212030 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Vanadium [V]
PACKAGE PROCESS AND PACKAGE STRUCTURE
#2REVERSABLE ATTACHMENT SYSTEM
#3Semiconductor device and method for fabricating a semiconductor device
#4SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSOR, AND ELECTRONIC EQUIPMENT
#5SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#6Reworkable inter-substrate bond structure
#7Semiconductor device with sealed semiconductor chip
#8Package process and package structure
#9DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#10SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#11SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
#12Semiconductor device and method for production of semiconductor device
#133D IC method and device
#143D IC method and device
#15Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment
#16Semiconductor device and method for fabricating a semiconductor device
#17Semiconductor device with sealed semiconductor chip
#18Semiconductor device and method of manufacturing semiconductor device
#19Alignment marks in substrate having through-substrate via (TSV)
#20Solder material for semiconductor device
#21Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment
#22Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
#23Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
#24Semiconductor device and method for production of semiconductor device
#25Substrate with embedded stacked through-silicon via die
#26Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#27Four D device process and structure
#28Semiconductor device with island and associated leads
#29Method of room temperature covalent bonding
#30METHOD OF ROOM TEMPERATURE COVALENT BONDING
#31Semiconductor device with sealed semiconductor chip
#32Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment
#33Designs and methods for conductive bumps
#34Systems and methods for electromagnetic interference shielding
#35Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#363D IC method and device
#37Alignment marks in substrate having through-substrate via (TSV)
#38ROOM TEMPERATURE METAL DIRECT BONDING
#39Method for preparing a semiconductor package
#40Solder metallization stack and methods of formation thereof
#41Semiconductor device
#42Semiconductor device
#43Electronic module with EMI protection
#44Methods and apparatus for measuring analytes using large scale FET arrays
#45Method of making fully molded peripheral package on package device
#46Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#47Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#48Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#49Implantable electrode array assembly including a carrier with packaged control modules
#50Semiconductor device and method of packaging
#51Microelectronic elements with post-assembly planarization
#52Semiconductor device and method for production of semiconductor device
#53Semiconductor package and method for preparing the same
#54Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment
#55Semiconductor device with island and associated leads
#56Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#57Fully molded miniaturized semiconductor module
#58SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#59Semiconductor structure having a composite barrier layer
#60Optoelectronic semiconductor component
#61Solder material for semiconductor device
#62Tooling for coupling multiple electronic chips
#63Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#64Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
#65Semiconductor device
#66Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#67Semiconductor packages and methods of fabrication thereof
#68Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
#693D IC method and device
#70Systems and methods for electromagnetic interference shielding
#71Semiconductor device and method for production of semiconductor device
#72Package process and package structure
#73Methods and apparatus of packaging semiconductor devices
#74Microelectronic elements with post-assembly planarization
#75Inter-chip alignment
#76Semiconductor device
#77Fabrication method of packaging substrate
#78Pillar design for conductive bump
#79Designs and methods for conductive bumps
#80Cu pillar bump with L-shaped non-metal sidewall protection structure
#81Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#82High quality electrical contacts between integrated circuit chips
#83Packaging devices and methods of manufacture thereof
#84Semiconductor device
#85Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#86Optoelectronic component and method of producing an optoelectronic component
#87Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#88Wafer backside interconnect structure connected to TSVs
#89SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#90Solder metallization stack and methods of formation thereof
#91Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by the same
#92Semiconductor device and method of forming a thin wafer without a carrier
#93Power semiconductor device and method therefor
#94Methods and apparatus for measuring analytes using large scale FET arrays
#95Method for low temperature bonding and bonded structure
#96Tooling for coupling multiple electronic chips
#97Semiconductor device and method for manufacturing the same
#98Semiconductor device
#99Semiconductor device
#100Methods for forming pillar bumps on semiconductor wafers
#101Packaging devices and methods of manufacture thereof
#102Method of producing a hybridized device including microelectronic components
#103Circuit module and method of manufacturing the same
#104Laser assisted transfer welding process
#105Bonding method using bonding material
#106Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#107Semiconductor device and method for production of semiconductor device
#108Method of forming an interconnection and arrangement for a direct interconnect chip assembly
#109Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
#110Bonding material and bonding method using the same
#111Method for low temperature bonding and bonded structure
#112Room temperature metal direct bonding
#113ZN BASED LEAD-FREE SOLDER AND SEMICONDUCTOR POWER MODULE
#114Template and pattern forming method
#115Method for forming package systems having interposers
#116Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#117Four D device process and structure
#118Semiconductor device having low on resistance
#119Method of forming an integrated circuit device including a pillar capped by barrier layer
#120Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#121Semiconductor device
#122Apparatus and methods for high-density chip connectivity
#123Semiconductor device and method for manufacturing the same
#124Circuit module and method of manufacturing the same
#1253D IC method and device
#126Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
#127Method for low temperature bonding and bonded structure
#128Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#129Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#130Substrate bonding with diffusion barrier structures
#131Semiconductor device
#132Microelectronic elements with post-assembly planarization
#133Microelectronic packages with nanoparticle joining
#134Solder paste, joining method using the same and joined structure
#135LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
#136Semiconductor device
#137Semiconductor device
#138Bonded processed semiconductor structures and carriers
#139Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
#140Package assembly having a semiconductor substrate
#141Semiconductor device
#142Method of fabricating bump structure and bump structure
#143Semiconductor device and method of forming stress relief layer between die and interconnect structure
#144Electronic module with EMI protection
#145Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
#146Semiconductor device with sealed semiconductor chip
#147Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#148Electrochemical deposition method
#149Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#150Alignment marks in substrate having through-substrate via (TSV)
#151Processes and structures for IC fabrication
#152Semiconductor device for battery power voltage control
#153Multiple access over proximity communication
#154Method of room temperature covalent bonding
#155SEMICONDUCTOR DEVICE
#156Multi-function and shielded 3D interconnects
#157Conductive structure and method for forming the same
#158Method of forming package systems having interposers
#159Electronic devices with yielding substrates
#160Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#161Room temperature metal direct bonding
#162Warp compensated electronic assemblies
#163Method of making a pillar structure having a non-metal sidewall protection structure
#164Pillar design for conductive bump
#165Semiconductor device
#166Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier
#167Copper pillar bump with cobalt-containing sidewall protection layer
#168Compliant interconnects in wafers
#169Method of making a conductive pillar bump with non-metal sidewall protection structure
#170Method and apparatus for semiconductor device fabrication using a reconstituted wafer
#171Semiconductor device including DC-DC converter
#172Semiconductor device
#173Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
#174Wafer backside interconnect structure connected to TSVs
#175Stackable package by using internal stacking modules
#176Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#177Semiconductor device including a DC-DC converter
#178Wafer backside interconnect structure connected to TSVs
#179Passivated copper chip pads
#180System and method of sensing current in a power semiconductor device
#181Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
#182Semiconductor device and method for manufacturing the same
#183Pb-free solder bumps with improved mechanical properties
#184Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#185Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#186Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
#187Semiconductor device with a connection pad in a substrate and method for production thereof
#188Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#189Bonded structure with enhanced adhesion strength
#1903D semiconductor device
#191Apparatus for lead free solder interconnections for integrated circuits
#192Front side copper post joint structure for temporary bond in TSV application
#193Semiconductor module system having encapsulated through wire interconnect (TWI)
#194Semiconductor device
#195Pre-soldered leadless package
#196Circuit module and method of manufacturing the same
#197Method for low temperature bonding and bonded structure
#198Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
#199Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#200Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#201Sensor package
#2023D IC method and device
#203Three-dimensional structure in which wiring is provided on its surface
#204Three-dimensional structure for wiring formation
#205Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#206Semiconductor device and method of manufacturing the same
#207Dicing tape-integrated film for semiconductor back surface
#208Semiconductor die package and method for making the same
#209Semiconductor device
#210Method for producing an optoelectronic semiconductor component
#211Integrated circuit device including a copper pillar capped by barrier layer and method of forming the same
#212Laminate electronic device
#213Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#214Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support
#215Semiconductor package with bonding wires of reduced loop inductance
#216Self-aligned protection layer for copper post structure
#217Microelectronic assembly with impedance controlled wirebond and conductive reference element
#218Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#219Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#220Package process and package structure
#221Semiconductor device
#222Microelectronic packages with nanoparticle joining
#223Electronic substrate, semiconductor device, and electronic device
#224Semiconductor device and semiconductor assembly with lead-free solder
#225Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
#226Dicing die bond film
#227Semiconductor device having a copper plug
#228Method of fabricating a package substrate
#229Waterproof structure of pad, waterproof pad, and method for forming waterproof structure
#230Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#231Semiconductor device and manufacturing method thereof
#232Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#233Backside processing of semiconductor devices
#234Semiconductor structure with thin film resistor and terminal bond pad
#235Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection
#236Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#237SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
#238Methods and apparatus for measuring analytes using large scale FET arrays
#239Electronic device, method for producing the same, and printed circuit board comprising electronic device
#240Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#241Methods and apparatus of packaging semiconductor devices
#242Power semiconductor device and method therefor
#243Methods of forming bonded semiconductor structures
#244Semiconductor device and method of forming through vias with reflowed conductive material
#245Cu pillar bump with electrolytic metal sidewall protection
#246Method of fabricating a power semiconductor chip package
#247Method for the wafer-level integration of shape memory alloy wires
#248Circuit device
#249Semiconductor device and method of forming a thin wafer without a carrier
#250Method for chip packaging
#251Process for direct bonding two elements comprising copper portions and portions of dielectric materials
#252Indium compositions
#2533-D Integrated Circuits and Methods of Forming Thereof
#254Bonded processed semiconductor structures and carriers
#255SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS
#256Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
#257Multichip power semiconductor device
#258Method of cutting semiconductor substrate
#259Method of manufacturing a semiconductor device
#260Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces
#261Clip frame semiconductor packages and methods of formation thereof
#262Integrated circuit chip using top post-passivation technology and bottom structure technology
#263Semiconductor chip package having via hole and semiconductor module thereof
#264Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#265Room temperature metal direct bonding
#266Passivated copper chip pads
#267Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
#268Method for chip package
#269High density sensor array without wells
#270Method for producing at least one optoelectronic semiconductor component
#271Printed wiring board and method for manufacturing the same
#272Methods and apparatus for measuring analytes using large scale FET arrays
#273Multilayer printed wiring board
#274Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#275Optoelectronic semiconductor component
#276Processes and structures for IC fabrication
#277Semiconductor component and corresponding production method
#278Power semiconductor device with reduced contact resistance
#279Manufacturing method and electronic module with new routing possibilities
#280Precious metal paste for bonding semiconductor element
#281Production apparatus of composite silver nanoparticle
#282COMPOSITE ALLOY BONDING WIRE
#283Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief
#284MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE
#285Electrically bonded arrays of transfer printed active components
#286Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogen
#287Semiconductor device having a chip mounting portion on which a separated plated layer is disposed
#288Substrate with embedded stacked through-silicon via die
#289Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#290Electronic device with multi-layer contact
#291Monolithic semiconductor switches and method for manufacturing
#292Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump
#293Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#294Methods and apparatus of under bump metallization in packaging semiconductor devices
#295Conductive structure and method for forming the same
#296Semiconductor device with wireless communication
#297Method for developing a custom device
#298Resin paste composition
#299PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
#300WAFER LEVEL CHIP SCALE PACKAGE DEVICE AND MANUFACTURING METHOD THEROF