212065 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Cerium [Ce]
Method for low loop wire bonding
#602Semiconductor device in which semiconductor chip is mounted on lead frame
#603Method for making an anisotropic conductive film pointed conductive inserts
#604High power Doherty amplifier
#605NANO IC packaging
#606Power semiconductor arrangement
#607Extension of fatigue life for C4 solder ball to chip connection
#608Method for maintaining solder thickness in flipchip attach packaging processes
#609Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
#610Split-gate power module for suppressing oscillation therein
#611Top finger having a groove and semiconductor device having the same
#612Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#613Semiconductor device and method of manufacturing the same
#614Method of microelectrode connection and connected structure of use threof
#615Method of manufacturing substrate joint body, substrate joint body and electrooptical device
#616Light emitting device
#617Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#618Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#619Semiconductor device and a memory system including a plurality of IC chips in a common package
#620Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#621Semiconductor copper bond pad surface protection
#622Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#623Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#624Semiconductor integrated circuit device
#625Semiconductor memory device and defect remedying method thereof
#626Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#627Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#628Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#629Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#630Method for making a micromechanical device by using a sacrificial substrate
#631Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#632Semiconductor device having radiation structure
#633Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
#634Device transferring method
#635Device transferring method
#636Device transferring method
#637Device transferring method, and device arraying method and image display unit fabricating method using the same
#638Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates
#639Methods of providing solder structures for out plane connections
#640Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method
#641Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
#642Method for anodic bonding of wafers and device
#643Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
#644Diode housing
#645Power amplifier device
#646Structure and method of making capped chips having vertical interconnects
#647Stacked semiconductor device including improved lead frame arrangement
#648Back-face and edge interconnects for lidded package
#649Structure and method of making capped chips using sacrificial layer
#650Output circuit for a semiconductor amplifier element
#651Structure and self-locating method of making capped chips
#652Structure and method of making sealed capped chips
#653Gold bonding wires for semiconductor devices and method of producing the wires
#654Method of using pre-applied underfill encapsulant
#655Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
#656Circuit carrier and production thereof
#657Resin composition for encapsulating semiconductor device
#658Designs and methods for conductive bumps
#659Electronic package having a folded flexible substrate and method of manufacturing the same
#660Bonding pad design for impedance matching improvement
#661Microbeam assembly and associated method for integrated circuit interconnection to substrates
#662Wirebonding insulated wire and capillary therefor
#663Process for making contact with and housing integrated circuits
#664Semiconductor integrated circuit device
#665Semiconductor integrated circuit device
#666Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads
#667Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces
#668Fabrication method of semiconductor device
#669Method for creating adhesion during fabrication of electronic devices
#670Semiconductor integrated circuit device
#671Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
#672Methods and devices for providing bias to a monolithic microwave integrated circuit
#673Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it
#674Module for high voltage power for converting a base of IGBT components
#675Enhanced die-down ball grid array and method for making the same
#676Arrangement comprising a capacitor