212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Semiconductor device including a protective film
#302Chip package and method for fabricating the same
#303Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#304Semiconductor device and a method of manufacturing the same
#305Semiconductor device having electrode pads arranged between groups of external electrodes
#306Electronic device and method for production
#307Semiconductor device and a method of manufacturing the same
#308Bumpless build-up layer package with pre-stacked microelectronic devices
#309Semiconductor package and mobile device using the same
#310Semiconductor device
#311Semiconductor device having semiconductor chip affixed to substrate via insulating resin adhesive film
#312Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#313Semiconductor device for preventing crack in pad region and fabricating method thereof
#314SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
#315Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#316Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#317Integrated antennas in wafer level package
#318Singulation method for semiconductor package with plating on side of connectors
#319Package carrier, semiconductor package, and process for fabricating same
#320Circuit module and method of manufacturing the same
#321Leadless chip carrier having improved mountability
#322Method of producing a semiconductor package
#323Embedded semiconductive chips in reconstituted wafers, and systems containing same
#324Semiconductor device and method of manufacturing same
#325Three dimensional device integration method and integrated device
#326Laser assisted transfer welding process
#327Semiconductor device and method for manufacturing semiconductor device
#328Semiconductor device and production method therefor
#329Bonding method using bonding material
#330Semiconductor device, method for manufacturing the same, and electronic device
#331Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#332Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#333Resin-encapsulated semiconductor device and its manufacturing method
#334Semiconductor package and method of forming the same
#335Method of filling probe indentations in contact pads
#336Method of manufacturing a semiconductor device
#337Method of producing an interposer with microspring contacts
#338Semiconductor device and method for production of semiconductor device
#339Method of making a semiconductor device having a functional capping
#340Semiconductor package
#341Fabrication method of embedded chip substrate
#342Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#343Methods of forming 3-D circuits with integrated passive devices
#344Semiconductor die mount by conformal die coating
#345Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#346LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#347Bonding material and bonding method using the same
#348Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#349Semiconductor light-emitting device, method for producing same, and display device
#350Stackable molded microelectronic packages with area array unit connectors
#351Method for low temperature bonding and bonded structure
#352Semiconductor device and a method of manufacturing the same
#353Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#354Room temperature metal direct bonding
#355Pressure application apparatus and pressure application method
#356Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#357Semiconductor device and a method of manufacturing the same
#358Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#359Semiconductor device and a method of manufacturing the same
#360Template and pattern forming method
#361High efficiency module
#362Method of manufacturing semiconductor device
#363Semiconductor package
#364Method for fabricating electronic device package
#365Thin plastic leadless package with exposed metal die paddle
#366Light emitting device and method for manufacturing light emitting device
#367Stacked packaging improvements
#368Bump pad structure
#369Electronic component with a leadframe
#370Method for forming package systems having interposers
#371Electronic component mounting apparatus and method
#372Light emitting device and method for manufacturing same
#373Memory device structure
#374Semiconductor device and lead frame used for the same
#375Selective die electrical insulation by additive process
#376Adhesive composition, adhesive sheet and production process for semiconductor device
#377Light-emitting apparatus
#378Substrate interconnections having different sizes
#379Semiconductor devices with recessed interconnects
#380Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
#381Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#382Four D device process and structure
#383Packaging structural member
#384Semiconductor device having low on resistance
#385Semiconductor device including a protective film
#386Method of forming an integrated circuit device including a pillar capped by barrier layer
#387Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#388Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#389Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program
#390Semiconductor device
#391Semiconductor device and a method of manufacturing the same
#392Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#393Recessed and embedded die coreless package
#394Three-dimensional semiconductor architecture
#395Apparatus for fluid guided self-assembly of microcomponents
#396Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#397Apparatus and methods for high-density chip connectivity
#398Semiconductor device and method for manufacturing the same
#399Circuit module and method of manufacturing the same
#400Semiconductor device with a semiconductor chip connected in a flip chip manner
#401Package systems
#402Microelectronic packages having cavities for receiving microelectronic elements
#403Power semiconductor package
#4043D IC method and device
#405Semiconductor component with a monocrystalline semiconductor region arranged in a via region
#406Off-chip vias in stacked chips
#407Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#408LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#409Method of making a stacked microelectronic package
#410Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#411Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
#412Semiconductor device
#413Method of forming wafer-level molded structure for package assembly
#414Semiconductor chip having different conductive pad widths and method of making layout for same
#415Semiconductor device having low dielectric insulating film and manufacturing method of the same
#416Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
#417Method of manufacturing a carrier tape
#418Semiconductor device and method of forming bump-on-lead interconnection
#419Semiconductor device and method for manufacturing semiconductor device
#420Method for low temperature bonding and bonded structure
#421Integrated circuit package and method of forming the same
#422Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#423Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#424Multiple die layout for facilitating the combining of an individual die into a single die
#425Integrated electronic device with transceiving antenna and magnetic interconnection
#426Module comprising a semiconductor chip
#427Manufacture of a circuit board and circuit board containing a component
#428Semiconductor device with output circuit and pad arrangements
#429Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#430Three dimensional device integration method and integrated device
#431Method of fabricating package structure
#432Semiconductor device including a buffer layer structure for reducing stress
#433Integrated circuit chip and fabrication method
#434Power semiconductor package with a common conductive clip
#435Semiconductor device
#436Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#437Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#438Power semiconductor package with conductive clips
#439Semiconductor device structure and manufacturing method
#440Electronic device including soldered surface-mount component
#441Package structure and manufacturing method
#442Semiconductor device
#443Semiconductor package with conductive clip
#444Power semiconductor package with conductive clip and related method
#445Semiconductor device and method of manufacturing same
#446Light emitting apparatus, illumination apparatus and display apparatus
#447Microelectronic elements with post-assembly planarization
#448Mixed alloy solder paste
#449Microelectronic packages with nanoparticle joining
#450RFID tags and processes for producing RFID tags
#451Solder paste, joining method using the same and joined structure
#452Semiconductor device and a method of manufacturing the same
#453Semiconductor device
#454Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
#455Semiconductor device
#456Semiconductor device
#457Bonded processed semiconductor structures and carriers
#458Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
#459Mixed alloy solder paste
#460Impedance controlled electrical interconnection employing meta-materials
#461Package assembly having a semiconductor substrate
#462Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#463System and method for 3D integrated circuit stacking
#464Semiconductor device with through silicon via and alignment mark
#465Semiconductor device
#466Semiconductor device
#467Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
#468Semiconductor package
#469Method of fabricating bump structure and bump structure
#470Method of fabricating a bond pad structure
#471Wireless communication system
#472Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#473Optoelectronic system
#474Solder in cavity interconnection structures
#475Apparatus, system, and method for wireless connection in integrated circuit packages
#476Semiconductor device
#477Grid array connection device and method
#478Forming functionalized carrier structures with coreless packages
#479Molding method for COB-EUSB devices and metal housing package
#480Formation of alpha particle shields in chip packaging
#481Electronic module with EMI protection
#482Method for manufacturing an electronic module and an electronic module
#483Laser ashing of polyimide for semiconductor manufacturing
#484Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
#485Semiconductor device and a method of manufacturing the same
#486Semiconductor device and semiconductor device mounting structure
#487Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#488Semiconductor device with sealed semiconductor chip
#489Three-dimensional integrated circuit device fabrication including wafer scale membrane
#490Embedded semiconductive chips in reconstituted wafers, and systems containing same
#491Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
#492Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#493Method of producing a transponder and a transponder
#494Wafer level semiconductor package and manufacturing methods thereof
#495Stacked microelectronic devices
#496Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#497Electrochemical deposition method
#498Semiconductor die contact structure and method
#499Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#500Semiconductor element
#501Semiconductor device and method of manufacturing semiconductor device
#502Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#503Ball grid array semiconductor package and method of manufacturing the same
#504Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#505Semiconductor device and method for manufacturing the same
#506Alignment marks in substrate having through-substrate via (TSV)
#507Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#508Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#509Manufacturing method of forming an etch-back type semiconductor package with locking anchorages
#510Semiconductor device and manufacturing method thereof
#511Stacked packaging improvements
#512Semiconductor device for battery power voltage control
#513Semiconductor device and method of manufacturing
#514Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#515Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#516Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#517High efficiency module
#518Vertical LED chip package on TSV carrier
#519Printed wiring board and method for manufacturing the same
#520Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#521Multiple access over proximity communication
#522Light-reflective anisotropic conductive adhesive agent, and light emitting device
#523Method of room temperature covalent bonding
#524ESD protection device
#525Method of forming a memory device
#526Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#527Semiconductor packages and methods of packaging semiconductor devices
#528Substrateless power device packages
#529Semiconductor device and method of forming pad layout for flipchip semiconductor die
#530Multilayer pillar for reduced stress interconnect and method of making same
#531Semiconductor package with embedded die and its methods of fabrication
#532Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#533Method for manufacturing a fan-out WLP with package
#534Method for fabricating multi-chip stack structure
#535Electronic module
#536Structures and methods for improving solder bump connections in semiconductor devices
#537Semiconductor device sealed in a resin section and method for manufacturing the same
#538Pad configurations for an electronic package assembly
#539Wafer scale package for high power devices
#540Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation
#541Bump pad structure
#542Multi-function and shielded 3D interconnects
#543Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#544Semiconductor device
#545Semiconductor device and method of forming thermal lid for balancing warpage and thermal management
#546Heat-transfer structure
#547III-Nitride device with solderable front metal
#548Method of forming package systems having interposers
#549Semiconductor device having low dielectric insulating film and manufacturing method of the same
#550Methods of fluxless micro-piercing of solder balls, and resulting devices
#551Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#552Semiconductor packages and electronic systems including the same
#553Semiconductor device and method of manufacturing same
#554Semiconductor device and a method of manufacturing the same
#555Electronic devices with yielding substrates
#556Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#557Apparatus for thermal melting process and method of thermal melting process
#558Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
#559Leadless semiconductor package and method of manufacture
#560Method of forming an integrated inductor by dry etching and metal filling
#561Semiconductor device having an inductor
#562Semiconductor device and method for fabricating the same
#563Dual lead frame semiconductor package and method of manufacture
#564Room temperature metal direct bonding
#565Warp compensated electronic assemblies
#566Forming in-situ micro-feature structures with coreless packages
#567Method of making a pillar structure having a non-metal sidewall protection structure
#568Pillar bumps and process for making same
#569Semiconductor device and method for manufacturing the same
#570Semiconductor device including cooler
#571Semiconductor device and radio communication device
#572Light-emitting apparatus
#573Semiconductor device
#574Recessed and embedded die coreless package
#575Moisture barrier for a wire bond
#576Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#577Semiconductor device
#578Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#579Semiconductor package with single sided substrate design and manufacturing methods thereof
#580Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier
#581Wireless communication system
#582Apparatus and method for embedding components in small-form-factor, system-on-packages
#583Copper pillar bump with cobalt-containing sidewall protection layer
#584Compliant interconnects in wafers
#585Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices
#586Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#587Semiconductor device and method of forming insulating layer around semiconductor die
#588Method of making a conductive pillar bump with non-metal sidewall protection structure
#589Bonding structure and method
#590Method and apparatus for semiconductor device fabrication using a reconstituted wafer
#591Chip package and manufacturing method thereof
#592Methods of forming 3-D circuits with integrated passive devices
#593Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
#594Semiconductor device
#595Resin-encapsulated semiconductor device and its manufacturing method
#596Dual lead frame semiconductor package and method of manufacture
#597Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#598Forming semiconductor chip connections
#599Semiconductor device including DC-DC converter
#600Semiconductor device