212014 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Nitrogen [N]
Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
#302Integrated circuit chips with fine-line metal and over-passivation metal
#303Integrated circuit chips with fine-line metal and over-passivation metal
#304Integrated circuit chips with fine-line metal and over-passivation metal
#305INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#306LAYER FOR CHIP CONTACT ELEMENT
#307METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER
#308Method for low temperature bonding and bonded structure
#309Copper alloy bonding wire for semiconductor device
#310Semiconductor chip and method for fabricating the same
#311Chip package and method for fabricating the same
#312Method for low temperature bonding and bonded structure
#313Adhesion by plasma conditioning of semiconductor chip
#314Method of wire bonding over active area of a semiconductor circuit
#315Semiconductor chip structure
#316Chip package and method for fabricating the same
#317Semiconductor device and method for manufacturing the same
#318Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus
#319Bonding apparatus
#320Bonding apparatus and method for cleaning tip of a bonding tool
#321Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bonding
#322Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween
#323Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#324Method for bonding wafers to produce stacked integrated circuits
#325Integrated circuit (IC) chip and method for fabricating the same
#326Semiconductor device, manufacturing method and apparatus for the same
#327Device clamp for reducing oxidation in wire bonding
#328HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#329Backages with buried electrical feedthroughs
#330Non-cyanide gold electroplating for fine-line gold traces and gold pads
#331Method of wire bonding over active area of a semiconductor circuit
#332Method for forming C4 connections on integrated circuit chips and the resulting devices
#333Power semiconductor module as H-bridge circuit and method for producing the same
#334Bonding Wire and Integrated Circuit Device Using the Same
#335Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#336Functional blocks for assembly
#337Chip package and method for fabricating the same
#338Post passivation interconnection schemes on top of the IC chips
#339Semiconductor device and manufacturing method for the same
#340Power composite integrated semiconductor device and manufacturing method thereof
#341ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
#342Method of fabricating semiconductor memory device and semiconductor memory device driver
#343Method of producing a semiconductor device by forming an oxide film on a resin layer
#344Active area bonding compatible high current structures
#345CHIP CONNECTOR
#346Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
#347Structure and method for bond pads of copper-metallized integrated circuits
#348Tooling for coupling multiple electronic chips
#349Electronic component and method for its assembly
#350Method of wire bonding over active area of a semiconductor circuit
#351Method of wire bonding over active area of a semiconductor circuit
#352Method of wire bonding over active area of a semiconductor circuit
#353Carbon nanotube circuit component structure
#354METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT
#355Semiconductor chip with bond area
#356Electronic device and method of manufacturing the same
#357Electronic circuit package
#358Manufacturing method for semiconductor device and semiconductor device
#359Forced heat transfer apparatus for heating stacked dice
#360Semiconductor device and method of manufacturing the same
#361Coaxial through chip connection
#362Adhesion by plasma conditioning of semiconductor chip surfaces
#363Method and system for increasing yield of vertically integrated devices
#364System and method for implementing transformer on package substrate
#365High-temperature solder, high-temperature solder paste and power semiconductor using same
#366A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER
#367Pin-type chip tooling
#368Semiconductor device
#369High frequency chip packages with connecting elements
#370Semiconductor structure and method of assembly
#371Semiconductor structure and method of manufacture
#372Method for forming bonding pad and semiconductor device having the bonding pad formed thereby
#373SEMICONDUCTORS AND METHODS OF MAKING
#374Semiconductor device with front side metallization and method for the production thereof
#375Semiconductor device and a manufacturing method of the same
#376Methods for protecting metal surfaces
#377Method for forming a double embossing structure
#3783D IC method and device
#379Semiconductor device and a manufacturing method of the same
#380Metal pad or metal bump over pad exposed by passivation layer
#381Electrical interconnect structures for integrated circuits and methods of manufacturing the same
#382Technique for forming a copper-based contact layer without a terminal metal
#383ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#384Microelectronic bond pad
#385Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
#386Method and structure for reduction of soft error rates in integrated circuits
#387Method of realizing direct bonding between metal wires and copper pads by means of thermosonic wire bonding using shielding gas spraying device
#388Semiconductor device with semiconductor device components embedded in a plastics composition
#389Circuitry component and method for forming the same
#390Coaxial through chip connection
#391Post-attachment chip-to-chip connection
#392Rigid-backed, membrane-based chip tooling
#393Through chip connection
#394Inverse chip connector
#395Chip connector
#396Profiled contact
#397Patterned contact
#398Contact-based encapsulation
#399Membrane-based chip tooling
#400Nickel bonding cap over copper metalized bondpads
#401Trenched MOSFET device with contact trenches filled with tungsten plugs
#402Structure and method for bond pads of copper-metallized integrated circuits
#403Semiconductor chip with coil element over passivation layer
#404Light emitting device package and method for manufacturing the same
#405NANO IC
#406Wire loop, semiconductor device having same and wire bonding method
#407Method for making a flat-top pad
#408Multiple etch-stop layer deposition scheme and materials
#409Techniques for improving bond pad performance
#410Semiconductor device having a leading wiring layer
#411Chip package with dam bar restricting flow of underfill
#412Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same
#413Bonding wire cleaning unit and method of wire bonding using same
#414Semiconductor chip and method manufacturing the same
#415Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#416Copper interconnection with conductive polymer layer and method of forming the same
#417Nano memory, light, energy, antenna and strand-based systems and methods
#418Planar microspring integrated circuit chip interconnection to next level
#419Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#420Bond pad structure for integrated circuit chip
#421Device packages having stable wirebonds
#422Efficient method of forming and assembling a microelectronic chip including solder bumps
#423Wire clamping plate
#424NANO IC packaging
#425Semiconductor device
#426Semiconductor device and manufacturing method of the same
#427Semiconductor device and radio communication device
#428High density package interconnect wire bond strip line and method therefor
#429Bonding structure and fabrication thereof
#430Semiconductor device and manufacturing method of semiconductor device
#431Microelectronic assemblies incorporating inductors
#432Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof
#433Active area bonding compatible high current structures
#434Integration type semiconductor device and method for manufacturing the same
#435Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head
#436Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
#437Multi-layer integrated semiconductor structure having an electrical shielding portion
#438Solderable top metal for SiC device
#439Iridium oxide nanowires and method for forming same
#440Method for forming an electrode
#441Solder foil, semiconductor device and electronic device
#442Method of stacking thin substrates by transfer bonding
#443Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment
#444Semiconductor device with reduced contact resistance
#445Dense intermetallic compound layer
#446Mounting semiconductor chips
#447Highly compliant plate for wafer bonding
#448Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#449Semiconductor device, manufacturing method and apparatus for the same
#450Method for forming bump on electrode pad with use of double-layered film
#451Semiconductor device with reduced contact resistance
#452Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#453Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
#454Power composite integrated semiconductor device and manufacturing method thereof
#455Electronic circuit package
#456Sealing and protecting integrated circuit bonding pads
#457NANO IC packaging
#458Semiconductor device having a refractory metal containing film and method for manufacturing the same
#459Conductive material for integrated circuit fabrication
#460Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#461Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#462Integrated circuit with intergrated capacitor and methods for making same
#463Wire bonding apparatus
#464Adhesion by plasma conditioning of semiconductor chip surfaces
#465Bump and fabricating process thereof
#466Circuit component with bump formed over chip
#467Manufacturing method for semiconductor device and semiconductor device
#468Laser cleaning system for a wire bonding machine
#469Adhesion by plasma conditioning of semiconductor chip
#470Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance
#471Method for manufacturing semiconductor device with plural semiconductor chips
#472Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
#473Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same
#474Electronic device and method of manufacturing same
#475Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device
#476Bonding apparatus
#477Bonding tool with resistance
#478Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
#479Method for low temperature bonding and bonded structure
#480Bonding tool with polymer coating
#481Integrated circuit package bond pad having plurality of conductive members
#482Sealing and protecting integrated circuit bonding pads
#483Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same
#484Method for chemical etch control of noble metals in the presence of less noble metals
#485Method of forming a bond pad
#486High-frequency chip packages
#487Active area bonding compatible high current structures
#488Nickel bonding cap over copper metalized bondpads
#489Nickel bonding cap over copper metalized bondpads
#490Method for forming a bond pad interface
#491Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
#492Semiconductor device and method of manufacturing the same
#493Manufacturing method for multichip module
#494Method of fabricating semiconductor memory device and semiconductor memory device driver
#495Wafer bonding using boron and nitrogen based bonding stack
#496Encapsulant for a semiconductor device