Circuit device and manufacturing method thereof

Methods and apparatus for packaging integrated circuit devices

Semiconductor device and manufacturing method thereof

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Integrated circuit device and the manufacturing method thereof

Method of manufacturing a semiconductor device

Test system with interconnect having conductive members and contacts on opposing sides

Inductor formed in an integrated circuit

Semiconductor device having a bond pad and method therefor

Method and semiconductor device having copper interconnect for bonding

Semiconductor package board using a metal base

Apparatus and method for low pressure wirebond

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Bonding pad structure

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Semiconductor device and method for fabricating the same

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Power semiconductor device and power semiconductor module

Method of mounting a circuit component and joint structure therefor

Semiconductor device and method of fabricating the same

IC package with stacked sheet metal substrate

Bath and method for high rate copper deposition

Method for forming solder bump structure

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

No-flow underfill composition and method

Flip chip package using no-flow underfill and method of fabrication

Microelectronic component and assembly having leads with offset portions

Chip structure and process for forming the same

Integrated circuit bond pad structures and methods of making

Automated filament attachment system for vacuum fluorescent display

Processes and tools for forming lead-free alloy solder precursors

Method of forming bumps

Output circuit for a semiconductor amplifier element

RF amplifier

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor device using insulating film of low dielectric constant as interlayer insulating film

Large bumps for optical flip chips

Large bumps for optical flip chips

Methods for forming patterns on a filled dielectric material on substrates

Self-locking wire bond structure and method of making the same

Method for low temperature bonding and bonded structure

Semiconductor radiation emitter package

Semiconductor device having heat radiation plate and bonding member

Anisotropic conductive film

Bonding tool with polymer coating

Inter-chip and intra-chip wireless communications systems

Local multilayered metallization

Method of fabricating a wire bond pad with Ni/Au metallization

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Pad structure for stress relief

Integrated circuit package bond pad having plurality of conductive members

Semiconductor device and method of fabricating the same

Sealing and protecting integrated circuit bonding pads

Electrical circuit assembly with micro-socket

Reliable metal bumps on top of I/O pads after removal of test probe marks

Devices and methods employing high thermal conductivity heat dissipation substrates

Group III nitride based flip-chip integrated circuit and method for fabricating

Reinforced bond pad

Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad

Semiconductor device with multilayered metal pattern

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

Fine pitch electronic flame-off wand electrode

System having semiconductor component with encapsulated, bonded, interconnect contacts

Bonding pad structure to minimize IMD cracking

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Resin composition for encapsulating semiconductor device

Designs and methods for conductive bumps

Pad structure of semiconductor device for reducing or inhibiting wire bonding cracks

Substrate with terminal pads having respective single solder bumps formed thereon

Semiconductor device having heat dissipation layer

Semiconductor device

Semiconductor apparatus and method for fabricating the same

Head assembly, disk unit, and bonding method and apparatus

Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Semiconductor device having a pair of heat sinks and method for manufacturing the same

High-frequency module and method for manufacturing the same

Stress sensitive microchip with premolded-type package

Process for precise arrangement of micro-bodies

Thermal interface adhesive

Semiconductor device and method of manufacturing the same

Semiconductor device having fuse circuit on cell region and method of fabricating the same

Method for producing display device

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Semiconductor device

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Semiconductor device and method of manufacturing the same

Semiconductor device having transferred integrated circuit

Electrical contact and connector and method of manufacture

Electrical contact and connector and method of manufacture

Method for chemical etch control of noble metals in the presence of less noble metals

Bond pad techniques for integrated circuits

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Microbeam assembly and associated method for integrated circuit interconnection to substrates

Super high density module with integrated wafer level packages

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Direct write™ system

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Multi-dice chip scale semiconductor components

Pad structures including insulating layers having a tapered surface

Electronic devices with small functional elements supported on a carrier

Chip stack package and manufacturing method thereof

Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween

Thermal conductive material utilizing electrically conductive nanoparticles

Wafer-level chip scale package

Wirebonding insulated wire and capillary therefor

Process for forming lead-free bump on electronic component

Active area bonding compatible high current structures

Fluxless assembly of chip size semiconductor packages

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Process for making contact with and housing integrated circuits

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Package module for an IC device and method of forming the same

Coolant cooled type semiconductor device

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Semiconductor device including a semiconductor chip mounted on a metal base

Interconnections

Aqueous based metal etchant

Method of metal sputtering for integrated circuit metal routing

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Electronic component and method for manufacturing the same

CSP semiconductor device having signal and radiation bump groups

Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

Semiconductor chip with bumps and method for manufacturing the same

Probe card assembly

Low fabrication cost, fine pitch and high reliability solder bump

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

Fabrication method of semiconductor device

Method for creating flip-chip conductive-polymer bumps using photolithography and polishing

Method for creating adhesion during fabrication of electronic devices

Under bump metallurgic layer

Apparatus and method for packaging circuits

Semiconductor apparatus and method of manufacturing the same

Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

Process for the production of improved metallized films

Contact structures and methods for making same

Inhibition of tin oxide formation in lead free interconnect formation

Semiconductor processing methods

Bonding structure with pillar and cap

Semiconductor integrated circuit device

Method of bonding semiconductor devices

Power supply device

Pad over active circuit system and method with meshed support structure

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Semiconductor device with strain relieving bump design

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Method of making a semiconductor device having an opening in a solder mask

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Methods of forming conductive structures including titanium-tungsten base layers and related structures

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Wirebond pad for semiconductor chip or wafer

Semiconductor component having conductors with wire bondable metalization layers

Semiconductor device with connections for bump electrodes

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Semiconductor device and switching element

Light-emitting semiconductor component

Forming tool for forming a contoured microelectronic spring mold

Substrate holder and plating apparatus

Method for forming a bond pad interface

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Method of making a semiconductor device having an opening in a solder mask

Stencil mask design method and under bump metallurgy for C4 solder bump

Electronic component-built-in module

Semiconductor interconnect having compliant conductive contacts

Semiconductor device including a diffusion layer

Under-bump metallugical structure

Semiconductor unit with cooling system

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Semiconductor device including inclined cut surface and manufacturing method thereof

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Semiconductor device

Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Wafer level bumping process

Method for forming a bonding pad of a semiconductor device including a plasma treatment

Manufacturing method for semiconductor device

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof

Interlayer dielectric and pre-applied die attach adhesive materials

Semiconductor device and method of manufacturing the same

[BONDING PAD STRUCTURE]

Packaging assembly and method of assembling the same

Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board

Semiconductor device and method of fabricating the same

Manufacturing method for multichip module

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Semiconductor device

Semiconductor device and method for manufacturing the same

Surface mount multichip devices

Arrangement comprising a capacitor

Method of fabricating semiconductor memory device and semiconductor memory device driver

Group III nitride based flip-chip integrated circuit and method for fabricating

Semiconductor device and manufacturing method thereof

Imaging system

Semiconductor package production method and semiconductor package

Method and apparatus for non-conductively interconnecting integrated circuits

Corrosion-resistant copper bond pad and integrated device

Corrosion-resistant bond pad and integrated device

Semiconductor device

Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device

Method of mounting electronic part and flux-fill

Selective tungsten removal

Three-dimensional memory device containing fluorine-free tungsten—word lines and methods of manufacturing the same

Test method for a redistribution layer

Semiconductor apparatus and method for preparing the same

3D bonded semiconductor structure with an embedded capacitor

Method for forming stacked metal contact in electrical communication with aluminum wiring in semiconductor wafer of integrated circuit