212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
Electrode pad arrangement with open side for waste removal
#5102FCBGA package structure
#5103Structure of package
#5104Semiconductor device
#5105Semiconductor structure integrated under a pad
#5106Flip chip bonding tool and ball placement capillary
#5107Method for manufacturing an interconnect
#5108Method for producing a semiconductor element
#5109Semiconductor device and its manufacturing process, electro-optical equipment, and electronic equipment
#5110Fan out type wafer level package structure and method of the same
#5111Semiconductor device, producing method of semiconductor substrate, and producing method of semiconductor device
#5112Semiconductor device
#5113Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#5114Method for manufacturing semiconductor device
#5115Bump structure for a semiconductor device and method of manufacture
#5116Semiconductor device and a method of manufacturing the same
#5117Semiconductor device and manufacturing method of the same
#5118Systems and methods for filling voids and improving properties of porous thin films
#5119Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
#5120Semiconductor device
#5121Semiconductor device
#5122High power Doherty amplifier
#5123Led chip mounting structure and image reader having same
#5124Bonding pad structure and method of forming the same
#5125NANO IC packaging
#5126Power semiconductor module
#5127High performance system-on-chip discrete components using post passivation process
#5128Semiconductor device having a refractory metal containing film and method for manufacturing the same
#5129Power semiconductor switching devices and power semiconductor devices
#5130Thermally conductive compositions and methods of making thereof
#5131Programmable radio transceiver
#5132Electronic device and method of manufacture the same
#5133Method for fabricating encapsulated semiconductor components
#5134Manufacture of microelectronic fold packages
#5135Conductive material for integrated circuit fabrication
#5136Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
#5137Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
#5138Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits
#5139Electronic component mounting method and apparatus
#5140Circuit device and method of manufacturing the circuit device
#5141Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#5142Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#5143Surface mounted package with die bottom spaced from support board
#5144Semiconductor device and method of fabricating the same
#5145Semiconductor device and method for manufacturing same
#5146Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#5147Integrated circuit with intergrated capacitor and methods for making same
#5148Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
#5149Semiconductor device comprising through-electrode interconnect
#5150Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
#5151Jig for a semiconductor substrate
#5152Vacuum fixing jig for semiconductor device
#5153Circuitry module
#5154Semiconductor device with electrode pads for test probe
#5155Semiconductor device
#5156Die down semiconductor package
#5157Use of palladium in IC manufacturing with conductive polymer bump
#5158Microelectronic assembly having encapsulated wire bonding leads
#5159Method and semiconductor device having copper interconnect for bonding
#5160Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
#5161Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#5162Power semiconductor module
#5163Fabrication method and structure of PCB assembly, and tool for assembly thereof
#5164Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#5165Methods of forming bumps using barrier layers as etch masks
#5166Low fabrication cost, high performance, high reliability chip scale package
#5167Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
#5168Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5169Programmable radio transceiver
#5170Adhesion by plasma conditioning of semiconductor chip surfaces
#5171Copper interconnect
#5172Semiconductor device with plate-shaped component
#5173Semiconductor apparatus and method of fabricating the apparatus
#5174Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet
#5175Top layers of metal for high performance IC's
#5176Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#5177Method of routing an electrical connection on a semiconductor device and structure therefor
#5178Dicing die-bonding film
#5179Manufacturing method for semiconductor device and determination method for position of semiconductor element
#5180Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#5181Stacked semiconductor packages
#5182Methods and apparatus for packaging integrated circuit devices
#5183Semiconductor package having step type die and method for manufacturing the same
#5184Semiconductor chip and display device using the same
#5185Ultrasonic tool and ultrasonic bonder
#5186Process for producing optical semiconductor device
#5187Manufacturing and testing of electrostatic discharge protection circuits
#5188Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#5189Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts
#5190Top layers of metal for high performance IC's
#5191Semiconductor device with increased number of external connection electrodes
#5192Integrated circuit bond pad structures and methods of making
#5193Bump and fabricating process thereof
#5194Semiconductor package without bonding wires and fabrication method thereof
#5195Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
#5196Apparatuses and methods for forming assemblies
#5197Power amplifier module for wireless communication devices
#5198Circuit component with bump formed over chip
#5199Submount and semiconductor device
#5200Semiconductor device and manufacturing method for the same
#5201Bonding structure and fabrication thereof
#5202Semiconductor device and manufacturing method of the same
#5203Testable electrostatic discharge protection circuits
#5204Semiconductor device
#5205Light emitting device
#5206Semiconductor devices and manufacturing method therefor
#5207Electrical contact
#5208Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5209Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5210Electronic component, method of manufacturing the electronic component, and electronic apparatus
#5211Test head assembly having paired contact structures
#5212Low fabrication cost, high performance, high reliability chip scale package
#5213LSI package, LSI element testing method, and semiconductor device manufacturing method
#5214Semiconductor package with crossing conductor assembly and method of manufacture
#5215Semiconductor device and manufacturing method thereof
#5216Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
#5217Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
#5218Manufacturing method for semiconductor device and semiconductor device
#5219Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
#5220Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
#5221Intrinsic thermal enhancement for FBGA package
#5222Semiconductor device
#5223Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#5224High performance system-on-chip using post passivation process
#5225Microelectronic packages and methods therefor
#5226Single mask via method and device
#5227Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
#5228Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5229Semiconductor copper bond pad surface protection
#5230Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5231Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5232Thermal head and bonding connection method therefor
#5233Semiconductor device and method of manufacturing the same
#5234Semiconductor integrated circuit device
#5235Semiconductor memory device and defect remedying method thereof
#5236System semiconductor device and method of manufacturing the same
#5237Manufacturing method of semiconductor device
#5238BUMPING PROCESS OF LIGHT EMITTING DIODE
#5239Bumping process of light emitting diode
#5240Ball transferring method and apparatus
#5241Semiconductor device having bonding pad above low-k dielectric film
#5242Electrode pad section for external connection
#5243Semiconductor device and method of manufacturing the same
#5244Quad flat non-leaded package comprising a semiconductor device
#5245Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
#5246Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5247Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device
#5248High performance system-on-chip discrete components using post passivation process
#5249Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5250Conductive bond for through-wafer interconnect
#5251Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#5252Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5253Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5254Method for making a micromechanical device by using a sacrificial substrate
#5255Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5256Resin compositions and methods of use thereof
#5257Via structure for semiconductor chip
#5258DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
#5259Semiconductor device and method of fabricating the same
#5260Bumpless wafer scale device and board assembly
#5261Semiconductor device having radiation structure
#5262Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device
#5263Semiconductor device and method of manufacturing same
#5264Surface mountable hermetically sealed package
#5265High Q factor integrated circuit inductor
#5266Active matrix substrate, method of manufacturing the same, and display device
#5267Active matrix substrate display device
#5268METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION
#5269Interconnection device and system
#5270Method and system for batch forming spring elements in three dimensions
#5271Selective passivation of exposed silicon
#5272Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#5273Method of fabricating a pad over active circuit I.C. with meshed support structure
#5274Method for processing an integrated circuit
#5275Direct writeTM system
#5276Chip and multi-chip semiconductor device using thereof and method for manufacturing same
#5277Adhesion by plasma conditioning of semiconductor chip
#5278Semiconductor device
#5279WAFER-LEVEL PACKAGE STRUCTURE
#5280Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#5281Semiconductor device having conducting portion of upper and lower conductive layers
#5282Room temperature metal direct bonding
#5283Hermetic surface mounted power package
#5284Method for manufacturing circuit board, circuit board, and electronic equipment
#5285Method of making wireless semiconductor device, and leadframe used therefor
#5286Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
#5287Optical sensor module with semiconductor device for drive
#5288Method of manufacturing high performance copper inductors with bond pads
#5289Method of forming segmented ball limiting metallurgy
#5290Hermetic passivation structure with low capacitance
#5291Semiconductor device and method of fabricating the same
#5292Structure and method for temporarily holding integrated circuit chips in accurate alignment
#5293Printed circuit board and method for manufacturing printed circuit board
#5294Spatial light modulators with light blocking/absorbing areas
#5295Polymer sustained microelectrodes
#5296Damascene interconnection and semiconductor device
#5297Process for producing a semiconductor device
#5298Integrated device including connections on a separate wafer
#5299Semiconductor integrated circuit device
#5300Test assembly including a test die for testing a semiconductor product die
#5301Electronic component mounting method and apparatus
#5302Method for manufacturing semiconductor device with plural semiconductor chips
#5303Stacked IC device having functions for selecting and counting IC chips
#5304Cooling devices and methods of using them
#5305Semiconductor chip package
#5306Adhesive film for circuit connection, and circuit connection structure
#5307Efficient use of wafer area with device under the pad approach
#5308Semiconductor device and method of manufacturing the same
#5309Semiconductor device and manufacturing method thereof
#5310Bumping electronic components using transfer substrates
#5311Lithographic contact elements
#5312Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
#5313Encapsulated semiconductor components and methods of fabrication
#5314Capacitor device and method of manufacturing the same
#5315Wafer stacking with anisotropic conductive adhesive
#5316Semiconductor device and semiconductor module
#5317Method for fabricating a semiconductor interconnect having conductive spring contacts
#5318Method of forming a bonding pad structure
#5319Semiconductor device and method for manufacturing the same
#5320Solder ball pad structure
#5321Method of fabricating a pad over active circuit I.C. with frame support structure
#5322Semiconductor device
#5323Surface mount package
#5324Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
#5325Electrical connection of components
#5326Dual band power amplifier module for wireless communication devices
#5327Fabrication methods for electronic system modules
#5328Method of manufacturing a semiconductor device
#5329Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#5330Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
#5331Thermal intermediate apparatus, systems, and methods
#5332Dicing die-bonding film
#5333Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates
#5334Package structure for semiconductor
#5335Nanotube modified solder thermal intermediate structure, systems, and methods
#5336Wire bonder for ball bonding insulated wire and method of using same
#5337Method to remove fluorine residue from bond pads
#5338Methods of providing solder structures for out plane connections
#5339Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
#5340Process for producing optical semiconductor device
#5341Stacked semiconductor device assembly and method for forming
#5342Wire loop grid array package
#5343Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#5344Dual semiconductor die package with reverse lead form
#5345Manufacturing method of a semiconductor device
#5346Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
#5347Opto-electronic assembly having an encapsulant with at least two different functional zones
#5348Methods of forming solder areas on electronic components and electronic components having solder areas
#5349Flip-chip solder bump formation using a wirebonder apparatus
#5350Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
#5351Semiconductor component and method for fabricating
#5352Structure and method for fabricating a bond pad structure
#5353Semiconductor device and method for fabricating the same
#5354Thin, thermally enhanced molded package with leadframe having protruding region
#5355Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips
#5356Nano-metal composite made by deposition from colloidal suspensions
#5357Method of incorporating interconnect systems into an integrated circuit process flow
#5358Connector for making electrical contact at semiconductor scales
#5359Fan out type wafer level package structure and method of the same
#5360Power amplifier module for wireless communication devices
#5361Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto
#5362Internally reinforced bond pads
#5363Offset-bonded, multi-chip semiconductor device
#5364Semiconductor device package utilizing proud interconnect material
#5365Thinned die integrated circuit package
#5366Semiconductor device with stacked chips
#5367Chip and wafer integration process using vertical connections
#5368Semiconductor device
#5369Capillary with contained inner chamfer
#5370Multi-part capillary
#5371Method for forming MEMS grid array connector
#5372Method of manufacturing semiconductor device and system of manufacturing semiconductor device
#5373Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification
#5374Stacked semiconductor device
#5375Semiconductor interconnect having conductive spring contacts
#5376Support structure for low-k dielectrics
#5377Semiconductor device and method of manufacturing the same
#5378Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation
#5379Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
#5380Semiconductor device and its manufacturing method, and semiconductor device manufacturing system
#5381Semiconductor device and method of fabricating the same
#5382Wiring base with wiring extending inside and outside of a mounting region
#5383Bond pad
#5384Light source apparatus with light-emitting chip which generates light and heat
#5385Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device
#5386Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
#5387Wafer level packages for chips with sawn edge protection
#5388Flip chip bonding tool tip
#5389Bonding tool with resistance
#5390Film adhesives containing maleimide compounds and methods for use thereof
#5391Wire bonding process for copper-metallized integrated circuits
#5392Method of manufacturing a semiconductor device
#5393Method of applying a pattern of particles to a substrate
#5394Power amplifier device
#5395Flip chip device having supportable bar and mounting structure thereof
#5396Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#5397Seedless wirebond pad plating
#5398Use of palladium in IC manufacturing with conductive polymer bump
#5399STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY
#5400Corrosion-resistant bond pad and integrated device