212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
BONDING WIRE FOR SEMICONDUCTOR DEVICES
#2SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS
#3PACKAGE PROCESS AND PACKAGE STRUCTURE
#4SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#5MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME
#6OPTOELECTRONIC SYSTEM
#7PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME
#8MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND ASSOCIATED METHODS OF MANUFACTURING
#9STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
#10Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second Die
#11BONDING WIRE FOR SEMICONDUCTOR DEVICES
#12BONDING WIRE FOR SEMICONDUCTOR DEVICES
#13BONDING WIRE FOR SEMICONDUCTOR DEVICES
#14BONDING WIRE FOR SEMICONDUCTOR DEVICES
#15Bonding wire for semiconductor devices
#16SEMICONDUCTOR PACKAGES AND METHODS THEREOF
#17SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
#18SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS
#19SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES
#20Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features
#21SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP CHIP MANNER
#22Multi-chip package and method of providing die-to-die interconnects in same
#23CHIP-SCALE PACKAGE
#24SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
#25Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#26REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
#27Semiconductor device and a method of manufacturing the same
#28Semiconductor die contact structure and method
#29Connection structure and manufacturing method therefor
#30Semiconductor chip with redundant thru-silicon-vias
#31Impedance controlled electrical interconnection employing meta-materials
#32Copper alloy bonding wire for semiconductor devices
#33Multi-chip package and method of providing die-to-die interconnects in same
#34Universal Surface-Mount Semiconductor Package
#35Semiconductor device with sealed semiconductor chip
#36Semiconductor device having electrode pads arranged between groups of external electrodes
#37MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND ASSOCIATED METHODS OF MANUFACTURING
#38EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#39Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#40Semiconductor device with a semiconductor chip connected in a flip chip manner
#41EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#42Package process and package structure
#43Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#44Semiconductor memory device structure
#45PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME
#46Semiconductor device having through silicon vias and manufacturing method thereof
#47COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISING CURED PRODUCT THEREOF, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
#48DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#49SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#50PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#51Circuit board structure and method for manufacturing a circuit board structure
#52Semiconductor device and method for production of semiconductor device
#53Method for manufacturing an electronic module and electronic module
#54ELECTRONIC MODULE
#55Semiconductor device and method for manufacturing semiconductor device
#563D IC method and device
#57Semiconductor device and a method of manufacturing the same
#58Methods for attachment and devices produced using the methods
#593D IC method and device
#60Gallium arsenide radio frequency circuit and millimeter wave front-end module
#61THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING METAL
#62Thermocompression Bonding with Passivated Gold Contacting Metal
#63Thermocompression bonding with passivated copper-based contacting metal
#64Thermocompression Bonding with Passivated Tin-Based Contacting Metal
#65Thermocompression bonding with passivated nickel-based contacting metal
#66Thermocompression bonding using metastable gas atoms
#67Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die
#68Multi-chip package and method of providing die-to-die interconnects in same
#69Semiconductor components having conductive vias with aligned back side conductors
#70Semiconductor die contact structure and method
#71Semiconductor device with sealed semiconductor chip
#72Electronic module
#73Semiconductor device with a semiconductor chip connected in a flip chip manner
#74Semiconductor device and a method of manufacturing the same
#75Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame
#76Semiconductor memory device structure
#77Multi-chip package and method of providing die-to-die interconnects in same
#78Semiconductor device and a method of manufacturing the same
#79Alignment marks in substrate having through-substrate via (TSV)
#80COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
#81Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#82Method for fabricating a semiconductor and semiconductor package
#83Flip chip package utilizing trace bump trace interconnection
#84Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#85Semiconductor device having through silicon vias and manufacturing method thereof
#86Universal surface-mount semiconductor package
#87Embedded semiconductive chips in reconstituted wafers, and systems containing same
#88Semiconductor device having electrode pads arranged between groups of external electrodes
#89PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#90Semiconductor device and a method of manufacturing the same
#91Structures for bonding a group III-V device to a substrate by stacked conductive bumps
#92METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#93Semiconductor device and a method of manufacturing the same
#94INTEGRATED CIRCUIT CHIP PACKAGING
#95INTEGRATED CIRCUIT CHIP PACKAGING
#96Semiconductor device and method for production of semiconductor device
#97Semiconductor device with a semiconductor chip connected in a flip chip manner
#98Semiconductor device
#99Impedance controlled electrical interconnection employing meta-materials
#100Multi-chip package and method of providing die-to-die interconnects in same
#101Semiconductor device and method of manufacturing the same
#102Substrate with embedded stacked through-silicon via die
#103Method for fabricating a semiconductor and semiconductor package
#104Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#105Four D device process and structure
#106Structures for bonding a group III-V device to a substrate by stacked conductive bumps
#107Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#108Semiconductor device and method for manufacturing semiconductor device
#109Semiconductor device with island and associated leads
#110Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#111Method of manufacturing semiconductor device
#112Method of room temperature covalent bonding
#113METHOD OF ROOM TEMPERATURE COVALENT BONDING
#114Multilayer pillar for reduced stress interconnect and method of making same
#115Multilayer pillar for reduced stress interconnect and method of making same
#116Stacked semiconductor packages
#117Semiconductor memory device structure
#118Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#119Flip chip package utilizing trace bump trace interconnection
#120Semiconductor device with sealed semiconductor chip
#121Grid array connection device and method
#122Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side
#123Packaged semiconductor components having substantially rigid support members
#124SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#125Light emitting apparatus, illumination apparatus and display apparatus
#126Semiconductor device and method of manufacturing the same
#127Method of forming a semiconductor device having through silicon vias
#128Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#129Method of manufacturing a semiconductor device
#130Designs and methods for conductive bumps
#131Semiconductor device and a method of manufacturing the same
#132Multilayer pillar for reduced stress interconnect and method of making same
#133Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#1343D IC method and device
#135Semiconductor memory device
#136Pnictide buffer structures and devices for GaN base applications
#137Alignment marks in substrate having through-substrate via (TSV)
#138Semiconductor die contact structure and method
#139ROOM TEMPERATURE METAL DIRECT BONDING
#140Semiconductor device and a method of manufacturing the same
#141Recessed and embedded die coreless package
#142Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#143Radar module with wafer level package and underfill
#144MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#145Semiconductor device having electrode pads arranged between groups of external electrodes
#146Semiconductor device
#147Semiconductor device
#148Methods of fluxless micro-piercing of solder balls, and resulting devices
#149Semiconductor device including a buffer layer structure for reducing stress
#150Electronic module
#151SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
#152Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#153Electronic module with EMI protection
#154Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#155Methods and apparatus for measuring analytes using large scale FET arrays
#156Method of fabricating a semiconductor package
#157Universal surface-mount semiconductor package
#158Semiconductor device
#159Implantable electrode array assembly including a carrier with packaged control modules
#160Microelectronic elements with post-assembly planarization
#161Grid array connection device and method
#1623-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
#163Stackable electronic package and method of fabricating same
#164Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#165Semiconductor device and method for production of semiconductor device
#166Semiconductor device and a method of manufacturing the same
#167Packaged semiconductor assemblies and methods for manufacturing such assemblies
#168Chip package
#169Solder in cavity interconnection structures
#170Multi-chip package and method of providing die-to-die interconnects in same
#171Manufacturing method of semiconductor device
#172Semiconductor device with island and associated leads
#173Bonding wire for semiconductor device
#174Thermocompression Bonding with Passivated Nickel-Based Contacting Metal
#175Thermocompression Bonding with Passivated Silver-Based Contacting Metal
#176Thermocompression Bonding with Passivated Gold Contacting Metal
#177Thermocompression Bonding with Passivated Copper-Based Contacting Metal
#178Thermocompression Bonding with Passivated Indium-Based Contacting Metal
#179Thermocompression Bonding Using Metastable Gas Atoms
#180System for Low-Force Thermocompression Bonding
#181Bonding wire for semiconductor device
#182Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#183Light emitting device and method for manufacturing light emitting device
#184Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#185Bonding wire for semiconductor device
#186Semiconductor device and method for manufacturing the same
#187Lead and lead frame for power package
#188SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#189Power module and fabrication method for the same
#190Semiconductor device including a buffer layer structure for reducing stress
#191SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
#192Semiconductor device with a semiconductor chip connected in a flip chip manner
#193Semiconductor device and method of manufacturing the same
#194BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC DEVICES
#195Method of manufacturing a semiconductor device
#196Integrated electronic device with transceiving antenna and magnetic interconnection
#197Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#198Semiconductor device
#199Tooling for coupling multiple electronic chips
#200Embedded semiconductive chips in reconstituted wafers, and systems containing same
#201Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#202Semiconductor device and a method of manufacturing the same
#203FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#204RECESSED AND EMBEDDED DIE CORELESS PACKAGE
#205SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#206RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDUCTOR WAFERS
#207Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
#208Semiconductor device
#209Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#210Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#211Electronic part embedded substrate and method of producing an electronic part embedded substrate
#212Rare earth pnictides for strain management
#213Bonding structure and method
#214Semiconductor device and a method of manufacturing the same
#215OPTOELECTRONIC SYSTEM
#216SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#217Stacked semiconductor devices
#2183D IC method and device
#219Semiconductor device having an inductor
#220Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#221Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#222Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#223Cu column, Cu core column, solder joint, and through-silicon via
#224Semiconductor device and method for production of semiconductor device
#225Package process and package structure
#226Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#227Dual lead frame semiconductor package and method of manufacture
#228Semiconductor device and semiconductor device mounting structure having conductor plates
#229Multi-chip package and manufacturing method
#230Semiconductor device and a method of manufacturing the same
#231CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME
#232Semiconductor device having electrode pads arranged between groups of external electrodes
#233Microelectronic elements with post-assembly planarization
#234Semiconductor package having multi-phase power inverter with internal temperature sensor
#235Integrated circuit chip packaging
#236Integrated circuit chip packaging including a heat sink topped cavity
#237Light emitting apparatus, illumination apparatus and display apparatus
#238Inter-chip alignment
#239Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#240Bonding wire for semiconductor device
#241Bonding wire for semiconductor device
#242Multilayer pillar for reduced stress interconnect and method of making same
#243Three dimensional device integration method and integrated device
#244Semiconductor light-emitting device, method for producing same, and display device
#245Semiconductor device
#246Semiconductor device and method for manufacturing semiconductor device
#247Semiconductor package including a device and lead frame used for the same
#248Semiconductor device and method of making a semiconductor device
#249Multilayer pillar for reduced stress interconnect and method of making same
#250Semiconductor package having a trench penetrating a main body
#251Recessed and embedded die coreless package
#252Semiconductor die contact structure and method
#253Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#254Semiconductor device and a method of manufacturing the same
#255Semiconductor device and production method therefor
#256Designs and methods for conductive bumps
#257Cu pillar bump with L-shaped non-metal sidewall protection structure
#258Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#259Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#260Semiconductor device including semiconductor chip, wiring, conductive material, and contact part
#261Circuit board structure and method for manufacturing a circuit board structure
#262Semiconductor device
#263Semiconductor device having through silicon vias and manufacturing method thereof
#264Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#265Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#266Resin-encapsulated semiconductor device and its manufacturing method
#267Semiconductor device and a method of manufacturing the same
#268Semiconductor device
#269Semiconductor device with trench-like feed-throughs
#270Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#271Semiconductor device
#272Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
#273Optoelectronic component and method of producing an optoelectronic component
#274Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#275Wafer backside interconnect structure connected to TSVs
#276Semiconductor device and a method of manufacturing the same
#277Semiconductor integrated circuit device
#278Apparatus, system, and method for wireless connection in integrated circuit packages
#279Semiconductor chip with redundant thru-silicon-vias
#280Grid array connection device and method
#281Light-emitting apparatus
#282Apparatus for stacked semiconductor packages and methods of fabricating the same
#283Electronic part embedded substrate and method of producing an electronic part embedded substrate
#284Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#285Semiconductor device
#286High efficiency module
#287Semiconductor device
#288Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#289Rigid-flex electronic module
#290Power semiconductor device and method therefor
#291Fixture to constrain laminate and method of assembly
#292Methods and apparatus for measuring analytes using large scale FET arrays
#293Method for low temperature bonding and bonded structure
#294Tooling for coupling multiple electronic chips
#295Semiconductor device and method for manufacturing the same
#296Semiconductor device
#297Semiconductor package
#298Semiconductor device
#299Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#300Semiconductor package with conductive clip