Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Lateral conduction Schottky diode with plural mesas

Semiconductor memory device and defect remedying method thereof

Adhesive, method of connecting wiring terminals and wiring structure

Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles

Wafer-level chip scale package and method for fabricating and using the same

Method for manufacturing semiconductor device

Ball transferring method and apparatus

Method of manufacturing hybrid integrated circuit device

Method of manufacturing a sensor device with binding material having a foaming agent

Quad flat non-leaded package comprising a semiconductor device

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Dies bonding apparatus and dies bonding method

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for making a micromechanical device by using a sacrificial substrate

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

DEVICE WITH AREA ARRAY PADS FOR TEST PROBING

Bumped IC, display device and electronic device using the same

Bumpless wafer scale device and board assembly

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device having radiation structure

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

Selective passivation of exposed silicon

Direct writeTM system

Semiconductor device and manufacturing method of them

Driver chip and display apparatus having the same

Adhesion by plasma conditioning of semiconductor chip

WAFER-LEVEL PACKAGE STRUCTURE

Room temperature metal direct bonding

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Interconnect structure for power transistors

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Method and resulting structure for manufacturing semiconductor substrates

Method of forming segmented ball limiting metallurgy

Hermetic passivation structure with low capacitance

Semiconductor device and method of fabricating the same

Process of fabricating polymer sustained microelectrodes

Structure and method for temporarily holding integrated circuit chips in accurate alignment

Polymer sustained microelectrodes

Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same

Die attach by temperature gradient lead free soft solder metal sheet or film

Self-supporting connecting element for a semiconductor chip

Semiconductor integrated circuit device

Semiconductor device using LED chip

Test assembly including a test die for testing a semiconductor product die

Methods of making microelectronic assemblies

Semiconductor device and manufacturing method thereof

Electronic device having wiring substrate and lead frame

LED substrate

Semiconductor device, optoelectronic board, and production methods therefor

Semiconductor device and method of manufacturing the same

Semiconductor element having protruded bump electrodes

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Dual band power amplifier module for wireless communication devices

Semiconductor device and method of fabricating the same

Method and apparatus for applying body bias to integrated circuit die

Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Chip packaging compositions, packages and systems made therewith, and methods of making same

Metal article intended for at least partially coating with a substance and a method for producing the same

Dual semiconductor die package with reverse lead form

Method and apparatus for improved power routing

Flip-chip solder bump formation using a wirebonder apparatus

Flip clip attach and copper clip attach on MOSFET device

Method of manufacturing a semiconductor device and a semiconductor device

Inverted J-lead for power devices

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

Nano-metal composite made by deposition from colloidal suspensions

Method of incorporating interconnect systems into an integrated circuit process flow

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Semiconductor device and method of manufacturing thereof

Power amplifier module for wireless communication devices

Thinned die integrated circuit package

Semiconductor device

Method for fabricating chip package

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Capillary with contained inner chamfer

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Stacked semiconductor device

Semiconductor device and method for assembling the same

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Semiconductor device and its manufacturing method, and semiconductor device manufacturing system

Wiring base with wiring extending inside and outside of a mounting region

Method for mounting semiconductor chip and semiconductor chip-mounted board

Opto-electronic element with a metallized carrier

Methods and apparatus for integrated circuit device power distribution via internal wire bonds

Film adhesives containing maleimide compounds and methods for use thereof

Method of manufacturing a semiconductor device

Method of applying a pattern of particles to a substrate

Power amplifier device

Flip chip device having supportable bar and mounting structure thereof

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Circuit device and manufacturing method thereof

Molded leadless package having a partially exposed lead frame pad

Mounting method for a semiconductor component

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

Apparatus and method for mounting electronic components

Structure and method of making capped chips having vertical interconnects

Wafer level transparent packaging

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Wire loop height measurement apparatus and method

Stacked semiconductor device including improved lead frame arrangement

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Semiconductor device having metal plates and semiconductor chip

Power semiconductor device and power semiconductor module

Method for forming solder bump structure

Method for reduced input output area

Back-face and edge interconnects for lidded package

Semiconductor chip package and method for making the same

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

Chip structure and process for forming the same

Automated filament attachment system for vacuum fluorescent display

Method of forming bumps

Structure and method of making capped chips using sacrificial layer

RF amplifier

Rectifier diode device

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Prevention of contamination on bonding pads of wafer during SMT

Electronic circuit device and porduction method therefor

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Large bumps for optical flip chips

Large bumps for optical flip chips

Methods for forming patterns on a filled dielectric material on substrates

Method for low temperature bonding and bonded structure

Semiconductor radiation emitter package

Bonding tool with polymer coating

Tin deposition

Inter-chip and intra-chip wireless communications systems

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Integrated circuit package bond pad having plurality of conductive members

Sealing and protecting integrated circuit bonding pads

Semiconductor device and method of fabricating the same

Wafer-level moat structures

Substrate having built-in semiconductor apparatus and manufacturing method thereof

Reinforced bond pad

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Method of forming a semiconductor package and structure thereof

Hybrid integrated circuit device and method of manufacturing the same

Circuit carrier and production thereof

Methods relating to forming interconnects and resulting assemblies

Bonding pad structure to minimize IMD cracking

Electrical or electronic component and method of producing same

Method for mounting passive components on wafer

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Designs and methods for conductive bumps

Method of fixing a sealing object to a base object

Semiconductor apparatus and method for fabricating the same

High-frequency module and method for manufacturing the same

Semiconductor package with through-hole

Receptacle and plug therefor

Solder bump structure and method for forming the same

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Semiconductor device

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Semiconductor device having transferred integrated circuit

Method for chemical etch control of noble metals in the presence of less noble metals

Method of forming a bond pad

Semiconductor device and manufacturing method thereof

Super high density module with integrated wafer level packages

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Direct write™ system

Buried solder bumps for AC-coupled microelectronic interconnects

High-frequency chip packages

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Wafer-level chip scale package

Process for forming lead-free bump on electronic component

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Process for making contact with and housing integrated circuits

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

Coolant cooled type semiconductor device

Semiconductor package with improved chip attachment and manufacturing method thereof

Aqueous based metal etchant

CSP semiconductor device having signal and radiation bump groups

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Fabrication method of semiconductor device

Method for creating flip-chip conductive-polymer bumps using photolithography and polishing

Method for producing a semiconductor device in chip format

Bonding structure with pillar and cap

Power supply device

Voltage protection device

High frequency circuit using high output amplifier cell block and low output amplifier cell block

Method for assembling a ball grid array package with multiple interposers

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Bumping process

Method for making electronic devices including silicon and LTCC and devices produced thereby

IC chip with improved pillar bumps

Semiconductor component having conductors with wire bondable metalization layers

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Forming tool for forming a contoured microelectronic spring mold

Substrate holder and plating apparatus

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Stencil mask design method and under bump metallurgy for C4 solder bump

Semiconductor assembly encapsulation mold and method for forming same

Wafer-level chip scale package and method for fabricating and using the same

Under-bump metallugical structure

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Semiconductor device including inclined cut surface and manufacturing method thereof

Semiconductor device including a potential drawing portion formed at a corner

Semiconductor device

Semiconductor device wiring structure

Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby

Wafer level bumping process

Manufacturing method for semiconductor device

Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs

Method of manufacturing a plurality of assemblies

Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof

Interlayer dielectric and pre-applied die attach adhesive materials

Packaging assembly and method of assembling the same

Bump electrodes having multiple under ball metallurgy (UBM) layers

Semiconductor device

High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same

Surface mount multichip devices

Micro lead frame package

Semiconductor device with under bump metallurgy and method for fabricating the same

Method for forming semiconductor device including stacked dies

Semiconductor device and lead frame

Semiconductor apparatus and method for preparing the same