Electronic package structure and method

MULTI CHIP STACKING WITH RELIABLE JOINING

Method for bonding semiconductor wafers and method for manufacturing semiconductor device

SOLVENT SOFTENING TO ALLOW DIE PLACEMENT

Semiconductor device including a DC-DC converter having a metal plate

Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

Two-sided substrateless multichip module and method of manufacturing same

Semiconductor device

Interconnect System without Through-Holes

SEMICONDUCTOR DEVICE

Semiconductor module with edge termination and process for its fabrication

Wiring structure between steps and wiring method thereof

Integrated circuit module and method of packaging same

Through substrate vias for back-side interconnections on very thin semiconductor wafers

Electronic device and semiconductor device

Device including a semiconductor chip

Power semiconductor module

Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolation

Semiconductor device and package with bit cells and power supply electrodes

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES

Package structure

Semiconductor packages

Power semiconductor module with segmented base plate

Lead frame, method for manufacturing the same and semiconductor device

Chip package and manufacturing method thereof

Leadframe-based chip scale semiconductor packages

Semiconductor device and heat radiation member

Very extremely thin semiconductor package

Semiconductor package having isolated inner lead

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

3-D circuits with integrated passive devices

Trench MOSFET with trench source contact having copper wire bonding

Method of manufacturing a semiconductor device

Light emitting diode package and manufacturing method thereof

Semiconductor module including a switch and non-central diode

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Solder ball mounting method and apparatus

Conductive ball mounting apparatus

High temperature, stable SiC device interconnects and packages having low thermal resistance

Bond head for heavy wire bonder

WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SAME

Carbon nanotubes solder composite for high performance interconnect

Wire bond encapsulant control method

Method of manufacturing a semiconductor package using a carrier

ELECTRONIC PACKAGE STRUCTURE AND METHOD

Heat radiation material, electronic device and method of manufacturing electronic device

Printing semiconductor elements by shear-assisted elastomeric stamp transfer

Flexible and stackable semiconductor die packages having thin patterned conductive layers

Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus

Electronic package structure having conductive strip and method

Layout design method and semiconductor integrated circuit

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Base package system for integrated circuit package stacking and method of manufacture thereof

Double solid metal pad with reduced area

Semiconductor integrated circuit devices and display apparatus including the same

Semiconductor device with varying bump density regions and method of manufacturing the same

FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE

Semiconductor device and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package

Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same

Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display

Interconnect and method for mounting an electronic device to a substrate

THERMALLY CONTROLLED FLUIDIC SELF-ASSEMBLY

Integrated Alignment and Bonding System

Method for forming an isolated inner lead from a leadframe

SEMICONDUCTOR DEVICE

Passivation layer for a circuit device and method of manufacture

Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film

Method of manufacturing semiconductor device

Integrated circuit package and a method for dissipating heat in an integrated circuit package

Method of manufacturing semiconductor device

Method for reducing chip warpage

Method of fabricating quad flat non-leaded package

Method for manufacturing semiconductor device

Method and article of manufacture for wire bonding with staggered differential wire bond pairs

Method for manufacturing magnetic memory chip device

Spread spectrum isolator

ENHANCED TRACES OF FLEXIBLE TAB CIRCUIT FOR ATTACHMENT ON BOND PADS OF INKJET PRINTHEAD CHIP IN PRINTHEAD CARTRIDGE ASSEMBLY

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Semiconductor device and manufacturing method therefor

Method and apparatus for stacked die package with insulated wire bonds

TECHNIQUE FOR PACKAGING MULTIPLE INTEGRATED CIRCUITS

Semiconductor device having stacked multiple substrates and method for producing same

Protective layer for bond pads

Interconnection structure of electronic device having multilayer interconnections structure with electrically conductive layers

Top layers of metal for high performance IC's

Metal line in semiconductor device and method for forming the same

RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Structure and method for stacked wafer fabrication

Semiconductor device and a manufacturing method of the same

Chip package structure

Planar multi semiconductor chip package

Coil and semiconductor apparatus having the same

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Integrated circuit package

Semiconductor device

Bond pad array for complex IC

Microarray package with plated contact pedestals

Integrated circuit package system with encapsulation lock and method of manufacture thereof

Semiconductor body and method for the design of a semiconductor body with a connecting line

Semiconductor device

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Electrical microfilament to circuit interface

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Adhesive film, connecting method, and joined structure

Component with Mechanically Loadable Connecting Surface

Circuit manufacturing apparatus

Manufacturing method for semiconductor device embedded substrate

Manufacturing method for semiconductor device embedded substrate

Method for producing semiconductor chips using thin film technology

Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them

Plating method, semiconductor device fabrication method and circuit board fabrication method

Semiconductor device and a manufacturing method of the same

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Manufacturing method for semiconductor device embedded substrate

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

Electronic device package and method of manufacturing the same

Integrated circuit package formation

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Methods for securing semiconductor devices using elongated fasteners

Semiconductor memory device

Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure

FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING THE FILM AND SEMICONDUCTOR DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Inner-connecting structure of lead frame and its connecting method

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES

Method for manufacturing an electronic device

TCP-type semiconductor device and method of testing thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

Conductive paths for transmitting an electrical signal through an electrical connector

Semiconductor device in which a semiconductor chip is sealed

Stacked integrated circuit packages that include monolithic conductive vias

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

Semiconductor device including a reduced stress configuration for metal pillars

Chip structure and chip package structure

SEMICONDUCTOR DEVICE

Flip chip with interposer

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor packing having offset stack structure

Semiconductor memory device and semiconductor memory card

Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same

Semiconductor device including semiconductor chip mounted on lead frame

Semiconductor die package including lead with end portion

Pre-molded, clip-bonded multi-die semiconductor package

Chip package and manufacturing method thereof

SEMICONDUCTOR DEVICE HAVING INTEGRATED CIRCUIT WITH PADS COUPLED BY EXTERNAL CONNECTING COMPONENT AND METHOD FOR MODIFYING INTEGRATED CIRCUIT

Semiconductor device and manufacturing method thereof

OVER THE MOLD PHOSPHOR LENS FOR AN LED

POWER SEMICONDUCTOR MODULE

Semiconductor device

Closed loop wire bonding methods and bonding force calibration

Method of manufacturing a multilayer printed wiring board

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Connecting wire and method for manufacturing same

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Combined diode, lead assembly incorporating an expansion joint

Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques

Semiconductor package with passivation island for reducing stress on solder bumps

SEMICONDUCTOR DEVICE

METHOD OF PRODUCING SEMICONDUCTOR DEVICE PROVIDED WITH FLIP-CHIP MOUNTED SEMICONDUCTOR ELEMENT

Direct die attach utilizing heated bond head

Method for manufacturing a semiconductor device having a heat spreader

MICROELECRONIC ASSEMBLY AND METHOD FOR FORMING THE SAME

Single-layer component package

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT

Anisotropic conductive material, connected structure, and production method thereof

LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Electronic circuit for controlling a power field effect transistor

Semiconductor device and manufacturing method thereof

Hybrid Semiconductor Chip Package

Semiconductor device and method of forming double-sided through vias in saw streets

Semiconductor electronic component and semiconductor device using the same

Wafer level package using stud bump coated with solder

Semiconductor device and method of manufacturing the same

Semiconductor package and manufacturing method thereof

APPARATUS FOR USE IN SEMICONDUCTOR WAFER PROCESSING FOR LATERALLY DISPLACING INDIVIDUAL SEMICONDUCTOR DEVICES AWAY FROM ONE ANOTHER

POWER MODULE AND INVERTER FOR VEHICLES

SEMICONDUCTOR MULTI-CHIP PACKAGE

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD

Electronic component built-in substrate and method of manufacturing the same

Electronic component embedded printed circuit board and manufacturing method thereof

Electronic Device and Manufacturing Method for Electronic Device

APPLICATION OF A SELF-ASSEMBLED MONOLAYER AS AN OXIDE INHIBITOR

Manufacturing method for protection circuit module of secondary battery

Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers

DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

Solder joint flip chip interconnection having relief structure

Process for spontaneous deposition from an organic solution

Assembling stacked substrates that can form 3-D structures

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

Semiconductor package with a metal post

Semiconductor device and method of manufacturing the same

IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV

Stackable semiconductor assemblies and methods of manufacturing such assemblies

CLAMPING ASSEMBLY

Thermally improved semiconductor QFN/SON package

Semiconductor integrated circuit device

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

Semiconductor package with embedded spiral inductor

Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type

Self-assembly of components

Wire bonding method

Adhesive film, connecting method, and joined structure

ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS

Wiring board having heat intercepting member

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Dicing/die bonding film

Electronic device and method for fabricating the same

Bonding apparatus and bonding method

MICROPARTS AND APPARATUS FOR SELF-ASSEMBLY AND ALIGNMENT OF MICROPARTS THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND OPTICAL PICKUP MODULE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, OPTICAL PICKUP MODULE AND SEMICONDUCTOR DEVICE

PACKAGE, AND FABRICATION METHOD FOR THE PACKAGE

Pad structure of semiconductor integrated circuit apparatus

Semiconductor device

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

Semiconductor die package including multiple dies and a common node structure

Semiconductor device and method of manufacturing the same

Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module

Semiconductor device with improved resin configuration

Packaging systems and methods

Bond pad connection to redistribution lines having tapered profiles

Backside connection to TSVs having redistribution lines

Forming solder balls on substrates

Bonding apparatus and bonding method

METHOD AND APPARATUS FOR WAFER BONDING

Arrangement for hermetically sealing components, and method for the production thereof

Semiconductor power conversion apparatus and method of manufacturing the same

LITHOGRAPHIC CONTACT ELEMENTS

METHOD FOR PACKAGING SEMICONDUCTOR

Module having a stacked passive element and method of forming the same

Mounting method using dilatancy fluid

Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate

Flexible semiconductor package and method for fabricating the same

Semiconductor package having bump ball

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

Metallic bump structure without under bump metallurgy and manufacturing method thereof

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SAME

Die rearrangement package structure using layout process to form a compliant configuration

Dual or multiple row package

Semiconductor Chip Package System Vertical Interconnect

Multi-chip package

Module having a stacked passive element and method of forming the same

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

Capacitance element, printed circuit board, semiconductor package, and semiconductor circuit

Twin-chip-mounting type diode

Electronic circuit device

Transfer tape strap process

Multilayer circuit board and method for manufacturing the same

Double-sided connector with protrusions

Method for manufacturing semiconductor device having electrode for external connection

Thermosetting die-bonding film

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER

MEMORY MODULE

Circuit device and method of manufacturing the same

Adhesive tape and semiconductor device using the same

Method for forming three-dimensional structure, method for manufacturing semiconductor device, and semiconductor device

Electronic device and method of manufacturing same

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE

Window BGA semiconductor package

Method of forming a semiconductor package including two devices

Chip package structure and fabricating method thereof

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Low cost flexible substrate

Microelectronic package with carbon nanotubes interconnect and method of making same

System and method for pre-patterned embedded chip build-up

Semiconductor package having ink-jet type dam and method of manufacturing the same

Lead frame and method of manufacturing the same

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Device including two mounting surfaces

Semiconductor device

On-chip RF shields with front side redistribution lines

Packaging technology

Lock and key through-via method for wafer level 3 D integration and structures produced

Integrated circuit module with integrated passive device

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

SEMICONDUCTOR DEVICE

Wire bonding apparatus and ball forming method

Device and method for making a semiconductor device including bonding two bonding partners

Printed circuit board including electronic component embedded therein and method of manufacturing the same

ADHESIVE FOR ELECTRONIC COMPONENTS

Method of forming electrode connecting portion

Method of forming assymetrical encapsulant bead

METHOD OF REDUCING VOIDS IN ENCAPSULANT

METHOD OF REDUCING VOIDS IN ENCAPSULANT