Approach to high temperature wafer processing

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer

Underbump metallurgy for enhanced electromigration resistance

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method for manufacturing same

Electronic system modules and method of fabrication

IC TAG AND MANUFACTURING METHOD OF THE SAME

Structure for reduction of soft error rates in integrated circuits

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

Method of manufacturing semiconductor device and semiconductor device

Device interconnects

Method for manufacturing a multilayer printed wiring board for providing an electronic component therein

Method for mounting semiconductor device

Method of manufacturing wiring substrate

Method of forming an interconnect on a semiconductor substrate

Method for manufacturing microelectronic devices

Component built-in wiring board

Sheet structure and method of manufacturing sheet structure

Wire bonding over active circuits

CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device

Solder preform and electronic component

Wire bond and redistribution layer process

SEMICONDUCTOR DEVICE WITH CAPACITOR

Method of manufacturing wiring substrate and method of manufacturing semiconductor device

Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating

Semiconductor device

Semiconductor package and multi-chip package using the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor die package including embedded flip chip

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LID FRAME

Method of bonding

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Method of forming an inlay substrate having an antenna wire

Dicing tape and die attach adhesive with patterned backing

Semiconductor device and method of manufacturing the same

Method and device for fabricating an assembly of at least two microelectronic chips

Methods of fabricating a composite carbon nanotube thermal interface device

Semiconductor device

SEMICONDUCTOR DEVICE

Method of fabricating semiconductor components with through interconnects

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Chip package with a dam structure on a die pad

Semiconductor device with wire-bonding on multi-zigzag fingers

Protection for bonding pads and methods of formation

Semiconductor circuit and method of fabricating the same

Semiconductor light-emitting device, light-emitting module and lighting unit

Low impedance gold electrode, apparatus, method and electrolyte solution for fabricating the same

Method of manufacturing wiring board having a semiconductor thereon

Semiconductor integrated circuit device

Wafer-level integrated circuit package with top and bottom side electrical connections

SEMICONDUCTOR DEVICE INCLUDING A PADDING UNIT

Flip chip semiconductor assembly with variable volume solder bumps

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

Semiconductor module and method of producing the same

SEMICONDUCTOR DEVICE

Semiconductor module

Device comprising electrode pad

METHOD OF PRODUCING ELECTRONIC COMPONENT

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device manufacturing method

Manufacturing method of resin-sealed semiconductor device

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and a method of manufacturing the same

JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION

Thermally enhanced molded leadless package

SURFACE TREATMENT METHOD

DICING DIE-BONDING FILM

Chipstack package and manufacturing method thereof

Semiconductor device

High voltage isolation dual capacitor communication system

Semiconductor device with recessed registration marks partially covered and partially uncovered

Semiconductor device and a method of manufacturing the same

Wirebond over post passivation thick metal

Solder interconnect pads with current spreading layers

Flip chip device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Conductive structure for a semiconductor integrated circuit

ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM

System and method for integrated waveguide packaging

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Integrated semiconductor device

Semiconductor device and a method of manufacturing the same

Gap capacitors for monitoring stress in solder balls in flip chip technology

Passivated Copper Chip Pads

Manufacturing method of semiconductor apparatus and semiconductor apparatus

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

Semiconductor package and method of making the same

3D smart power module

Package substrate with built-in capacitor and manufacturing method thereof

Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure

Electric Component with Two-Phase Cooling Device and Method for Manufacturing

Device mounting board, and semiconductor module and manufacturing method therefor

Differential internally matched wire-bond interface

Bond pad structure

Semiconductor device including wiring and manufacturing method thereof

Wafer level chip scale package and process of manufacture

Panel level methods and systems for packaging integrated circuits with integrated heat sinks

Integrated module for data processing system

Semiconductor package and methods of fabricating the same

Semiconductor device having antenna over thin film integrated circuit

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method of the same

Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure

Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby

Light-emitting device and its manufacturing method

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

High performance system-on-chip inductor using post passivation process

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Method for processing a base that includes connecting a first base to a second base with an insulating film

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Solar cell and magnetically self-assembled solar cell assembly

Multiple access over proximity communication

Micropad formation for a semiconductor

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Method of forming a bump structure using an etching composition for an under bump metallurgy layer

Removable layer manufacturing method

Method for processing a base that includes connecting a first base to a second base

Bonding pad structure and semiconductor device including the bonding pad structure

Package substrate with built-in capacitor and manufacturing method thereof

High power integrated RF amplifier

Semiconductor device and method of manufacturing the same

Method for structuring a substrate using a metal mask layer formed using a galvanization process

Semiconductor device and the method of manufacturing the same

Semiconductor device including electrically conductive bump and method of manufacturing the same

I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES

Semiconductor device, circuit board, and electronic instrument

Semiconductor device and method of manufacturing the same

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

Silicon heat spreader mounted in-plane with a heat source and method therefor

Multi-chip package

ESD protection semiconductor device having an insulated-gate field-effect transistor

Forming a 3-D semiconductor die structure with an intermetallic formation

PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT

Pad in semicondcutor device and fabricating method thereof

Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same

3-D semiconductor die structure with containing feature and method

ELECTRICAL BONDING PAD

Semiconductor device and method of manufacturing the same

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Power semiconductor module

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD

LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Semiconductor package board using a metal base

Method for manufacturing metal chips by plasma from a layer comprising several elements

Nanoscale metal paste for interconnect and method of use

METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

Semiconductor element, semiconductor device, and fabrication method thereof

Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

Structure and process for the formation of TSVs

UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE

Semiconductor chip, method of fabricating the same and semiconductor chip stack package

Semiconductor device employing wafer level chip size package technology

Method of fabricating a power electronic device

Wafer level chip scale packaging

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

Semiconductor device and automotive AC generator

Forming solder balls on substrates

Electronic component manufacturing apparatus

Circuit arrangements and associated apparatus and methods

Terminal pad structures and methods of fabricating same

ROBUST DIE BONDING PROCESS FOR LED DIES

Multi-die wafer level packaging

Method of manufacturing a printed wiring board

Bonding pad for anti-peeling property and method for fabricating the same

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor device and manufacturing method of the same

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Electronic device including an inductor

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Dicing die-bonding film

Semiconductor device

Top layers of metal for high performance IC's

Post passivation interconnection schemes on top of the IC chips

Flip chip interconnection with double post

Semiconductor device and method of manufacturing the same

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Semiconductor package and method of forming similar structure for top and bottom bonding pads

Chip-stacked package structure with asymmetrical leadframe

Semiconductor device

Component attach methods and related device structures

Method of manufacturing a semiconductor device

LCD Driver IC and Method for Manufacturing the Same

Metal foil interconnection of electrical devices

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Soft error rate mitigation by interconnect structure

Edge seal for thru-silicon-via technology

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

Isolating chip-to-chip contact

Low fabrication cost, high performance, high reliability chip scale package

STRUCTURE OF THREE-DIMENSIONAL STACKED DICE WITH VERTICAL ELECTRICAL SELF-INTERCONNECTIONS AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing semiconductor device and semiconductor device

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY

Multilayered Circuit Board for Connection to Bumps

Protected solder ball joints in wafer level chip-scale packaging

Method for forming an electrical structure comprising multiple photosensitive materials

Undercut-free BLM process for Pb-free and Pb-reduced C4

Semiconductor device

Semiconductor apparatus including a radiator for diffusing the heat generated therein

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

Electronic component mounting method

Method of manufacturing semiconductor device with through hole

Method of manufacturing semiconductor device

Semiconductor device and a method of manufacturing the same

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Self-aligning structures and method for integrated circuits

Clip mount for integrated circuit leadframes

Method for manufacturing a printed wiring board

Method of forming an inductor on a semiconductor wafer

Mounting structure

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

Gold wire for semiconductor element connection

Back end integrated WLCSP structure without aluminum pads

Device mounting board, semiconductor module, and mobile device

Electronic component

Semiconductor package

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated circuit package with integrated heat sink

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Modular chip integration techniques

Packaged gallium nitride material transistors and methods associated with the same

Assembly comprising a functional device and a resonator and method of making same

Semiconductor device and method for manufacturing the same

Chip structure

SEMICONDUCTOR DEVICE HAVING A FINE PITCH BONDPAD

Electrode structure for semiconductor chip with crack suppressing dummy metal patterns

Flip-Chip Interconnect Structure

Semiconductor structure and method of manufacture

Method of packaging an LED array module

Semiconductor chip with coil element over passivation layer

Image display unit with light emitting devices having a resin surrounding the light emitting devices

Electrically enhanced wirebond package

SEMICONDUCTOR DEVICE

Semiconductor package

Electronic device

Through-silicon vias and methods for forming the same

Metallic laminate and method for preparing the same

Inductor formed in an integrated circuit

Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component

SOI on package hypersensitive sensor

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

Bump I/O contact for semiconductor device

MICROELECTRONIC ASSEMBLY AND METHOD OF PREPARING SAME

Thermally enhanced wafer level package

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Light-emitting device

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

Multilayer pillar for reduced stress interconnect and method of making same

Method for fabricating heat dissipating semiconductor package

Circuit module and radio communications equipment, and method for manufacturing circuit module

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

Semiconductor package having marking layer

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

I/O pad structures for integrated circuit devices

Semiconductor device having interconnected contact groups

Wireless semiconductor package for efficient heat dissipation

Multilayer printed wiring board

FLIP-CHIP MOUNTING APPARATUS

Semiconductor device

Semiconductor component comprising copper metallizations

Semiconductor device and methods of manufacturing semiconductor devices

Integrated-circuit package for proximity communication

Method for producing a matrix of individual electronic components and matrix produced thereby

Comb-shaped power bus bar assembly structure having integrated capacitors

Stackable self-aligning insulative guide tray for holding semiconductor substrates

MULTI-BAND TUNABLE RESONANT CIRCUIT

Local defect memories on semiconductor substrates in a stack computer

Method of testing using a temporary chip attach carrier

Solder bump with inner core pillar in semiconductor package

Preventing breakage of long metal signal conductors on semiconductor substrates

BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME

Semiconductor package with passivation island for reducing stress on solder bumps

Integrated semiconductor substrate structure using incompatible processes

Semiconductor substrate elastomeric stack

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor package and method of reducing electromagnetic interference between devices

SEMICONDUCTOR APPARATUS

Method of manufacturing a printed circuit board having an embedded electronic component

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions

Thermal intermediate apparatus, systems, and methods

Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit

Semiconductor device, and manufacturing method of semiconductor device

Bonding method of semiconductor and laminated structure fabricated thereby

Semiconductor device with conductive interconnect

Connecting and bonding adjacent layers with nanostructures

Semiconductor mounting bonding wire

Redistribution layer for wafer-level chip scale package and method therefor

Structure and method for fabricating flip chip devices

Semiconductor device with inductor

Electronic assemblies providing active side heat pumping

NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING INK-JET PRINTING