212014 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Nitrogen [N]
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
#2OPTOELECTRONIC SYSTEM
#3SEMICONDUCTOR PACKAGES AND METHODS THEREOF
#4Hybrid manufacturing for integrated circuit devices and assemblies
#5PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME
#6Hybrid manufacturing for integrated circuit devices and assemblies
#7Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures
#8Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion
#93D IC method and device
#103D IC method and device
#11Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion
#123D IC method and device
#13METHOD FOR PERMANENT BONDING OF WAFERS
#14Power semiconductor device load terminal
#15Chip package
#16Bonding wire for semiconductor device
#17Semiconductor structure having a composite barrier layer
#18Tooling for coupling multiple electronic chips
#19Semiconductor device
#20OPTOELECTRONIC SYSTEM
#21Power module package having patterned insulation metal substrate
#223D IC method and device
#23Power semiconductor device load terminal
#24Systems and methods for gap filling improvement
#25Thermocompression bonding using plasma gas
#26Method for low temperature bonding and bonded structure
#27Tooling for coupling multiple electronic chips
#28Semiconductor structure with composite barrier layer under redistribution layer and manufacturing method thereof
#29Chip package and method for fabricating the same
#30Method for processing a die
#31SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
#32Method for permanent bonding of wafers
#33Method for low temperature bonding and bonded structure
#343D IC method and device
#35Semiconductor structure with composite barrier layer under redistribution layer and manufacturing method thereof
#36Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
#37Reflow process and tool
#38Semiconductor device
#39Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#40Optoelectronic system
#41Semiconductor Die Having Fine Pitch Electrical Interconnects
#42Semiconductor device with pads of enhanced moisture blocking ability
#43Semiconductor device and radio communication device
#44Sensor package
#453D IC method and device
#46Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#47Semiconductor device capable of switching operation modes and operation mode setting method therefor
#48Bonding wire for semiconductor
#49Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces
#50Integrated circuit chip using top post-passivation technology and bottom structure technology
#51Production apparatus of composite silver nanoparticle
#52Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief
#53Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer
#54Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate
#55Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#56Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump
#57Semiconductor device and method of forming conductive pillar having an expanded base
#58Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#59Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#60Semiconductor integrated circuit device and method of manufacturing same
#61Method and system for real time control of an active antenna over a distributed antenna system
#62SEMICONDUCTOR CHIP INCLUDING BUMP HAVING BARRIER LAYER, AND MANUFACTURING METHOD THEREOF
#63Bump I/O contact for semiconductor device
#64Electronic device
#65Semiconductor device
#66Method of manufacturing semiconductor device
#67SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
#68Manufacturing a filling of a gap in semiconductor devices
#69Copper pillar bump with non-metal sidewall protection structure and method of making the same
#70Techniques for improving bond pad performance
#71Ag—Au—Pd ternary alloy bonding wire
#72Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#73Semiconductor device and radio communication device
#74Via network structures and method therefor
#75Semiconductor die having fine pitch electrical interconnects
#76Semiconductor laser mounting for improved frequency stability
#77Method and system for real time control of an active antenna over a distributed antenna system
#78Process for wet passivation of bond pads for protection against subsequent TMAH-based processing
#79Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device
#80BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME
#81SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE
#82SEMICONDUCTOR DEVICE
#83WIRE BONDING METHOD
#84Thermosetting die-bonding film
#85BONDING WIRE FOR SEMICONDUCTOR
#86METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM
#87Bonding wire for semiconductor device
#88Method For Low Temperature Bonding And Bonded Structure
#89Semiconductor device with pads of enhanced moisture blocking ability
#90Semiconductor device and method for manufacturing thereof
#91Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner
#92Gas delivery system for reducing oxidation in wire bonding operations
#93Recessed pillar structure
#94Substrate stand-offs for semiconductor devices
#95INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#96Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer
#97Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
#98Double-sided integrated circuit chips
#99Reception circuit and signal reception method
#100Chip package having a chip combined with a substrate via a copper pillar
#101Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
#102SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER
#103PATTERNED CONTACT
#104Carbon nanotube circuit component structure
#105WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE
#106Cu pillar bump with non-metal sidewall protection structure
#107Integrated circuit including bond wire directly bonded to pad
#108Semiconductor device capable of switching operation modes
#109Apparatus with a multi-layer coating and method of forming the same
#110Inverse chip connector
#111Semiconductor device including coupling ball with layers of aluminum and copper alloys
#112Semiconductor device and manufacturing method of the same
#113Semiconductor chip with coil element over passivation layer
#114Cu pillar bump with non-metal sidewall protection structure
#115Pin-type chip tooling
#116METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE
#117Semiconductor device capable of switching operation mode and operation mode setting method therefor
#118Chip package and method for fabricating the same
#119Rigid-backed, membrane-based chip tooling
#120Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#121Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#122Semiconductor chip with a bonding pad having contact and test areas
#123WIREBONDING PROCESS
#124Post passivation interconnection schemes on top of the IC chips
#125Bonded structure and manufacturing method for bonded structure
#126Contact-based encapsulation
#127Bonding connection between a bonding wire and a power semiconductor chip
#128Bonding wire for semiconductor
#129Interconnect with flexible dielectric layer
#130Joint structure, joining material, and method for producing joining material containing bismuth
#131Semiconductor device
#132Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
#133Bonding structure of bonding wire
#134Semiconductor chip assembly with post/base heat spreader with ESD protection layer
#135Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head
#136Semiconductor device and method for manufacturing same
#137Gas delivery system for reducing oxidation in wire bonding operations
#138Method for low temperature bonding and bonded structure
#139Semiconductor device
#140Bonding metallurgy for three-dimensional interconnect
#141ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME
#142METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#143Composite silver nanoparticle, composite silver nanopaste, bonding method and patterning method
#144Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#145FORMING GAS KIT DESIGN FOR COPPER BONDING
#146Bonding wire for semiconductor devices
#147Copper alloy bonding wire for semiconductor device
#148Semiconductor device bonding wire and wire bonding method
#1493-D semiconductor die structure with containing feature and method
#150METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE
#151High-voltage semiconductor device
#152INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP
#153WIREBOND STRUCTURES
#154Bonding wire for semiconductor devices
#155Bonding apparatus and wire bonding method
#156ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE
#157Optoelectronic system
#158Bonding wire for semiconductor device
#159Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same
#160High breakdown voltage semiconductor device and high voltage integrated circuit
#161Semiconductor integrated circuit device and method of manufacturing same
#162Semiconductor device capable of switching operation modes
#163Integrated circuit chip using top post-passivation technology and bottom structure technology
#164SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#165Method for bonding wafers to produce stacked integrated circuits
#166MIM decoupling capacitors under a contact pad
#167Module having a stacked magnetic device and semiconductor device and method of forming the same
#168Wire bonding structure and method for forming same
#169SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#170Bidirectional switch module
#171SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#172Coaxial through chip connection
#173THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#174Metallized substrate and method for producing the same
#175Lead frames with improved adhesion to plastic encapsulant
#176Laser bonding for stacking semiconductor substrates
#177Ultrahigh-purity copper and process for producing the same
#178Method for low temperature bonding and bonded structure
#179Nano memory, light, energy, antenna and strand-based systems and methods
#180Semiconductor element and electrical apparatus
#181Semiconductor Package Having Support Chip And Fabrication Method Thereof
#182Semiconductor element and electrical apparatus
#183Method for manufacturing semiconductor device
#184Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
#185Protective layer for bond pads
#186Semiconductor device and a manufacturing method of the same
#187Connecting wire and method for manufacturing same
#188Semiconductor electronic component and semiconductor device using the same
#189Method and system for real time control of an active antenna over a distributed antenna system
#190Thermosetting die-bonding film
#191Adhesive tape and semiconductor device using the same
#192Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
#193Wire bonding apparatus and ball forming method
#194Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package
#195Stacked Semiconductor Chips with Through Substrate Vias
#196Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
#197Thermosetting die-bonding film
#198COPPER PAD FOR COPPER WIRE BONDING
#199SEMICONDUCTOR DEVICE INCLUDING COLUMNAR ELECTRODES HAVING PLANAR SIZE GREATER THAN THAT OF CONNECTION PAD PORTION OF WIRING LINE, AND MANUFACTURING METHOD THEREOF
#200ENHANCED WIRE BOND STABILITY ON REACTIVE METAL SURFACES OF A SEMICONDUCTOR DEVICE BY ENCAPSULATION OF THE BOND STRUCTURE
#201Semiconductor device and radio communication device
#202Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process
#203Semiconductor device, manufacturing method and apparatus for the same
#204Bonding metallurgy for three-dimensional interconnect
#205Chip package and method for fabricating the same
#206SEMICONDUCTOR DEVICE HAVING AN ANTI-PAD PEELING-OFF STRUCTURE
#207Circuitry component and method for forming the same
#208Semiconductor chip and method for fabricating the same
#209Wire bonding method
#210Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper
#211Method for low temperature bonding and bonded structure
#212Power converter apparatus
#213RELIABILITY IMPROVEMENT IN A COMPOUND SEMICONDUCTOR MMIC
#214Semiconductor device capable of switching operation modes and operation mode setting method therefor
#215Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer
#216Structure for reduction of soft error rates in integrated circuits
#217Method of manufacturing semiconductor device and semiconductor device
#218Semiconductor device capable of switching operation modes
#219SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#220Semiconductor device and manufacturing method of the same
#221Method of manufacturing electronic device on leadframe
#222Bonding wire for semiconductor device
#223Semiconductor device having a refractory metal containing film and method for manufacturing the same
#224High power integrated RF amplifier
#225ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
#2263-D semiconductor die structure with containing feature and method
#227WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING
#228Semiconductor chip having conductive member for reducing localized voltage drop
#229WIRE BONDING METHOD
#230Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding
#231METHOD AND DEVICE FOR WIRE BONDING
#232Work clamp and wire bonding apparatus
#233Semiconductor device with bonding pad
#234Semiconductor device and method for manufacturing thereof
#235Double-sided integrated circuit chips
#236Manufacturing method of semiconductor integrated device with inverting plating cup
#237Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#238Semiconductor package
#239Wafer bonding method
#240Coated lead frame
#241Semiconductor chip with coil element over passivation layer
#242Electronic device
#243Bump I/O contact for semiconductor device
#244Semiconductor mounting bonding wire
#2453D IC method and device
#246Bidirectional switch module
#247UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION
#248BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME
#249Semiconductor device and method of providing common voltage bus and wire bondable redistribution
#250Electronic assembly having a multilayer adhesive structure
#251Sensor package
#252Semiconductor apparatus having side surface wiring
#253SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
#254Semiconductor Device Package Disassembly
#255Semiconductor device with pads of enhanced moisture blocking ability
#256Semiconductor device and method for manufacturing the same
#257Semiconductor device
#258Metal pad formation method and metal pad structure using the same
#259Power composite integrated semiconductor device and manufacturing method thereof
#260Photoelectric conversion element having a semiconductor and semiconductor device using the same
#261Ubm Pad, Solder Contact and Methods for Creating a Solder Joint
#262Electronic circuit package
#263Device configuration and method to manufacture trench MOSFET with solderable front metal
#264MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING
#265Packages and assemblies including lidded chips
#266Solderable top metal for silicon carbide semiconductor devices
#267Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure
#268Integration type semiconductor device and method for manufacturing the same
#269Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
#270Semiconductor device with improved pads
#271Semiconductor device and method for manufacturing the same
#272SEMICONDUCTOR DEVICE WITH BONDING PAD
#273Method of assembling chips
#274SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS
#275Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device
#276Method of wire bonding over active area of a semiconductor circuit
#277Wire-bonded semiconductor component with reinforced inner connection metallization
#278Method of joining chips utilizing copper pillar
#279Ultrahigh-purity copper and process for producing the same
#280Method of assembling chips
#281Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#282SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE
#283Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#284Semiconductor device including a coupling region which includes layers of aluminum and copper alloys
#285INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#286SEMICONDUCTOR DEVICE FOR WHICH ELECTRICAL TEST IS PERFORMED WHILE PROBE IS IN CONTACT WITH CONDUCTIVE PAD
#287Wire cleaning guide
#288Method for reduction of soft error rates in integrated circuits
#289Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers
#290Post passivation interconnection schemes on top of the IC chips
#291Semiconductor device and method for manufacturing same
#292Post passivation interconnection schemes on top of the IC chips
#293Integrated circuit chips with fine-line metal and over-passivation metal
#294Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package
#295METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
#296Apparatus for delivering shielding gas during wire bonding
#297Bonding and probing pad structures
#298Integrated circuit chips with fine-line metal and over-passivation metal
#299INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#300Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance