produced according to this method

Semiconductor device having separated heatsink and chip mounting portion

Semiconductor device

Leadframe, semiconductor device, and method of manufacturing the same

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

Lead frame and semiconductor package including the same

Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER

Geometry of contact sites at brittle inorganic layers in electronic devices

Solder joint reflow process for reducing packaging failure rate

Method of manufacturing semiconductor device

Dicing die bonding film, semiconductor wafer, and semiconductor device

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME

Semiconductor packages and methods of fabricating the same

METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVIDING AN ELECTRONIC COMPONENT THEREIN

Field barrier structures within a conformal shield

SPACER FORMATION FILM, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE

Semiconductor device and a method of manufacturing the same

Thin wafer protection device

Semiconductor device

Substrate bonding method and semiconductor device

Methods and designs for localized wafer thinning

Semiconductor device and production method therefor

PLASMA TREATMENT ON SEMICONDUCTOR WAFERS

Stackable electronic package and method of making same

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Semiconductor package and method of manufacturing the same

Semiconductor device

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Anti-reflection structures for CMOS image sensors

ADHESIVE COMPOSITION

Apparatus for transporting substrates for bonding

Fabrication of through-silicon vias on silicon wafers

Fabrication of through-silicon vias on silicon wafers

Semiconductor package with a metal post and manufacturing method thereof

Ultrasonic wire bonding method for a semiconductor device

Substrate for semiconductor package and method for manufacturing the same

Method of manufacturing semiconductor device including plural semiconductor chips stacked together

BOND PACKAGE AND APPROACH THEREFOR

Die power structure

Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same

Semiconductor device package

Substrate with embedded stacked through-silicon via die

Template wafer and process for small pitch flip-chip interconnect hybridization

Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer

Method for connecting a plurality of unpackaged substrates

Chip pad resistant to antenna effect and method

Method of forming a ring-shaped metal structure

Solder paste, joining method using the same and joined structure

ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE

Semiconductor package and manufacturing method therefor

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of forming the same

Integrated circuit having a three dimensional stack package structure

Light emitting semiconductor element bonded to a base by a silver coating

Method of assembling two integrated circuits and corresponding structure

Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Package structure

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

Self-organizing network with chip package having multiple interconnection configurations

Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing

SEMICONDUCTOR DEVICE

Void-free wafer bonding using channels

Metal paste with co-precursors

Metal paste with oxidizing agents

Apparatus for thermal melting process and method of thermal melting process

Electronic assemblies including mechanically secured protruding bonding conductor joints

Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus

FOUR MOSFET FULL BRIDGE MODULE

Semiconductor device and method of manufacturing the same

Semiconductor device for battery power voltage control

Semiconductor device with wireless communication

Method for packaging semiconductor dies having through-silicon vias

Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof

Electronic device and method of manufacturing electronic device

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Solder bump connections

Semiconductor device including a DC-DC converter with schottky barrier diode

Compliant interconnects in wafers

Packaging substrate having through-holed interposer embedded therein and fabrication method thereof

Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections

SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES

INTEGRATED CIRCUITS AND FABRICATION PROCESS THEREOF

Method for producing a semiconductor component with insulated semiconductor mesas

Semiconductor component with a semiconductor via

Wiring board and electronic component device

Integrated circuits secure from invasion and methods of manufacturing the same

Semiconductor device including a DC-DC converter

Wire bonding method and semiconductor device

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Multi-chip package and method of manufacturing thereof

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof

Electronic component

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE CHIP

Semiconductor device and a method of manufacturing the same

MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

WIRE BONDING METHOD

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

Semiconductor device and manufacturing method of a semiconductor device

Thermosetting die-bonding film

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Semiconductor device having semiconductor substrate electrode pads, and external electrodes

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Solder joint flip chip interconnection

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

Semiconductor devices having electrodes

Clip interconnect with encapsulation material locking feature

TCP-type semiconductor device and method of testing thereof

Compensation network for RF transistor

Micro-fluidic injection molded solder (IMS)

Method and device for discharging a fixed amount of liquid

Methods for wafer bonding, and for nucleating bonding nanophases

ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

Methods and apparatus for measuring analytes using large scale FET arrays

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

Semiconductor packages and methods of manufacturing the same

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

4D Device, process and structure

IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM

SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Pressure application apparatus and pressure application method

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement

Integrated circuit device having die bonded to the polymer side of a polymer substrate

Semiconductor device and manufacturing method thereof

Solder interconnect pads with current spreading layers

Semiconductor device including chip with complementary I/O cells

Semiconductor device and method of forming the same

STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY

Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

Electronic devices

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM

LED PACKAGE

Wafer level packaged GaN power device and the manufacturing method thereof

Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance

Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

Solder mold plates used in packaging process and method of manufacturing solder mold plates

Connecting and bonding adjacent layers with nanostructures

Method of manufacturing a printed circuit board with an embedded electronic component

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Method Of Manufacturing Semiconductor Package Board

Method for manufacturing magnetic memory chip device

SEMICONDUCTOR DEVICE

LEAD-FREE HIGH TEMPERATURE COMPOUND

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Stacked integrated circuit package having recessed sidewalls

Microelectronic package with terminals on dielectric mass

Electric part package and manufacturing method thereof

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Conductive pads defined by embedded traces

Adding cap to copper passivation flow for electroless plating

Grain refinement by precipitate formation in Pb-free alloys of tin

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Semiconductor device

Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of manufacturing semiconductor device

Wiring method and device

BONDING WIRE FOR SEMICONDUCTOR

Apparatus for manufacturing a hierarchical structure

Packaging or mounting a component

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM

Semiconductor device manufacturing method and semiconductor device

Multi-chip stacking method to reduce voids between stacked chips

Laser assisted transfer welding process

Composite nanometal paste of two-metallic-component type, bonding method, and electronic part

BONDING SHEET

Sintering materials and attachment methods using same

In-package microelectronic apparatus, and methods of using same

Light emitting device with electrode having recessed concave portion

Chip structure having redistribution layer

System for relieving stress and improving heat management in a 3D chip stack

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Semiconductor structure and method for making same

Method for wafer bonding using gold and indium

Flexible electronic devices and related methods

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Dual lead frame semiconductor package and method of manufacture

Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Anisotropic conductive adhesive

Etching composition for an under-bump metallurgy layer

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

Wire bonding apparatus and method using the same

Thermal compressive bonding with separate die-attach and reflow processes

Electronic element unit and reinforcing adhesive agent

Laser ashing of polyimide for semiconductor manufacturing

Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus

MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Apparatus, system, and method for wireless connection in integrated circuit packages

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD

Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same

Manufacturing light emitting diode (LED) packages

Pattern layout in semiconductor device

Electronic component and electronic device

Multilayered printed circuit board and method for manufacturing the same

Electronic device and electronic apparatus

Semiconductor module

Semiconductor packages

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

Bonding wire for semiconductor device

Semiconductor device and method for manufacturing the same

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Crack arrest vias for IC devices

Interconnect assemblies and methods of making and using same

Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device

Semiconductor device and method of forming wafer level ground plane and power ring

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

CHIP-ON-CHIP STRUCTURE AND MANUFACTURING METHOD THEROF

No flow underfill

Grounded seal ring structure in semiconductor devices

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Substrateless power device packages

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Leadframe package with recessed cavity for LED

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

Joining method and device produced by this method and joining unit

Method of operating a clamping system of a wire bonding machine

Apparatus for mounting semiconductor chip

Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor package and method of manufacturing the same

Semiconductor device and method of forming the same

Power/ground layout for chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE

Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer

Device with semiconductor die attached to a leadframe

Chip package and manufacturing method thereof

Light emitting device and method for manufacturing same

Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)

ANISOTROPIC CONDUCTIVE PARTICLES

System and method for packaging electronic devices

Method For Low Temperature Bonding And Bonded Structure