Electrical component and film composite laminated on the component and method for production

Processes for forming photovoltaic devices

Printed circuit board

Semiconductor device, production method for the same, and substrate

Adhesive for connection of circuit member and semiconductor device using the same

Light-emitting diode arrangement and method for producing the same

Production method of semiconductor device and bonding film

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

Carbon nanotube-based horizontal interconnect architecture

Method for producing an array for detecting electromagnetic radiation, especially infrared radiation

Conductive bump, method for producing the same, and electronic component mounted structure

INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANES AND ITS METHOD OF PRODUCTION

Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS

ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME

Rotary chip attach process

Multilayer printed wiring board

Process for the vertical interconnection of 3D electronic modules by vias

Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots

Method and device for fabricating an assembly of at least two microelectronic chips

Semiconductor light-emitting device, light-emitting module and lighting unit

Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure

Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport

Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip

Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module

Module with Flat Construction and Method for Placing Components

Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same

ELECTRICAL BONDING PAD

Semiconductor memory device

Method for manufacturing metal chips by plasma from a layer comprising several elements

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

Wiring substrate and display device including the same

Semiconductor device

Method for soldering two elements together using a solder material

Method for fabricating electrical bonding pads on a wafer

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANFACTURING SAME, AND MICROELECTRONIC STRUCTURE CONTAINING SAME

Stacked semiconductor device and method of forming serial path thereof

Optoelectronic component with a wireless contacting

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Gold wire for semiconductor element connection

Semiconductor device comprising a housing containing a triggering unit

Multilayer printed wiring board

Shielding Apparatus and Manufacturing Method Thereof

Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor

Integrated-circuit package for proximity communication

Method for producing a matrix of individual electronic components and matrix produced thereby

Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit

Semiconductor device with inductor

Flip-chip component production method

Printed wiring board

Method of producing a contactless microelectronic device, such as for an electronic passport

ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADHESIVE FILM, WIRING CIRCUIT LAMINATED WITH ADHESIVE FILM, AND SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Semiconductor element and semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME

Arrangement of stacked integrated circuit dice having a direct electrical connection

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus

METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL

Method for making contact with a contact surface on a substrate

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Method for stacking serially-connected integrated circuits and multi-chip device made from same

Method for connecting an electronic chip to a radiofrequency identification device

Method and apparatus for placing conductive balls

3D electronic module

Reactive solder material

Semiconductor module manufacturing method, semiconductor module, and mobile device

Systems and methods for post-circuitization assembly

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Etch method

Methods of packaging a semiconductor die and package formed by the methods

Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer

Non-leaded semiconductor package and a method to assemble the same

SEMICONDUCTOR DEVICE

Semiconductor Device with Improved Contact Pad and Method for Fabrication Thereof

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Heat cycle-able connection

Joining method and device produced by this method and joining unit

Flux for soldering and soldering process

AG-BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE

Method of making semiconductor package with plated connection

Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments

Wire-bonded semiconductor component with reinforced inner connection metallization

Semiconductor package

Semiconductor device including mounting board with stitches and first and second semiconductor chips

Substrate with feedthrough and method for producing the same

Designs and methods for conductive bumps

Carbon nanotube bond pad structure and method therefor

Semiconductor memory device and defect remedying method thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Fabrication of Electronic Components In Plastic

Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points

Method of room temperature covalent bonding

Adhesive Film and Method for Manufacturing Semiconductor Device Using Same

Imaging device equipped with a last copper and aluminum based interconnection level

Semiconductor integrated circuit device including wiring lines and interconnections

Diode housing

Printed circuit board

Memory device

Process for making contact with and housing integrated circuits

Printed wiring board

Electric component having microtips and ductile conducting bumps

Adhesive film composition, associated dicing die bonding film, and die package

Printed circuit board

Circuit device with at least partial packaging and method for forming

Printed circuit board

Liquid metal thermal interface material system

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Silica nanoparticles thermoset resin compositions

Semiconductor device and method for manufacturing same

Method of sealing or welding two elements to one another

Gold wire for connecting semiconductor chip

Power semiconductor module

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Electronics module and method for manufacturing the same

Metallised film for sheet contacting

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Light emitting device

Nanoscopic Assurance Coating for Lead-Free Solders

Wire Bump Material

Copper alloy bonding wire for semiconductor device

COMPOSITIONS FOR USE IN ELECTRONICS DEVICES

Au Alloy Bonding Wire

LED with phosphor tile and overmolded phosphor in lens

Electronic module

Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film

Semiconductor integrated circuit device

Structure and method of making sealed capped chips

Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle

Semiconductor integrated circuit device

Semiconductor device, electro-optical device, and method for manufacturing semiconductor device

Sheet Peeling Apparatus and Peeling Method

Thermally conductive composite and uses for microelectronic packaging

Secure electronic entity such as a passport

System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System

Au bonding wire for semiconductor device

Assembly and method of assembling by soldering an object and a support

Au-Ag based alloy wire for semiconductor package

Semiconductor device and method for manufacturing the same

Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)

Flip chip MLP with folded heat sink

Method for forming a semiconductor on insulator structure

Semiconductor light emitting device and a method for producing the same

Printed circuit board

Polymer matrices for polymer solder hybrid materials

Method for Electroplating and Contact Projection Arrangement

Semiconductor memory device and defect remedying method thereof

Solder joint flip chip interconnection having relief structure

Alternative flip chip in leaded molded package design and method for manufacture

Method for bonding a semiconductor substrate to a metal substrate

Wire bonding capillary tool having multiple outer steps

Methods and materials useful for chip stacking, chip and wafer bonding

Integrated-circuit chip with offset external pads and method for fabricating such a chip

Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Semiconductor integrated circuit device

Device having a contacting structure

Power semiconductor arrangement

Cap layer for an aluminum copper bond pad

Method of fabrication on high coplanarity of copper pillar for flip chip packaging application

Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Semiconductor device having an antenna with anisotropic conductive adhesive

Warpage-reducing packaging design

Electrical component on a substrate and method for production thereof

Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Semiconductor memory card

Microelectronic interconnect device comprising localised conductive pins

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Adhesion method using gray-scale photolithography

Arrangement and method impedance matching

Electronic micromodule and method for manufacturing the same

Semiconductor device with semiconductor device components embedded in a plastic housing composition

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

Sensor component and panel used for the production thereof

Liquid metal thermal interface material system

Semiconductor device with a wiring substrate and method for producing the same

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Leadless semiconductor package and method of manufacture

Protection for an integrated circuit chip containing confidential data

Rotary chip attach

Stackable semiconductor package and method for its fabrication

Method and device for connecting chips

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit

Semiconductor device and method for producing it, and use of an electrospinning method

Semiconductor device having several assembled integrated-circuit chips and method of assembling and electrically connecting the integrated-circuit chips

Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed

Solder joint flip chip interconnection

Multi-stack chip package with wired bonded chips

Method for producing through-contacts and a semiconductor component with through-contacts

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Contact pad structure for flip chip semiconductor die

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

Method for mounting electronic component

Production process for manufacturing such semiconductor package

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Intermetallic solder with low melting point

Method and device for extracting an electronic chip from a silicon wafer and transporting the chip to its installation location on an electronic device

Power semiconductor module

Solder joint intermetallic compounds with improved ductility and toughness

Electronic device and method of manufacturing same

Nitride-based semiconductor light-emitting device and method of manufacturing the same

Device transferring method, and device arraying method

Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature

Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method

Manufacturing method of semiconductor device

Diode housing

Forming of conductive bumps for an integrated circuit

Packaged integrated circuits and methods of producing thereof

Semiconductor device with semiconductor device components embedded in a plastics composition

Thermal interface material with carbon nanotubes and particles

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method of soldering or brazing articles having surfaces that are difficult to bond

Method for connecting a semiconductor chip onto an interconnection support

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Method of making an electronic device using an electrically conductive polymer, and associated products

Circuit arrangement placed on a substrate and method for producing the same

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Semiconductor device

NANO IC

Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material

Packaging structure and method

Semiconductor device with sealed semiconductor chip

Method for making a flat-top pad

Method of manufacturing a device having a contacting structure

Methods for providing bias to a monolithic microwave integrated circuit

Multilayer printed wiring board

Multilayer printed wiring board

Device packages having a III-nitride based power semiconductor device

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Method for manufacturing an electronic module

Method of room temperature covalent bonding

Circuit board and the manufacturing method

Method of making a flexible substrate containing self-assembling microstructures

Nano memory, light, energy, antenna and strand-based systems and methods

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Anisotropic conductive adhesive, electrode connection structure and method using the adhesive

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Encapsulation of circuit components to reduce thermal cycling stress

Semiconductor package with plated connection

High-density inter-die interconnect structure

Method for producing an anisotropic conductive film on a substrate

Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

NANO IC packaging

Layered microelectronic contact and method for fabricating same

Solder structures for out of plane connections

Diode housing

Connection ball positioning method and device for integrated circuits

Method for constructing contact formations

Package for a high-frequency electronic device

Method for re-routing lithography-free microelectronic devices

Protection of an integrated capacitor

Electronic component and a panel

Forming of high aspect ratio conductive structure using injection molded solder

Semiconductor memory device and defect remedying method thereof

Liquid metal thermal interface material system

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

Electronic component comprising external surface contacts and a method for producing the same

Wiring board and method for producing same

Bond pad structure with stress-buffering layer capping interconnection metal layer

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Method and apparatus for placing conductive balls

Circuit carrier and production thereof

Wire feed system for a wire bonding apparatus

Chip module

Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device

Electronic component with multilayered rewiring plate and method for producing the same

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Substrate for producing semiconductor packages

Electronic component embedded substrate and method for manufacturing the same

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Substrate for mounting IC chip

Circuit device with at least partial packaging and method for forming

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

Electronic package having a folded flexible substrate and method of manufacturing the same

Method for manufacturing surface acoustic wave device

Sensor equipment having sensing portion and method for manufacturing the same

Multiple device package

Printed wiring board

Method of making photolithographically-patterned out-of-plane coil structures

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Semiconductor device

Method of bumping die pads for wafer testing

Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating

Compositions for use in electronics devices

Single row bond pad arrangement