IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV

Semiconductor integrated circuit device

Adhesive film, connecting method, and joined structure

ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS

Wiring board having heat intercepting member

Microelectronic contact structure

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

PACKAGE, AND FABRICATION METHOD FOR THE PACKAGE

Semiconductor device and method of manufacturing the same

Forming solder balls on substrates

Semiconductor power conversion apparatus and method of manufacturing the same

LITHOGRAPHIC CONTACT ELEMENTS

Module having a stacked passive element and method of forming the same

Module having a stacked passive element and method of forming the same

Twin-chip-mounting type diode

Thermosetting die-bonding film

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER

Circuit device and method of manufacturing the same

Adhesive tape and semiconductor device using the same

Semiconductor package having ink-jet type dam and method of manufacturing the same

Semiconductor package system with through silicon via interposer

Semiconductor device

On-chip RF shields with front side redistribution lines

Lock and key through-via method for wafer level 3 D integration and structures produced

Wire bonding apparatus and ball forming method

ADHESIVE FOR ELECTRONIC COMPONENTS

Bond pad structure having dummy plugs and/or patterns formed therearound

Connection by fitting together two soldered inserts

Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device

METAL INTERCONNECTION

High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof

Semiconductor device for battery power voltage control

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

Method and apparatus for forming planar alloy deposits on a substrate

Electronic component mounting structure

Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package

Method for the Production of a Windshield Wiping Concentrate in the Form of Tablets, Windshield Wiping Concentrate, and Corresponding Presentation

Integrated circuit device

Methods of forming solder connections and structure thereof

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT

Stacked Semiconductor Chips with Through Substrate Vias

Process for making contact with and housing integrated circuits

Conductive composition

Electronic component mounting apparatus and electronic component mounting method

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Composition Containing Porphyrin to Improve Adhesion

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

PRODUCTION METHOD OF SEMICONDUCTOR DEVICE, PRODUCTION METHOD OF DISPLAY DEVICE, SEMICONDUCTOR DEVICE, PRODUCTION METHOD OF SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR ELEMENT

METHOD OF FORMING BALL BOND

Semiconductor device with signal wirings and dummy wirings that pass through under electrode pads and in which the number of dummy wirings near the peripheral portion of the device being greater than at a more centrally located portion

Semiconductor device

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Method for producing an LTCC substrate

Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus

Electrically conductive structure on a semiconductor substrate formed from printing

Wafer level compliant packages for rear-face illuminated solid state image sensors

Electronic component mounting structure and method for manufacturing the same

Semiconductor device and method for fabricating the same

COPPER PAD FOR COPPER WIRE BONDING

SURFACE SMOOTHENED ULTRAHIGH CONDUCTIVITY COMPOSITE LID FOR IMPROVED MARKING PERMANENCY OF SEMICONDUCTOR PACKAGED DEVICES

Semiconductor device and method for fabricating semiconductor device

Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire

Multi-chip package and manufacturing method

Semiconductor system-in-a-package containing micro-layered lead frame

METHOD FOR APPLYING AN ADHESIVE LAYER ON THIN CUT SEMICONDUCTOR CHIPS OF SEMICONDUCTOR WAFERS

Bonded structure and bonding method

Method of fabricating a high Q factor integrated circuit inductor

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)

Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same

Multi-component device integrated into a matrix

TRANSIENT LIQUID PHASE EUTECTIC BONDING

Electrical component and film composite laminated on the component and method for production

Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same

Semiconductor device bonding with stress relief connection pads

Semiconductor device and method of fabricating semiconductor device

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Semiconductor device

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Heat dissipating package structure and method for fabricating the same

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device

Semiconductor device

INTEGRATED CIRCUIT STRUCTURES AND FABRICATING METHODS THAT USE VOIDS IN THROUGH HOLES AS JOINING INTERFACES

Method of making a sidewall-protected metallic pillar on a semiconductor substrate

Bond pad for wafer and package for CMOS imager

Method of packaging and interconnection of integrated circuits

Semiconductor structure with communication element

Ultrasonic bonding apparatus

Method of fabricating a circuit structure

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Methods of making compliant semiconductor chip packages

Combination via and pad structure for improved solder bump electromigration characteristics

Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same

Structures and methods for improving solder bump connections in semiconductor devices

Flange package for a semiconductor device

Through wafer vias and method of making same

Through wafer vias and method of making same

Wafer level semiconductor module and method for manufacturing the same

Capacitor contact formed concurrently with bond pad metallization

Assembling of Electronic Members on IC Chip

Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure

Semiconductor device and radio communication device

Method of bonding two structures together with an adhesive line of controlled thickness

Method for manufacturing multilayer printed circuit board

Method of fabricating a base layer circuit structure

DICING DIE-BONDING FILM

Dicing die-bonding film

DICING DIE-BONDING FILM

Packaging an integrated circuit die with backside metallization

Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device

DICING DIE-BONDING FILM

Method and apparatus for forming planar alloy deposits on a substrate

Microelectronic packages with small footprints and associated methods of manufacturing

Semiconductor device, through hole having expansion portion and thin insulating film

Metal adhesion by induced surface roughness

Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface Features

Method and device for controlling the generation of ultrasonic wire bonds

CIRCUIT CONNECTION STRUCTURE

Method of forming support structures for semiconductor devices

Method of manufacturing semicondictor chip

METHOD OF FORMING ON-CHIP PASSIVE ELEMENT

ADHESIVE TAPE

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

High frequency ceramic package and fabrication method for the same

DICING/DIE BONDING FILM

IC HAVING FLIP CHIP PASSIVE ELEMENT AND DESIGN STRUCTURE

ANISOTROPIC CONDUCTIVE TAPE AND METHOD OF MANUFACTURING IT, CONNECTED STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER BY USE OF THE TAPE

Conductive nanowires for electrical interconnect

Method And Apparatus For Mounting A Piece Of Foil On A Substrate

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

VOID-FREE IMPLANTABLE HERMETICALLY SEALED STRUCTURES

Semiconductor device, manufacturing method and apparatus for the same

Packaging conductive structure and method for forming the same

CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR

Semiconductor device and manufacturing method thereof

Printed circuit board

Method and system for forming conductive bumping with copper interconnection

Semiconductor package and methods of manufacturing the same

Semiconductor device and manufacturing method therefor

Semiconductor device including a copolymer layer

Chip package and method for fabricating the same

Adhesive for connection of circuit member and semiconductor device using the same

Vertical MOSFET with through-body via for gate

Light-emitting diode arrangement and method for producing the same

SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP STACKED PACKAGE

Electronic component assembly

Manufacturing method of semiconductor device and semiconductor manufacturing apparatus therefor

Semiconductor device and a method of manufacturing the same

PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER

Electrical device with protruding contact elements and overhang regions over a cavity

Semiconductor device and heat sink with 3-dimensional thermal conductivity

Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well

Substrate bonding method and electronic component thereof

Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package

Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus Bar

Ultrasonic bonding apparatus

Ultrasonic bonding apparatus

Chip-level underfill method of manufacture

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Bond pad structure

Semiconductor device with fuse portion

SEMICONDUCTOR DEVICE HAVING AN ANTI-PAD PEELING-OFF STRUCTURE

Substrate holder and plating apparatus

Electronic component bonding machine

Bonded semiconductor structure and method of fabricating the same

Method for reclaiming semiconductor package

SEMICONDUCTOR WITH TOP-SIDE WRAP-AROUND FLANGE CONTACT

Semiconductor memory device

Method for stacking devices

Surface depressions for die-to-die interconnects and associated systems and methods

Semiconductor device

SYSTEM WITH RADIO FREQUENCY INTEGRATED CIRCUITS

Chip pad resistant to antenna effect and method

Method for manufacturing a semiconductor integrated circuit device

Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same

Conductive bump, method for producing the same, and electronic component mounted structure

Semiconductor device

Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION

Method for producing a semiconductor component

Performing die-to-wafer stacking by filling gaps between dies

Heat sink, electronic device, and method of manufacturing electronic device

Circuit apparatus and method of manufacturing the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

Method and apparatus for wafer level integration using tapered vias

Top layers of metal for high performance IC's

Circuitry component and method for forming the same

Semiconductor device having copper interconnect for bonding

Injection molded solder ball method

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

Semiconductor device mounted on heat sink having protruded periphery

Method of forming stress relief layer between die and interconnect structure

Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposed

CHIP PACKAGE FOR SEMICONDUCTOR DEVICES

WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS

Bump structure for a semiconductor device and method of manufacture

Compact multi-port cam cell implemented in 3D vertical integration

DIE REARRANGEMENT PACKAGE STRUCTURE AND METHOD THEREOF

Mountable integrated circuit package-in-package system

Packaged products, including stacked package modules, and methods of forming same

Chip stacked structure and the forming method

Integrated circuit packaging system with isolated pads and method of manufacture thereof

Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference

Electrically conducting connection with insulating connection medium

Low resistance integrated MOS structure

CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME

Method and system for composite bond wires

PLATING APPARATUS AND PLATING METHOD

Integrated module for data processing system

Bond pad structure located over active circuit structure

Semiconductor device and method for manufacturing the same

Substrate for semiconductor package

SEMICONDUCTOR DEVICE

WAFER LEVEL REDISTRIBUTION USING CIRCUIT PRINTING TECHNOLOGY

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Bonding method for through-silicon-via based 3D wafer stacking

Method for manufacturing semiconductor chip and semiconductor device

Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

Linked Chip Attach And Underfill

Probe card assembly and kit, and methods of making same

Semiconductor chip and method for fabricating the same

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Component protection for advanced packaging applications

Low loading pad design for STT MRAM or other short pulse signal transmission

SEMICONDUCTOR DEVICE

Power semiconductor device

Electrically conducting poylmer glue, devices made therewith and methods of manufacture

Semiconductor package featuring flip-chip die sandwiched between metal layers

CONDUCTIVE STRUCTURE OF A CHIP

Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device

Semiconductor device and method

Semiconductor device and manufacturing method thereof

Anti-reflection structures for CMOS image sensors

Method and apparatus for 3D interconnect

RELIABILITY WCSP LAYOUTS

Semiconductor device and method of fabrication

Packaged electronic devices with face-up die having TSV connection to leads and die pad

IC device having low resistance TSV comprising ground connection

SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTRATE INCLUDING DIE

GaN-based semiconductor light-emitting device and method for the fabrication thereof

Light-emitting diode display and method for manufacturing the same

Method and apparatus for electrostatic discharge protection using a temporary conductive coating

Semiconductor storage device, semiconductor storage device manufacturing method and package resin forming method

Semiconductor component with improved contact pad and method for forming the same

Rectangular-shaped controlled collapse chip connection

Planar packageless semiconductor structure with via and coplanar contacts

Semiconductor device package interconnections

Interposer chip and multi-chip package having the interposer chip

CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL

Semiconductor device and method of manufacturing the same

Thermal enhanced package

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Chip-based thermo-stack

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Manufacturing method of semiconductor device

Printed circuit board having embedded RF module power stage circuit

Printed circuit board having embedded RF module power stage circuit

Through-hole via on saw streets

Bonded semiconductor structure and method of making the same

Method of manufacturing an integrated circuit

Intermetallic diffusion block device and method of manufacture

Heat extraction from packaged semiconductor chips, scalable with chip area

Electronic circuit device and method for manufacturing same

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Wafer level package and method of fabricating the same

Multilayer printed wiring board

Method for low temperature bonding and bonded structure

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Low fabrication cost, fine pitch and high reliability solder bump

Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element

Semiconductor device and method of forming vertical interconnect structure using stud bumps

SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS

Thermosetting resin composition and semiconductor sealing medium

Semiconductor device and method for manufacturing the same

Power converter apparatus

Camera module, method of manufacturing the same, and electronic system having the same

Bonded structures formed by plasma enhanced bonding

Final via structures for bond pad-solder ball interconnections

METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MATERIALS USING RF AND MICROWAVES

Interconnect structure including hybrid frame panel

Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

RELIABILITY IMPROVEMENT IN A COMPOUND SEMICONDUCTOR MMIC

Multi-chip package including die paddle with steps

Interposers, electronic modules, and methods for forming the same

Method for bonding metallic terminals by using elastic contact

Linked chip attach and underfill

Semiconductor package and method of manufacturing the same

Adhesive composition, adhesive sheet and production method of semiconductor device

Semiconductor device manufacturing method

Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring

Semiconductor device and bonding material

Method for manufacturing multilayer printed wiring board

Power Device Substrates and Power Device Packages Including the Same

Semiconductor device and manufacturing method of the same