212030 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Vanadium [V]
Semiconductor device and method of forming conductive pillar having an expanded base
#302Semiconductor device
#303Electrochemical deposition apparatus
#304Semiconductor device
#305Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#306Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#307Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure
#308Device including a semiconductor chip and metal foils
#309Method for producing chip stacks, and a carrier for carrying out the method
#310Semiconductor structure and method for making same
#311ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
#312Semiconductor chip device with solder diffusion protection
#313Self-aligned protection layer for copper post structure
#314Methods of fabricating semiconductor chip solder structures
#315Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
#316Method and apparatus for fabricating integrated circuit device using self-organizing function
#317METHOD OF MANUFACTURING SOFT-DILUTE-COPPER-ALLOY-MATERIAL
#318SEMICONDUCTOR CHIP INCLUDING BUMP HAVING BARRIER LAYER, AND MANUFACTURING METHOD THEREOF
#319Semiconductor package with under bump metallization routing
#320Multilayer printed circuit board
#321Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
#322Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
#323Power semiconductor chip having two metal layers on one face
#324Method for manufacturing semiconductor device
#325Manufacturing method for semiconductor device
#326Wafer-level chip scale package
#327Semiconductor element-embedded wiring substrate
#328Coaxial solder bump support structure
#329PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE
#330Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#331SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE
#332Semiconductor device
#333Pillar design for conductive bump
#334Methods and apparatus for measuring analytes using large scale FET arrays
#335Solder bump cleaning before reflow
#336RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features
#337Memory module in a package
#338Solder bump with inner core pillar in semiconductor package
#339Semiconductor device with solder bump formed on high topography plated Cu pads
#340Bump I/O contact for semiconductor device
#341Electronic assembly including an embedded electronic component
#342Method of forming an inductor on a semiconductor wafer
#343Methods and apparatus for measuring analytes using large scale FET arrays
#344Methods and apparatus for measuring analytes using large scale FET arrays
#345Thermal enhanced package
#346Laminate electronic device
#347Carrier structures for microelectronic elements
#348Semiconductor element-embedded substrate, and method of manufacturing the substrate
#349Semiconductor device including a contact clip having protrusions and manufacturing thereof
#350Oblique parts or surfaces
#351Ball-limiting-metallurgy layers in solder ball structures
#352Methods of forming a metal pattern
#353METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A HEAT SPREADER
#354Four MOSFET full bridge module
#355Semiconductor device and a method of manufacturing the same
#356PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
#357Connecting film, and joined structure and method for producing the same
#358Method for Predetermined Component Placement to a Target Platform
#359Method for Predetermined Component Placement to a Target Platform
#360Method of cutting semiconductor substrate
#361Through wafer vias and method of making same
#362Semiconductor die package and method for making the same
#363Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
#364SEMICONDUCTOR CHIP WITH DUAL POLYMER FILM INTERCONNECT STRUCTURES
#365Optoelectronic component and method for producing an optoelectronic component
#366Die backside standoff structures for semiconductor devices
#367Semiconductor device and manufacturing of the semiconductor device
#368Method of producing a radiation-emitting optoelectronic component
#369BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
#370Semiconductor device and manufacturing method
#371Electrical connection for multichip modules
#372Semiconductor device and bonding material for semiconductor device
#373CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#374Wiring board with built-in semiconductor element
#375Solder ball protection structure with thick polymer layer
#376Electronic device and method for producing electronic device
#377Electronic device and manufacturing thereof
#378Bonded semiconductor structures and methods of forming same
#379Chip package structure and method of making the same
#380Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates
#381Semiconductor device and method of manufacturing same
#382Power converter, semiconductor device, and method for manufacturing power converter
#383Curing low-k dielectrics for improving mechanical strength
#384Conductive pads defined by embedded traces
#385Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector
#386Wafer-level package device
#387Semiconductor device including Schottky barrier diode
#388Light emitting device package and lighting system
#389Connecting and bonding adjacent layers with nanostructures
#390STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
#391Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area
#392SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
#393Stacked wafer level package having a reduced size
#394Bonding material and bonding method using the same
#395Semiconductor structure having offset passivation to reduce electromigration
#396Method for producing a metal layer on a substrate and device
#397Methods and structures for forming integrated semiconductor structures
#398Vertical MOSFET device
#399Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
#400Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)
#401Method of producing semiconductor module and semiconductor module
#402Semiconductor device and method for manufacturing the same
#4033D interconnection structure and method of manufacturing the same
#404Manufacturing electronic device having contact elements with a specified cross section
#405Manufacturing method of semiconductor device
#406Method of producing semiconductor device with patterned photosensitive adhesive
#407Copper pillar bump with non-metal sidewall protection structure and method of making the same
#408Window interposed die packaging
#409Semiconductor device and method of forming wafer level die integration
#410Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
#411Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
#412Chip-packaging module for a chip and a method for forming a chip-packaging module
#413Integrated circuit device including a copper pillar capped by barrier layer
#414Three-dimensional system-in-a-package
#415Semiconductor device and manufacturing method of the same
#416Methods for Lead Free Solder Interconnections for Integrated Circuits
#417Manufacturing method for semiconductor integrated device
#418Semiconductor device and method of forming IPD in fan-out wafer level chip scale package
#419Mechanisms for forming copper pillar bumps using patterned anodes
#420Method of manufacturing a semiconductor device
#421Device and method including a soldering process
#422Double layer metal (DLM) power MOSFET
#423Semiconductor device
#424SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER
#425Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#426Sealed electric element package
#427SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION
#428Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device
#429ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF
#430Semiconductor device
#431Production method of connection structure
#432Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device
#433PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR
#434METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#435Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device
#436Method for the production of an electronic component and electronic component produced according to this method
#437Selective electromigration improvement for high current C4s
#438Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumps
#439METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
#440Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die
#441Method of fabricating a semiconductor chip with supportive terminal pad
#442WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION
#443Semiconductor device and method of manufacturing the same
#444Power device with bottom source electrode
#445Method of manufacturing optical module
#446Template and pattern forming method
#447DEVICE INCLUDING A SEMICONDUCTOR CHIP
#448Solder bump interconnect
#449Anisotropic conductive film, connection structure and method of producing the same
#450Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate
#451Semiconductor device and method of forming stress relief layer between die and interconnect structure
#452Optoelectronic component and method for producing an opto-electronic component
#453Mechanical coupling in a multi-chip module using magnetic components
#454Heat radiation material, electronic device and method of manufacturing electronic device
#455Wiring connection method and functional device
#456SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#457Electronic devices with yielding substrates
#458Semiconductor device
#459CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME
#460Low temperature high strength metal stack for die attachment
#461Method for mounting a semiconductor chip on a carrier
#462Semiconductor device and manufacturing method therefor
#463On-Chip RF shields with front side redistribution lines
#464RFID integrated circuit with integrated antenna structure
#465METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-DEPOSITED NICKEL COPPER ALLOY
#466WAFER-LEVEL CHIP SCALE PACKAGING OF METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT-TRANSISTORS (MOSFET'S)
#467SURGE PROTECTION DEVICE
#468CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF
#469Sensor device having electrode draw-out portions through side of substrate
#470Rule-based semiconductor die stacking and bonding within a multi-die package
#471Method of making ferroelectric memory device with barrier layer and novolac resin passivation layer
#472Electrostatic chucking of an insulator handle substrate
#473Multichip Packages
#474Pad bonding employing a self-aligned plated liner for adhesion enhancement
#475Light-emitting diode arrangement and method for producing the same
#476Semiconductor device and wiring board
#477Device including two semiconductor chips and manufacturing thereof
#478Method of room temperature covalent bonding
#479CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL
#480Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers
#481Semiconductor module
#482POWER SEMICONDUCTOR DEVICE PACKAGING
#483Semiconductor die package and method for making the same
#484Multilayer printed wiring board
#485Device including two mounting surfaces
#486Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure
#487Semiconductor device
#488Lead frame and semiconductor package including the same
#489Method of manufacturing semiconductor device
#490Semiconductor device having a copper plug
#491Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
#492ADHESIVE COMPOSITION
#493BOND PACKAGE AND APPROACH THEREFOR
#494Substrate with embedded stacked through-silicon via die
#495Method for producing an integrated circuit and resulting film chip
#496Method of forming a ring-shaped metal structure
#497Solder paste, joining method using the same and joined structure
#498ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
#499CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE
#500Metallic thermal joint for high power density chips
#501SEMICONDUCTOR DEVICE
#502Void-free wafer bonding using channels
#503Metal paste with co-precursors
#504FOUR MOSFET FULL BRIDGE MODULE
#505Semiconductor device for battery power voltage control
#506Semiconductor device with wireless communication
#507Electronic device and method of manufacturing electronic device
#508Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
#509Wafer-level interconnect for high mechanical reliability applications
#510Semiconductor device including a DC-DC converter with schottky barrier diode
#511Compliant interconnects in wafers
#512Semiconductor device including a DC-DC converter
#513Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#514Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
#515Soft error rate mitigation by interconnect structure
#516ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
#517Mechanisms for resistivity measurement of bump structures
#518Semiconductor device and method for manufacturing the same
#519SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
#520Compensation network for RF transistor
#521Micro-fluidic injection molded solder (IMS)
#522Methods for wafer bonding, and for nucleating bonding nanophases
#523ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE
#524METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME
#5254D Device, process and structure
#526Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip
#527Semiconductor device and semiconductor package having the same
#528STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING
#529THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY
#530SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF
#531Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
#532ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#533DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
#534LED PACKAGE
#535Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#536Connecting and bonding adjacent layers with nanostructures
#537SEMICONDUCTOR DEVICE
#538SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#539Semiconductor package with bonding wires of reduced loop inductance
#540Conductive pads defined by embedded traces
#541Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground
#542SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#543Method for manufacturing a substrate for a semiconductor package
#544Contact pad
#545Laser assisted transfer welding process
#546Composite nanometal paste of two-metallic-component type, bonding method, and electronic part
#547BONDING SHEET
#548Quad flat package with exposed paddle
#549Semiconductor chip and semiconductor device including the same
#550Silicon structure having bonding pad
#551Semiconductor structure and method for making same
#552Flexible electronic devices and related methods
#553Anisotropic conductive adhesive
#554Etching composition for an under-bump metallurgy layer
#555Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus
#556ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD
#557Electronic component and electronic device
#558Multilayered printed circuit board and method for manufacturing the same
#559Electronic device and electronic apparatus
#560Bonding wire for semiconductor device
#561Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#562Joining method and device produced by this method and joining unit
#563Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
#564Methods and apparatus for a stacked-die interposer
#565SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME
#566Bond pad for wafer and package for CMOS imager
#567HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS
#568Light emitting diode chip and manufacturing method thereof
#569Method For Low Temperature Bonding And Bonded Structure
#570Apparatus for thermal control of semiconductor chip assembly and underfill
#571Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#572COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF
#573Integrated circuit device and structure
#574Copper pillar bump with cobalt-containing sidewall protection
#575Under-bump metallization (UBM) structure and method of forming the same
#576Semiconductor device
#577Manufacturing of a device including a semiconductor chip
#578Semiconductor assembly and semiconductor package including a solder channel
#579Electronic component device, method of manufacturing the same and wiring substrate
#580ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER
#581Manufacturing method of semiconductor device
#582Metal wiring structures for uniform current density in C4 balls
#583Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad
#584Delamination resistant device package having raised bond surface and mold locking aperture
#585LED package
#586Multilayered printed circuit board and method for manufacturing the same
#587PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT
#588Semiconductor structure and method for making same
#589Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same
#590Circuit device having an improved heat dissipitation, and the method of manufacturing the same
#591Semiconductor package with integrated metal pillars and manufacturing methods thereof
#592Semiconductor module including a switch and non-central diode
#593Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
#594Methods and apparatus for measuring analytes using large scale FET arrays
#595Method of making a light emitting device having a molded encapsulant
#596Integrated circuit with intra-chip clock interface and methods for use therewith
#597Stacked chip assembly having vertical vias
#598Chip assembly having via interconnects joined by plating
#599SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME
#600LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS