212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Fixture to constrain laminate and method of assembly
#302Selective area heating for 3D chip stack
#303Methods and apparatus for measuring analytes using large scale FET arrays
#304Method for low temperature bonding and bonded structure
#305Tooling for coupling multiple electronic chips
#306Method for permanent connection of two metal surfaces
#307Semiconductor device
#308Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#309Semiconductor device including a protective film
#310Chip package and method for fabricating the same
#311Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#312Methods for forming semiconductor device packages
#313Semiconductor device and method of forming wafer level ground plane and power ring
#314Guard structure for signal isolation
#315Semiconductor device and a method of manufacturing the same
#316Semiconductor device having electrode pads arranged between groups of external electrodes
#317Semiconductor device packages
#318Electronic device and method for production
#319Semiconductor device
#320Semiconductor device and a method of manufacturing the same
#321Bumpless build-up layer package with pre-stacked microelectronic devices
#322Semiconductor package and mobile device using the same
#323Methods and apparatus for measuring analytes using large scale FET arrays
#324Embedded graphite heat spreader for 3DIC
#325Semiconductor device having semiconductor chip affixed to substrate via insulating resin adhesive film
#326Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#327Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#328Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#329Heat spreader and method for forming
#330Reliable interconnect
#331Circuit module and method of manufacturing the same
#332Method of producing a semiconductor package
#333Embedded semiconductive chips in reconstituted wafers, and systems containing same
#334Semiconductor device and method of manufacturing same
#335Three dimensional device integration method and integrated device
#336Laser assisted transfer welding process
#337Low cost package warpage solution
#338Semiconductor device and method for manufacturing semiconductor device
#339Semiconductor device and production method therefor
#340Bonding method using bonding material
#341Narrow-gap flip chip underfill composition
#342Semiconductor device, method for manufacturing the same, and electronic device
#343Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#344Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#345Resin-encapsulated semiconductor device and its manufacturing method
#346Semiconductor package and method of forming the same
#347Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
#348Method of manufacturing a semiconductor device
#349Method of producing an interposer with microspring contacts
#350Semiconductor device and method for production of semiconductor device
#351Method of making a semiconductor device having a functional capping
#352Methods of forming 3-D circuits with integrated passive devices
#353Semiconductor die mount by conformal die coating
#354Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#355LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#356Bonding material and bonding method using the same
#357Silver—gold alloy bonding wire
#358Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#359Method for low temperature bonding and bonded structure
#360Semiconductor device and a method of manufacturing the same
#361Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#362Chip mounting
#363Room temperature metal direct bonding
#364Pressure application apparatus and pressure application method
#365Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#366Semiconductor device and a method of manufacturing the same
#367Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#368Semiconductor device and a method of manufacturing the same
#369Template and pattern forming method
#370High efficiency module
#371Method of manufacturing semiconductor device
#372Thin plastic leadless package with exposed metal die paddle
#373Light emitting device and method for manufacturing light emitting device
#374Stacked packaging improvements
#375Bump pad structure
#376Method for forming package systems having interposers
#377Electronic component mounting apparatus and method
#378Light emitting device and method for manufacturing same
#379Memory device structure
#380Semiconductor device and lead frame used for the same
#381Selective die electrical insulation by additive process
#382Adhesive composition, adhesive sheet and production process for semiconductor device
#383Light-emitting apparatus
#384Substrate interconnections having different sizes
#385Semiconductor devices with recessed interconnects
#386Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#387Four D device process and structure
#388Semiconductor device having low on resistance
#389Semiconductor device including a protective film
#390Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#391Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#392Semiconductor device
#393Semiconductor device and a method of manufacturing the same
#394Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#395Three-dimensional semiconductor architecture
#396Apparatus for fluid guided self-assembly of microcomponents
#397Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#398Circuit module and method of manufacturing the same
#399Semiconductor device with a semiconductor chip connected in a flip chip manner
#400Power semiconductor package
#4013D IC method and device
#402Electrical barrier layers
#403Semiconductor component with a monocrystalline semiconductor region arranged in a via region
#404Off-chip vias in stacked chips
#405Semiconductor device with mechanical lock features between a semiconductor die and a substrate
#406LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#407Method of making a stacked microelectronic package
#408Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#409Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
#410Semiconductor device
#411Electronic device and method for manufacturing the same, and substrate structure and method for manufacturing the same
#412Method of forming wafer-level molded structure for package assembly
#413Semiconductor device having low dielectric insulating film and manufacturing method of the same
#414MODULE AND METHOD FOR PRODUCING MODULE
#415Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
#416Method of manufacturing a carrier tape
#417Binding wire and semiconductor package structure using the same
#418Semiconductor device and method of forming bump-on-lead interconnection
#419Semiconductor device and method for manufacturing semiconductor device
#420Method for low temperature bonding and bonded structure
#421Semiconductor package and method for fabricating the same
#422Integrated circuit package and method of forming the same
#423Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#424Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#425Module comprising a semiconductor chip
#426Manufacture of a circuit board and circuit board containing a component
#427Semiconductor device with output circuit and pad arrangements
#428Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#429Three dimensional device integration method and integrated device
#430Semiconductor device including a buffer layer structure for reducing stress
#431Semiconductor device
#432Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#433Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#434Electronic device including soldered surface-mount component
#435Semiconductor device
#436Semiconductor device
#437Semiconductor device and method of manufacturing same
#438Microelectronic elements with post-assembly planarization
#439Mixed alloy solder paste
#440Microelectronic packages with nanoparticle joining
#441Solder paste, joining method using the same and joined structure
#442Selective area heating for 3D chip stack
#443Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#444Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
#445Semiconductor device and a method of manufacturing the same
#446Semiconductor device
#447Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
#448Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#449Bonded processed semiconductor structures and carriers
#450Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
#451Mixed alloy solder paste
#452Impedance controlled electrical interconnection employing meta-materials
#453Package assembly having a semiconductor substrate
#454Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#455System and method for 3D integrated circuit stacking
#456Semiconductor device with through silicon via and alignment mark
#457Semiconductor device
#458Semiconductor device
#459Method for fabricating a heat sink, and heat sink
#460Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
#461Method of fabricating a bond pad structure
#462Wireless communication system
#463Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#464Optoelectronic system
#465Solder in cavity interconnection structures
#466Apparatus, system, and method for wireless connection in integrated circuit packages
#467Semiconductor device
#468Semiconductor device and method of forming stress relief layer between die and interconnect structure
#469Forming functionalized carrier structures with coreless packages
#470Narrow-gap flip chip underfill composition
#471Electronic module for a piece of vehicle-borne aeronautic equipment and a piece of aeronautic equipment for an aeronautic vehicle
#472Molding method for COB-EUSB devices and metal housing package
#473Insulated gate semiconductor device and method
#474CHIP ELEMENT AND CHIP PACKAGE
#475Formation of alpha particle shields in chip packaging
#476Electronic module with EMI protection
#477Method for manufacturing an electronic module and an electronic module
#478Laser ashing of polyimide for semiconductor manufacturing
#479Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
#480Semiconductor device and a method of manufacturing the same
#481Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#482Method for fabricating EMI shielding package structure
#483Semiconductor device with sealed semiconductor chip
#484Embedded semiconductive chips in reconstituted wafers, and systems containing same
#485Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#486Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
#487Aluminum coated copper ribbon
#488Stacked microelectronic devices
#489Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#490Electrochemical deposition method
#491Method of forming a microelectronic device package
#492Fabrication methods of chip device packages
#493Semiconductor die contact structure and method
#494Semiconductor element
#495Semiconductor device and method of manufacturing semiconductor device
#496Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#497Chip device packages and fabrication methods thereof
#498Ball grid array semiconductor package and method of manufacturing the same
#499Semiconductor device and method for manufacturing the same
#500Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#501Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#502Processes and structures for IC fabrication
#503Manufacturing method of forming an etch-back type semiconductor package with locking anchorages
#504Semiconductor device and manufacturing method thereof
#505Stacked packaging improvements
#506Semiconductor device for battery power voltage control
#507Semiconductor device and method of manufacturing
#508Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#509Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#510Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
#511Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#512High efficiency module
#513Printed wiring board and method for manufacturing the same
#514Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#515Multiple access over proximity communication
#516Light-reflective anisotropic conductive adhesive agent, and light emitting device
#517Method of room temperature covalent bonding
#518ESD protection device
#519Method of forming a memory device
#520Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#521Semiconductor packages and methods of packaging semiconductor devices
#522Semiconductor Die Having Fine Pitch Electrical Interconnects
#523Substrateless power device packages
#524Semiconductor device and method of forming pad layout for flipchip semiconductor die
#525Multilayer pillar for reduced stress interconnect and method of making same
#526Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#527Method for manufacturing a fan-out WLP with package
#528Electronic module
#529Structures and methods for improving solder bump connections in semiconductor devices
#530Semiconductor device sealed in a resin section and method for manufacturing the same
#531Pad configurations for an electronic package assembly
#532Wafer scale package for high power devices
#533Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation
#534Bump pad structure
#535Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#536Multi-function and shielded 3D interconnects
#537Semiconductor device
#538Semiconductor device and method of forming thermal lid for balancing warpage and thermal management
#539Heat-transfer structure
#540III-Nitride device with solderable front metal
#541Method of forming package systems having interposers
#542Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
#543Semiconductor device having low dielectric insulating film and manufacturing method of the same
#544Methods of fluxless micro-piercing of solder balls, and resulting devices
#545Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#546Semiconductor device and method of manufacturing same
#547Semiconductor device and a method of manufacturing the same
#548Electronic devices with yielding substrates
#549Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#550Apparatus for thermal melting process and method of thermal melting process
#551Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
#552Method of forming an integrated inductor by dry etching and metal filling
#553Semiconductor device and method for fabricating the same
#554Dual lead frame semiconductor package and method of manufacture
#555Room temperature metal direct bonding
#556Warp compensated electronic assemblies
#557Forming in-situ micro-feature structures with coreless packages
#558Method of making a pillar structure having a non-metal sidewall protection structure
#559Pillar bumps and process for making same
#560Semiconductor device and method for manufacturing the same
#561Semiconductor device including cooler
#562Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
#563Semiconductor device and radio communication device
#564Light-emitting apparatus
#565Semiconductor device
#566Moisture barrier for a wire bond
#567Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#568Method for producing reconstituted wafers with support of the chips during their encapsulation
#569Semiconductor device
#570Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#571Semiconductor package with single sided substrate design and manufacturing methods thereof
#572Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier
#573Wireless communication system
#574Apparatus and method for embedding components in small-form-factor, system-on-packages
#575Copper pillar bump with cobalt-containing sidewall protection layer
#576Compliant interconnects in wafers
#577Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices
#578Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#579Semiconductor device and method of forming insulating layer around semiconductor die
#580Method of making a conductive pillar bump with non-metal sidewall protection structure
#581Bonding structure and method
#582Method and apparatus for semiconductor device fabrication using a reconstituted wafer
#583Methods of forming 3-D circuits with integrated passive devices
#584Semiconductor device
#585Resin-encapsulated semiconductor device and its manufacturing method
#586Dual lead frame semiconductor package and method of manufacture
#587Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#588Semiconductor device including DC-DC converter
#589Semiconductor device
#590Bonding wire and method for manufacturing same
#591Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
#592Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#593Wafer backside interconnect structure connected to TSVs
#594Stackable package by using internal stacking modules
#595Semiconductor device and method of forming high routing density interconnect sites on substrate
#596Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#597Power semiconductor package
#598Chip embedded substrate and method of producing the same
#599Semiconductor device, substrate and semiconductor device manufacturing method
#600Semiconductor device including a DC-DC converter