212030 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Vanadium [V]
Liquid metal thermal interface material system
#2702Microelectronic packages with solder interconnections
#2703Semiconductor device and manufacturing method of semiconductor device
#2704Semiconductor device
#2705Semiconductor die attachment for high vacuum tubes
#2706Microelectronic assemblies incorporating inductors
#2707Resonator, ultrasonic head, and ultrasonic bonder using the same
#2708Plating apparatus
#2709Forming an intermediate layer in interconnect joints and structures formed thereby
#2710Electronic device and manufacturing method of the same
#2711Solder for fabricating solder bumps and pumping process
#2712Power module, and phase leg assembly
#2713Die bonded device and method for transistor packages
#2714ESD protection apparatus for an electrical device
#2715Power amplifier module
#2716Module substrate and disk apparatus
#2717REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF
#2718Multi-chip package
#2719Wire positioning and mechanical attachment for a radio-frequency indentification device
#2720Semiconductor package device and method for fabricating the same
#2721Semiconductor package with conductive molding compound and manufacturing method thereof
#2722Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#2723Bumping process and structure thereof
#2724Fabrication method of a wafer structure
#2725In-place bonding of microstructures
#2726LED with self aligned bond pad
#2727Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
#2728Semiconductor device, circuit board, electro-optic device, electronic device
#2729Film circuit substrate having Sn-In alloy layer
#2730Bumping process and structure thereof
#2731Method for manufacturing a semiconductor device
#2732Chip package, chip packaging, chip carrier and process thereof
#2733Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#2734Oblique parts or surfaces
#2735Bumping process and structure thereof
#2736Audio amplifier assembly
#2737Solderable top metal for SiC device
#2738Circuit carrier and production thereof
#2739Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#2740Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
#2741Non-Circular via holes for bumping pads and related structures
#2742Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#2743Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
#2744Method for forming an electrode
#2745Underfill of resin and sulfonic acid-releasing thermally cleavable compound
#2746Inverter and vehicle drive unit using the same
#2747Methods to deposit metal alloy barrier layers
#2748Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device
#2749Semiconductor device carrier unit and semiconductor socket provided therewith
#2750Film substrate of a semiconductor package and a manufacturing method
#2751Semiconductor substrate thinning method for manufacturing thinned die
#2752Method for fabricating carrier structure integrated with semiconductor element
#2753Semiconductor element including a wet prevention film
#2754Die down ball grid array package
#2755Bonding apparatus
#2756Circuit-connecting material and circuit terminal connected structure and connecting method
#2757Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
#2758Electronic circuit including circuit-connecting material
#2759Semiconductor device having a switch circuit
#2760Semiconductor device
#2761Semiconductor device and fabrication process thereof
#2762Wafer level packages and methods of fabrication
#2763Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices
#2764Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
#2765Semiconductor module
#2766Sensor device having stopper for limitting displacement
#2767Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
#2768Sealed surface acoustic wave element package
#2769Light emitting device and method of producing same
#2770Conductive particle and adhesive agent
#2771Bump structure of semiconductor package and method for fabricating the same
#2772Microprobe tips and methods for making
#2773Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology
#2774Electronic device and method of manufacturing the same
#2775Grooved substrates for uniform underfilling solder ball assembled electronic devices
#2776Semiconductor device having tin-based solder layer and method for manufacturing the same
#2777Semiconductor device with reduced contact resistance
#2778High density interconnect power and ground strap and method therefor
#2779Semiconductor device
#2780Semiconductor device and method for fabricating the same
#2781Semiconductor chip, electrically connections therefor
#2782High-reliable semiconductor device using hermetic sealing of electrodes
#2783Structures and methods for heat dissipation of semiconductor integrated circuits
#2784Apparatus for improved power distribution in wirebond semiconductor packages
#2785Semiconductor device and process for manufacturing the same
#2786Semiconductor device with simplified constitution
#2787Dense intermetallic compound layer
#2788Method of bonding and bonding apparatus for a semiconductor chip
#2789Method for transferring a semiconductor body from a growth substrate to a support material
#2790Substrate for producing semiconductor packages
#2791QFN package and method therefor
#2792Method and resulting structure for manufacturing semiconductor substrates
#2793Stacked packages
#2794Semiconductor device with sidewall wiring
#2795Programmable radio transceiver
#2796Method of fabricating semiconductor device
#2797Method for fabricating semiconductor package with circuit side polymer layer
#2798Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
#2799Method and apparatus for stacked die packaging
#2800Interconnect assemblies and methods
#2801Microelectronic packages including solder bumps and AC-coupled interconnect elements
#2802Semiconductor device and method of manufacturing same
#2803Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
#2804Semiconductor device and a manufacturing method of the same
#2805Die bonding apparatus
#2806Method for forming microelectronic spring structures on a substrate
#2807Formation method and structure of conductive bumps
#2808Semiconductor package having protective layer for re-routing lines and method of manufacturing the same
#2809Structure and formation method of conductive bumps
#2810Semiconductor device and method of manufacturing a semiconductor device
#2811Interconnections of semiconductor device and method of forming the same
#2812Semiconductor package and method for its manufacture
#2813Power semiconductor package
#2814Damascene patterning of barrier layer metal for C4 solder bumps
#2815Circuit-connecting material and circuit terminal connected structure and connecting method
#2816Method of manufacturing semiconductor device
#2817Substrate for mounting IC chip
#2818Connection between a semiconductor chip and a circuit component with a large contact area
#2819Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#2820Semiconductor device and method of manufacturing the same
#2821Bonding method and bonding apparatus
#2822Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
#2823Methods of forming electronic structures including conductive shunt layers and related structures
#2824Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
#2825Stacked semiconductor chips
#2826Substrate having built-in semiconductor apparatus and manufacturing method thereof
#2827Flip-chip without bumps and polymer for board assembly
#2828Stacked semiconductor device and semiconductor memory module
#2829Plastic encapsulated semiconductor device with reliable down bonds
#2830Semiconductor device and method of manufacturing same
#2831Method for ultra thinning bumped wafers for flip chip
#2832Highly compliant plate for wafer bonding
#2833Electrode contact structure
#2834Electronic assembly having multi-material interconnects
#2835Packaging stacked chips with finger structure
#2836Electronic package and semiconductor device using the same
#2837Taped lead frames and methods of making and using the same in semiconductor packaging
#2838Semiconductor device, optoelectronic board, and production methods therefor
#2839Bonding apparatus and method of bonding for a semiconductor chip
#2840Co-curable compositions
#2841Modular board device, high frequency module, and method of manufacturing same
#2842Heat sink formed of multiple metal layers on backside of integrated circuit die
#2843Electrostatic discharge (ESD) protection for integrated circuit packages
#2844Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#2845Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
#2846Semiconductor device and manufacturing method thereof
#2847Prefabricated semiconductor chip carrier
#2848Electronic assembly having an indium wetting layer on a thermally conductive body
#2849Printed wiring board
#2850Co-packaged control circuit, transistor and inverted diode
#2851Semiconductor device, manufacturing method and apparatus for the same
#2852Wire bonding wedge
#2853Method of forming a lead-free bump and a plating apparatus therefor
#2854Compound semiconductor device and manufacturing method thereof
#2855Method for forming bump on electrode pad with use of double-layered film
#2856Manufacturing method of semiconductor device
#2857Capping of metal interconnects in integrated circuit electronic devices
#2858Method of forming a solder bump and the structure thereof
#2859Lead-free bonding systems
#2860Spread spectrum isolator
#2861Semiconductor device with reduced contact resistance
#2862Formation method for conductive bump
#2863RF isolator for isolating voltage sensing and gate drivers
#2864RF isolator with differential input/output
#2865Method of making photolithographically-patterned out-of-plane coil structures
#2866Semiconductor package including redistribution pattern and method of manufacturing the same
#2867On chip transformer isolator
#2868Semiconductor device
#2869Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#2870Novel aqueous based metal etchant
#2871Integrated power amplifier module with power sensor
#2872Chip structure and process for forming the same
#2873Asymmetric bump structure
#2874Semiconductor device and method for manufacturing the same
#2875Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#2876Semiconductor device with a floating gate electrode that includes a plurality of particles
#2877Multi-band tunable resonant circuit
#2878Bonding method, bonding apparatus and sealing means
#2879Circuit device, manufacturing method thereof, and sheet-like board member
#2880Method for fabricating leadless packages with mold locking characteristics
#2881Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#2882Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#2883Semiconductor device
#2884Bump structure
#2885Leadless leadframe with an improved die pad for mold locking
#2886Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement
#2887Semiconductor die attachment for high vacuum tubes
#2888Method and resulting structure for manufacturing semiconductor substrates
#2889Method of attaching a leadframe to singulated semiconductor dice
#2890Method to build robust mechanical structures on substrate surfaces
#2891Light emitting diodes for high AC voltage operation and general lighting
#2892Universal interconnect die
#2893Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
#2894Method for integrating pre-fabricated chip structures into functional electronic systems
#2895Semiconductor device
#2896Method of manufacturing different bond pads on the same substrate of an integrated circuit package
#2897Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#2898Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
#2899Semiconductor die attachment for high vacuum tubes
#2900Method of forming an array of semiconductor packages
#2901Semiconductor package and method of fabricating the same
#2902Under bump metallization layer to enable use of high tin content solder bumps
#2903Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#2904Method of magnetic field assisted self-assembly
#2905High data rate chip mounting
#2906Surface mount multichip devices
#2907Sealing and protecting integrated circuit bonding pads
#2908Method for making an interconnect pad
#2909Microelectronic connection components having bondable wires
#2910Semiconductor device
#2911Test circuit under pad
#2912Method for producing a semiconductor element
#2913Method for releasing stress of embedded chip and chip embedded structure
#2914Method for producing a BGA chip module and BGA chip module
#2915Semiconductor device in which semiconductor chip is mounted on lead frame
#2916Semiconductor device, producing method of semiconductor substrate, and producing method of semiconductor device
#2917Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#2918Method and apparatus for improved power routing
#2919Bump structure for a semiconductor device and method of manufacture
#2920Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
#2921Semiconductor device
#2922Semiconductor device
#2923High power Doherty amplifier
#2924Semiconductor device and multilayer substrate therefor
#2925NANO IC packaging
#2926Power semiconductor module
#2927Electronic component, mounted structure, electro-optical device, and electronic device
#2928Power semiconductor switching devices and power semiconductor devices
#2929Programmable radio transceiver
#2930Electronic device and method of manufacture the same
#2931Method for depositing a solder material on a substrate
#2932Manufacture of microelectronic fold packages
#2933Dicing die bonding film
#2934Conductive material for integrated circuit fabrication
#2935Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
#2936Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
#2937Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits
#2938Heat curable adhesive composition, article, semiconductor apparatus and method
#2939Circuit board, device mounting structure, device mounting method, and electronic apparatus
#2940Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#2941Integrated circuit package and method having wire-bonded intra-die electrical connections
#2942Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#2943Power semiconductor switching-device and semiconductor power module using the device
#2944Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
#2945Wafer support and release in wafer processing
#2946Wire bonding apparatus
#2947Semiconductor flip-chip package and method for the fabrication thereof
#2948Semiconductor device, a method of manufacturing the same and an electronic device
#2949Semiconductor device with non-overlapping chip mounting sections
#2950Top finger having a groove and semiconductor device having the same
#2951Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#2952Methods of forming bumps using barrier layers as etch masks
#2953Method of wafer/substrate bonding
#2954Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#2955BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE
#2956Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#2957Programmable radio transceiver
#2958Adhesion by plasma conditioning of semiconductor chip surfaces
#2959Semiconductor device and manufacturing metthod thereof
#2960Under bump metallization layer to enable use of high tin content solder bumps
#2961Semiconductor device and method of manufacturing the same
#2962HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#2963Semiconductor apparatus and method of fabricating the apparatus
#2964Method of routing an electrical connection on a semiconductor device and structure therefor
#2965Semiconductor device and manufacturing method of the same
#2966Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#2967Stacked semiconductor packages
#2968Circuit device and manufacturing method thereof
#2969Semiconductor package having step type die and method for manufacturing the same
#2970Manufacturing and testing of electrostatic discharge protection circuits
#2971Semiconductor device and manufacturing method thereof
#2972Bump and fabricating process thereof
#2973Semiconductor component assemblies having interconnects
#2974Semiconductor package without bonding wires and fabrication method thereof
#2975Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
#2976Semiconductor device and electronic device
#2977Electronic component having an integrated passive electronic component and associated production method
#2978Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#2979Power amplifier module for wireless communication devices
#2980Submount and semiconductor device
#2981Semiconductor device and manufacturing method for the same
#2982Bonding pad arrangement method for semiconductor devices
#2983Testable electrostatic discharge protection circuits
#2984Apparatus and method for forming bump
#2985Method to prevent passivation layer peeling in a solder bump formation process
#2986Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#2987Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#2988Test head assembly having paired contact structures
#2989Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
#2990Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
#2991Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
#2992Method and apparatus for fabricating self-assembling microstructures
#2993Light emitting diodes for high AC voltage operation and general lighting
#2994Semiconductor integrated circuit device
#2995Semiconductor device
#2996Semiconductor device and fabrication method for the same
#2997Single mask via method and device
#2998Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof
#2999Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#3000Semiconductor copper bond pad surface protection