212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#4802PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING A PRINTED CIRCUIT BOARD
#4803Structure and method for sealing cavity of micro-electro-mechanical device
#4804Methods and systems for packaging integrated circuits
#4805SEMICONDUCTOR DEVICE
#4806Semiconductor package
#4807INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF
#4808Semiconductor device and wire bonding method
#4809Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
#4810SEMICONDUCTOR DEVICE AND BACKSIDE ILLUMINATION SOLID-STATE IMAGING DEVICE
#4811Semiconductor device having finger electrodes
#4812Semiconductor device and method for manufacturing the same
#4813Electronic component-embedded printed circuit board
#4814ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SHEET
#4815Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method
#4816Method for manufacturing semiconductor apparatus
#4817Method for fabricating chip scale package structure with metal pads exposed from an encapsulant
#4818Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
#4819METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#4820Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die
#4821Method for bonding wafers to produce stacked integrated circuits
#4822Reconfigured wafer alignment
#4823DICING DIE-BONDING FILM
#4824Method Of Forming A Paste Pattern
#4825Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
#4826Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices
#4827Light emitting device package and method of fabricating the same
#4828FLMP buck converter with a molded capacitor and a method of the same
#4829Microelectronic assembly with impedance controlled wirebond and reference wirebond
#4830SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM
#4831Semiconductor device
#4832Microelectronic assembly with impedance controlled wirebond and conductive reference element
#4833Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure
#4834Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die
#4835Semiconductor constructions
#4836Microelectronic assemblies having compliancy and methods therefor
#4837Semiconductor device having a conductive bump
#4838Flip chip semiconductor package and fabrication method thereof
#4839Wire loop and method of forming the wire loop
#4840Reducing stress between a substrate and a projecting electrode on the substrate
#4841Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
#4842Semiconductor device
#4843Warp-suppressed semiconductor device
#4844Method for fabricating semiconductor components using maskless back side alignment to conductive vias
#4845Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure
#4846Semiconductor Carrier for Multi-Chip Packaging
#4847SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4848Semiconductor device
#4849Silicon Wafer Having Interconnection Metal
#4850Electrical interconnect forming method
#4851Electrical interconnect forming method
#4852BONDING METHOD AND BONDING DEVICE
#4853Conductive ball mounting apparatus and conductive ball mounting method
#4854Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same
#4855Electrical interconnect structure
#4856Method and apparatus for electronic component mounting
#4857Light emitting diode package and manufacturing method thereof
#4858Peeling sheet with adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloyloxyethyl) hydrogen phosphate
#4859Printed circuit board and method of manufacturing printed circuit board
#4860Stacked device assembly with integrated coil and method of forming same
#4861Semiconductor device
#4862Integrated circuit for driving semiconductor device and power converter
#4863Integrated circuit assemblies with alignment features and devices and methods related thereto
#4864Wire bond interconnection
#4865Integrated circuit packaging system with stacked die and method of manufacture thereof
#4866Chips having rear contacts connected by through vias to front contacts
#4867Three-dimensional system-in-package architecture
#4868MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#4869Semiconductor device
#4870System and method for stacked die embedded chip build-up
#4871Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#4872Stress buffering package for a semiconductor component
#4873Mounted body and method for manufacturing the same
#4874SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRCUIT BOARD AND SEMICONDUCTOR CHIP ARE CONNECTED BY LEADS
#4875SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#4876Lead and lead frame for power package
#4877Routable array metal integrated circuit package
#4878Integrated circuit packaging system with flex tape and method of manufacture thereof
#4879Leadless integrated circuit package having standoff contacts and die attach pad
#4880Leadless integrated circuit package having electrically routed contacts
#4881Leadless integrated circuit package having standoff contacts and die attach pad
#4882Electronic device including dies, a dielectric layer, and a encapsulating layer
#4883Stress barrier structures for semiconductor chips
#4884Semiconductor chip, transponder and method of manufacturing a transponder
#4885Semiconductor device having a junction FET and a MISFET for control
#4886WIRE SUPPLY DEVICE FOR A WIRE BONDER
#4887FIXTURE APPARATUS FOR LOW-TEMPERATURE AND LOW-PRESSURE SINTERING
#4888Micro-fluidic injection molded solder (IMS)
#4889WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#4890Method to build robust mechanical structures on substrate surfaces
#4891METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#4892Manufacturing method of semiconductor device
#4893Method of manufacturing ball grid array type semiconductor device
#4894Reversible leadless package and methods of making and using same
#4895Multi-surface IC packaging structures and methods for their manufacture
#4896Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#4897Electronic substrate, semiconductor device, and electronic device
#4898Semiconductor device having shifted stacked chips
#4899METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
#4900SEMICONDUCTOR DEVICE
#4901Electromigration-Resistant Flip-Chip Solder Joints
#4902Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom
#4903CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME
#4904SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
#4905WINDOW TYPE SEMICONDUCTOR PACKAGE
#4906Complete power management system implemented in a single surface mount package
#4907Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method
#4908Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#4909PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#4910Chip capacitive coupling
#4911MIM decoupling capacitors under a contact pad
#4912Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element
#4913Bonding tool and electronic component mounting apparatus and method
#4914Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
#4915DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS
#4916Semiconductor device and method of forming through vias with reflowed conductive material
#4917Integrated circuit micro-module
#4918Multilayer wiring board and method for manufacturing the same
#4919Electronics module comprising an embedded microcircuit
#4920Module having a stacked magnetic device and semiconductor device and method of forming the same
#4921Arrangement comprising an optoelectronic component
#4922Method for Manufacturing Imaging Device, Imaging Device and Portable Terminal
#4923Display apparatus
#4924Light source apparatus
#4925Light source apparatus
#4926Method of manufacturing a semiconductor device and a semiconductor device produced thereby
#4927Semiconductor device
#4928Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
#4929Wire bonding structure and method for forming same
#4930Semiconductor device and method of forming through vias with reflowed conductive material
#4931Semiconductor device and a method of manufacturing the same, and an electronic device
#4932Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#4933Through-silicon via formed with a post passivation interconnect structure
#4934Semiconductor device having wiring layers with power-supply plane and ground plane
#4935Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure
#4936Solder bump UBM structure
#4937Integrated circuit micro-module
#4938SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#4939Integrated circuit micro-module
#4940Integrated circuit micro-module
#4941Integrated circuit micro-module
#4942Integrated circuit micro-module
#4943SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4944Stack package
#4945Semiconductor package and manufacturing method thereof and encapsulating method thereof
#4946SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#4947Stacked semiconductor package having reduced height
#4948Systems and methods of tamper proof packaging of a semiconductor device
#4949MULTI-CHIP PACKAGE
#4950WIRE BOND CHIP PACKAGE
#4951Electronic device
#4952Reduced-crosstalk wirebonding in an optical communication system
#4953Bidirectional switch module
#4954Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same
#4955WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#4956Method for fabricating a bond
#4957Module having a stacked magnetic device and semiconductor device and method of forming the same
#4958Formation of solder bumps
#4959Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same
#4960Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same
#4961Multilayer wiring substrate and method for manufacturing the same
#4962Pad interface circuit and method of improving reliability of the pad interface circuit
#4963Wire bonding method and semiconductor device
#4964Semiconductor package with ribbon with metal layers
#4965Semiconductor component having a stack of semiconductor chips and method for producing the same
#4966Semiconductor device including conductive element
#4967SEMICONDUCTOR DEVICE
#4968Semiconductor module, method for manufacturing semiconductor module, and portable device
#4969CHIP PACKAGE STRUCTURE
#4970Semiconductor device and semiconductor device mounted structure
#4971Semiconductor device
#4972Package-on-package system with through vias and method of manufacture thereof
#4973Chip attach adhesive to facilitate embedded chip build up and related systems and methods
#4974Semiconductor device packages with electromagnetic interference shielding
#4975Manufacturing method of semiconductor device
#4976Semiconductor apparatus with decoupling capacitor
#4977Semiconductor device and wire bonding method
#4978Electronic Device and Method of Manufacturing Same
#4979Electronic component device, and method of manufacturing the same
#4980Wire bonding method, wire bonding apparatus, and wire bonding control program
#4981Wire bonding apparatus, record medium storing bonding control program, and bonding method
#4982Connection structure, power module and method of manufacturing the same
#4983Bump Structure With Multiple Layers And Method Of Manufacture
#4984Process for placing, securing and interconnecting electronic components
#4985Electronic component bonding method and apparatus using vibration energy
#4986Method of refining solder materials
#4987Semiconductor device and method of manufacturing semiconductor device
#4988Multi-component integrated circuit contacts
#4989Semiconductor package and method for manufacturing the same for decreasing number of processes
#4990Semiconductor package formed within an encapsulation
#4991Method of manufacturing a semiconductor package with fine pitch lead fingers
#4992Method of manufacturing semiconductor device, and wire bonder
#4993Method for manufacturing semiconductor
#4994Method for fabricating semiconductor packages with discrete components
#4995Chip assembly
#4996Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
#4997Gap capacitors for monitoring stress in solder balls in flip chip technology
#4998Electronic module with EMI protection
#4999Electric module having a conductive pattern layer
#5000Semiconductor device and method for manufacturing semiconductor device
#5001Bond pad support structure for semiconductor device
#5002Lock and key through-via method for wafer level 3D integration and structures produced
#5003Grain refinement by precipitate formation in PB-free alloys of tin
#5004Semiconductor device and a method of manufacturing the same
#5005Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process
#5006Semiconductor device and manufacturing method thereof
#5007Semiconductor device
#5008Power transistor package with integrated bus bar
#5009Method of manufacturing a semiconductor device
#5010Layered chip package with wiring on the side surfaces
#5011Semiconductor device and semiconductor memory device
#5012Semiconductor device and method of manufacturing the same, and electronic apparatus
#5013SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME
#5014Wirebonded semiconductor package
#5015THRU SILICON ENABLED DIE STACKING SCHEME
#5016Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
#5017Electronic-component-housing package and electronic device
#5018SUPER GTO-BASED POWER BLOCKS
#5019Anisotropic conductive adhesive
#5020Adhesive bonding method
#5021CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP
#5022Coaxial through chip connection
#5023Implantable microelectronic device and method of manufacture
#5024Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method
#5025Method of making semiconductor device packaged by sealing resin member
#5026Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same
#5027Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
#5028Power semiconductor devices having integrated inductor
#5029Integrated multicomponent device in a semiconducting die
#5030Electronic member, electronic part and manufacturing method therefor
#5031Semiconductor wafer coated with a filled, spin-coatable material
#5032Barrier structures and methods for through substrate vias
#5033WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO
#5034Structure of UBM and solder bumps and methods of fabrication
#5035Flip chip interconnection having narrow interconnection sites on the substrate
#5036Semiconductor module having semiconductor device mounted on device mounting substrate
#5037Reinforced structure for a stack of layers in a semiconductor component
#5038Semiconductor flip-chip system having oblong connectors and reduced trace pitches
#5039Thermally enhanced semiconductor package
#5040SEMICONDUCTOR MODULE
#5041Semiconductor device
#5042Integrated antennas in wafer level package
#5043Semiconductor device having a sealing body and partially exposed conductors
#5044Semiconductor device stack with bonding layer and wire retaining member
#5045Package-on-package using through-hole via die on saw streets
#5046MULTI-CHIP SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME
#5047SEMICONDUCTOR DEVICE
#5048Memory card and method for manufacturing memory card
#5049Semiconductor device and manufacturing method therefor
#5050Semiconductor chip package
#5051Semiconductor die package and method for making the same
#5052SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING
#5053Optical element package and method of manufacturing the same
#5054Method for the manufacture of an optoelectronic component and an optoelectronic component
#5055Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same
#5056Method for producing an electrical and mechanical connection and an assembly comprising such a connection
#5057Method of disposing an electronic device on an electrode formed on substrate
#5058THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#5059METHOD OF FORMING CONNECTION TERMINAL
#5060Electronic packages with fine particle wetting and non-wetting zones
#5061Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof
#5062Semiconductor device and production method therefor
#5063Method of manufacturing semiconductor device
#5064Method of manufacturing semiconductor device
#5065METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE
#5066Manufacturing method of semiconductor device
#5067Manufacturing method of light-emitting diode
#5068METAL BONDED NANOTUBE ARRAY
#5069Method for manufacturing an electronic module
#5070Power device and a method for controlling a power device
#5071Method and apparatus for manufacturing an electronic module, and electronic module
#5072SEMICONDUCTOR DEVICE
#5073Reduced bottom roughness of stress buffering element of a semiconductor component
#5074Underbump metallization structure
#5075Semiconductor package comprising alignment members
#5076Semiconductor device
#5077System and method for 3D integrated circuit stacking
#5078Semiconductor device and method of manufacturing the same
#5079Semiconductor device and method of manufacturing the same
#5080WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
#5081Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules
#5082Adhesive tape and semiconductor package using the same
#5083Process for packaging components, and packaged components
#5084Method for manufacturing a semiconductor component and structure therefor
#5085Semiconductor device and method for manufacturing semiconductor device
#5086INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
#5087Monolithic semiconductor switches and method for manufacturing
#5088Semiconductor device and production method therefor
#5089Lead pin for mounting semiconductor and printed wiring board
#5090Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer
#5091CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME
#5092Method for packing electric components on a substrate
#5093Method for producing a metal-ceramic substrate for electric circuits on modules
#5094FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION
#5095Micro-machined structure production using encapsulation
#5096Method to prevent corrosion of bond pad structure
#5097Method of manufacturing semiconductor device
#5098Resin sealing method of semiconductor device
#5099Metallized substrate and method for producing the same
#5100Semiconductor device including single circuit element for soldering