212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#2ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#3STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
#4HEAT DISSIPATING STRUCTURE AND METHODS OF FORMING THE SAME
#5SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS
#6EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#7HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
#8STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
#9SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#10ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING
#11ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS
#12Power, Signaling and Thermal Path Co-optimization
#13Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light Irradiation
#14Heat Dissipating Structure and Methods of Forming The Same
#15SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#16METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
#17MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME
#18METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET ARRAYS
#19OPTOELECTRONIC SYSTEM
#20PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME
#21METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
#22MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND ASSOCIATED METHODS OF MANUFACTURING
#23SEMICONDUCTOR PACKAGE
#24THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND METHODS OF FORMING THE SAME
#25DIRECT BONDING METHODS AND STRUCTURES
#26Thermal management device for high heat flux applications including a microchannel heat sink assembly and method for manufacturing the same
#27THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
#28SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
#29DEBONDING REPAIR DEVICES
#30Embedded cooling assemblies for advanced device packaging and methods of manufacturing the same
#31Manufacturing method of flip chip package structure
#32Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach
#33Methods and apparatus for measuring analytes using large scale FET arrays
#34SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS
#35THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
#36SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
#37METHOD OF FABRICATING DISPLAY PANEL
#38LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
#39SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP CHIP MANNER
#40CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
#41Multi-chip package and method of providing die-to-die interconnects in same
#42Hybrid manufacturing for integrated circuit devices and assemblies
#43THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#44MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER
#45Semiconductor Device and Method of Forming Conductive Vias to Have Enhanced Contact to Shielding Layer
#46Flip chip package structure and manufacturing method thereof
#47Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#48Semiconductor device and a method of manufacturing the same
#49Semiconductor die contact structure and method
#50Methods and apparatus for measuring analytes using large scale FET arrays
#51Impedance controlled electrical interconnection employing meta-materials
#52Multi-chip package and method of providing die-to-die interconnects in same
#53Semiconductor device with sealed semiconductor chip
#54Semiconductor device having electrode pads arranged between groups of external electrodes
#55MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND ASSOCIATED METHODS OF MANUFACTURING
#56EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#57Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#58Semiconductor device with a semiconductor chip connected in a flip chip manner
#59Display device
#60Hybrid manufacturing for integrated circuit devices and assemblies
#61Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures
#62EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#63Method for permanent connection of two metal surfaces
#64Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#65Semiconductor memory device structure
#66PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME
#67Semiconductor device having through silicon vias and manufacturing method thereof
#68DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#69SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#70Circuit board structure and method for manufacturing a circuit board structure
#71Semiconductor device and method for production of semiconductor device
#72Method for manufacturing an electronic module and electronic module
#73ELECTRONIC MODULE
#74Semiconductor device and method for manufacturing semiconductor device
#753D IC method and device
#76Semiconductor device and a method of manufacturing the same
#77Methods for attachment and devices produced using the methods
#783D IC method and device
#79THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING METAL
#80Thermocompression Bonding with Passivated Gold Contacting Metal
#81Thermocompression bonding with passivated copper-based contacting metal
#82Thermocompression Bonding with Passivated Tin-Based Contacting Metal
#83Thermocompression bonding with passivated nickel-based contacting metal
#84Thermocompression bonding using metastable gas atoms
#85Solder ball dimension management
#86Multi-chip package and method of providing die-to-die interconnects in same
#87Semiconductor components having conductive vias with aligned back side conductors
#88Chemically-sensitive sensor array device
#89Semiconductor die contact structure and method
#90Semiconductor device with sealed semiconductor chip
#91Semiconductor device and method of manufacturing semiconductor device
#92Electronic module
#93Semiconductor device with a semiconductor chip connected in a flip chip manner
#94Semiconductor device and a method of manufacturing the same
#95Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame
#96Semiconductor memory device structure
#97Multi-chip package and method of providing die-to-die interconnects in same
#98Semiconductor device and a method of manufacturing the same
#99Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#100Method for fabricating a semiconductor and semiconductor package
#101Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#102Semiconductor device having through silicon vias and manufacturing method thereof
#103Embedded semiconductive chips in reconstituted wafers, and systems containing same
#104Semiconductor device having electrode pads arranged between groups of external electrodes
#105Semiconductor device and a method of manufacturing the same
#106METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#107Semiconductor device and a method of manufacturing the same
#108INTEGRATED CIRCUIT CHIP PACKAGING
#109INTEGRATED CIRCUIT CHIP PACKAGING
#110Method for measuring analytes using large scale chemfet arrays
#111Semiconductor device and method for production of semiconductor device
#112Semiconductor device with a semiconductor chip connected in a flip chip manner
#113Semiconductor device
#114Impedance controlled electrical interconnection employing meta-materials
#115Multi-chip package and method of providing die-to-die interconnects in same
#116Semiconductor device and method of manufacturing the same
#117Substrate with embedded stacked through-silicon via die
#118Method for fabricating a semiconductor and semiconductor package
#119Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#120Four D device process and structure
#121Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#122Semiconductor device and method for manufacturing semiconductor device
#123Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#124Method of manufacturing semiconductor device
#125Method of room temperature covalent bonding
#126METHOD OF ROOM TEMPERATURE COVALENT BONDING
#127Multilayer pillar for reduced stress interconnect and method of making same
#128Multilayer pillar for reduced stress interconnect and method of making same
#129Adhesive film for semiconductor, and semiconductor device
#130Stacked semiconductor packages
#131Semiconductor memory device structure
#132Semiconductor Device and Method of Forming Conductive Vias to Have Enhanced Contact to Shielding Layer
#133Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#134Semiconductor device with sealed semiconductor chip
#135Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier
#136Packaged semiconductor components having substantially rigid support members
#137SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#138Semiconductor device and method of manufacturing the same
#139FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUNDS INCLUDING THE SAME FOR PREPARING SEMICONDUCTOR PACKAGES
#140Method of forming a semiconductor device having through silicon vias
#141Method of manufacturing a semiconductor device
#142Designs and methods for conductive bumps
#143Semiconductor device and a method of manufacturing the same
#144PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD
#145Multilayer pillar for reduced stress interconnect and method of making same
#146Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#1473D IC method and device
#148Semiconductor memory device
#149Semiconductor die contact structure and method
#150ROOM TEMPERATURE METAL DIRECT BONDING
#151Semiconductor die assemblies with heat sink and associated systems and methods
#152Semiconductor device and a method of manufacturing the same
#153MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#154Semiconductor device having electrode pads arranged between groups of external electrodes
#155Semiconductor device
#156Semiconductor device
#157Methods of fluxless micro-piercing of solder balls, and resulting devices
#158Semiconductor device including a buffer layer structure for reducing stress
#159Chemically-sensitive sensor array calibration circuitry
#160Electronic module
#161Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#162Semiconductor device package having an underfill barrier
#163Electronic module with EMI protection
#164Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#165Enhanced adhesive materials and processes for 3D applications
#166Methods and apparatus for measuring analytes using large scale FET arrays
#167Method of fabricating a semiconductor package
#168ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#169Semiconductor device
#170Implantable electrode array assembly including a carrier with packaged control modules
#171Flexible hermetic membranes with electrically conducting vias
#172Microelectronic elements with post-assembly planarization
#173Stackable electronic package and method of fabricating same
#174Semiconductor package
#175Embedded graphite heat spreader for 3DIC
#176Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method
#177Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#178Semiconductor device and method for production of semiconductor device
#179Semiconductor device and a method of manufacturing the same
#180THIN FILM TRANSISTOR AND METHOD FOR MAKING THE SAME
#181THIN FILM TRANSISTOR AND METHOD FOR MAKING THE SAME
#182Chip package
#183Solder in cavity interconnection structures
#184Hermetically sealed MEMS device and its fabrication
#185Multi-chip package and method of providing die-to-die interconnects in same
#186Manufacturing method of semiconductor device
#187Wire bonding methods and systems incorporating metal nanoparticles
#188Thermocompression Bonding with Passivated Nickel-Based Contacting Metal
#189Thermocompression Bonding with Passivated Silver-Based Contacting Metal
#190Thermocompression Bonding with Passivated Gold Contacting Metal
#191Thermocompression Bonding with Passivated Copper-Based Contacting Metal
#192Thermocompression Bonding with Passivated Indium-Based Contacting Metal
#193Thermocompression Bonding Using Metastable Gas Atoms
#194System for Low-Force Thermocompression Bonding
#1953D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#196Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#197Light emitting device and method for manufacturing light emitting device
#198Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#199Semiconductor device and method for manufacturing the same
#200Semiconductor device and method of forming interposer with opening to contain semiconductor die
#201SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#202Selective area heating for 3D chip stack
#203Method for fabricating a semiconductor package
#204Semiconductor device including a buffer layer structure for reducing stress
#205SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
#206Semiconductor device with a semiconductor chip connected in a flip chip manner
#207Semiconductor device and method of manufacturing the same
#208BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC DEVICES
#209Method of manufacturing a semiconductor device
#210Semiconductor device
#211Tooling for coupling multiple electronic chips
#212Embedded semiconductive chips in reconstituted wafers, and systems containing same
#213Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#214Semiconductor device and a method of manufacturing the same
#215FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#216Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
#217Semiconductor chip package with resilient conductive paste post and fabrication method thereof
#218Semiconductor device
#219Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#220Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#221Electronic part embedded substrate and method of producing an electronic part embedded substrate
#222Bonding structure and method
#223Semiconductor device and a method of manufacturing the same
#224OPTOELECTRONIC SYSTEM
#225Semiconductor die assemblies with heat sink and associated systems and methods
#226Stacked semiconductor devices
#2273D IC method and device
#228Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#229Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#230Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#231Semiconductor device and method for production of semiconductor device
#232Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#233Dual lead frame semiconductor package and method of manufacture
#234ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY PANEL, AND THEIR FABRICATION METHODS
#235Semiconductor device and a method of manufacturing the same
#236Semiconductor device having electrode pads arranged between groups of external electrodes
#237Microelectronic elements with post-assembly planarization
#238Semiconductor package having multi-phase power inverter with internal temperature sensor
#239Integrated circuit chip packaging
#240Integrated circuit chip packaging including a heat sink topped cavity
#241Inter-chip alignment
#242Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#243Multilayer pillar for reduced stress interconnect and method of making same
#244Three dimensional device integration method and integrated device
#245Semiconductor device and method for manufacturing semiconductor device
#246EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER
#247Semiconductor package including a device and lead frame used for the same
#248Hermetically sealed MEMS device and its fabrication
#249Semiconductor device having polyimide layer
#250FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUNDS INCLUDING THE SAME FOR PREPARING SEMICONDUCTOR PACKAGES
#251Multilayer pillar for reduced stress interconnect and method of making same
#252PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD
#253Semiconductor die contact structure and method
#254ELECTRICAL BARRIER LAYERS
#255Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
#256Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#257Semiconductor device and a method of manufacturing the same
#258Semiconductor device and production method therefor
#259Designs and methods for conductive bumps
#260Cu pillar bump with L-shaped non-metal sidewall protection structure
#261Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#262Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#263Semiconductor device including semiconductor chip, wiring, conductive material, and contact part
#264Circuit board structure and method for manufacturing a circuit board structure
#2653D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#266Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device
#267Semiconductor device
#268High quality electrical contacts between integrated circuit chips
#269Wire bonding methods and systems incorporating metal nanoparticles
#270Hermetically-sealed MEMS device and its fabrication
#271Semiconductor device having through silicon vias and manufacturing method thereof
#272Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#273Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#274Resin-encapsulated semiconductor device and its manufacturing method
#275Semiconductor device and a method of manufacturing the same
#276Semiconductor device
#277Methods and apparatus for detecting molecular interactions using FET arrays
#278Semiconductor device with trench-like feed-throughs
#279Process for producing a structure by assembling at least two elements by direct adhesive bonding
#280Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#281Semiconductor device
#282Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
#283Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#284Wafer backside interconnect structure connected to TSVs
#285Semiconductor device and a method of manufacturing the same
#286Semiconductor integrated circuit device
#287Apparatus, system, and method for wireless connection in integrated circuit packages
#288Light-emitting apparatus
#289Apparatus for stacked semiconductor packages and methods of fabricating the same
#290Electronic part embedded substrate and method of producing an electronic part embedded substrate
#291Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#292Semiconductor device
#293High efficiency module
#294Film for semiconductor back surface and its use
#295Semiconductor package and fabrication method thereof
#296Semiconductor device
#297Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#298Selective area heating for 3D chip stack
#299Rigid-flex electronic module
#300Power semiconductor device and method therefor